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The 45nm Intel® Atom™ Processor N270Δ at 1.6 GHz core speed and 2.5 W TDP is power-optimized to deliver robust performance/watt. This single-core processor is validated with the Mobile Intel® 945GSE Express Chipset, consisting of the Intel® 82945GSE Graphics Memory Controller Hub and Intel® I/O Controller Hub 7-M. The chipset features power-efficient graphics with an integrated 32-bit 3D graphics engine based on Intel® Graphics Media Accelerator 950 architecture and a single-channel 400/533 MHz DDR2 system memory up to 2 GB (SODIMM and/or memory down). It provides rich I/O capabilities and flexibility via high-bandwidth interfaces such as PCI Express,* PCI, Serial ATA and Hi-Speed USB 2.0 connectivity.
Featuring embedded lifecycle support, this platform offers cost-effective solutions for digital signage, retail and transaction appliances (kiosks, point-of-service terminals), thin clients, digital security, residential gateways, print imaging and commercial and industrial control. The processor is software compatible with previous 32-bit Intel® architecture.
Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.
¹ Intel® Active Management Technology requires the platform to have an Intel® AMT-enabled chipset, network hardware and software, as well as connection with a power source and a corporate network connection. With regard to notebooks, Intel AMT may not be available or certain capabilities may be limited over a host OS-based VPN or when connecting wirelessly, on battery power, sleeping, hibernating or powered off. For more information, see http://www.intel.com/technology/advanced_comm/activemanagement.htm.
² Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see http://www.intel.com/info/hyperthreading.
Intel® 82583V Gigabit Ethernet Controller Product Brief
Version: 001 : May 2009
Product brief for the Intel® Atom™ Processor N270, Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset development kit.
Version: 001 : August 2008
Information for implementing power management features on designs based on the Intel® Atom™ Processor (N270), Intel® 82945GSE Express Chipset and 82801GBM I/O Controller Hub.
File Type/Size: PDF 72KB
Version: 0.5 : March 2008
This document provides a context for using the features for manufacturability and debug implemented on Intel® processors and chipsets.
Version: 001 : October 2007
The Intel® Atom™ Processor provides OpenPeak with the performance of Intel® architecture in a processor dissipating just 2.2 watts.
Version: 001 : November 2008
This document provides reference fanless system design considerations for embedded applications utilizing CFD simulation, analytic and modeling techniques.
Version: January 2009
An increase in the speed and frequency of a design combined with a need to reduce cost has created a challenge in defining an acceptable stack-up to meet the needs of high-speed designs.
Version: December 2008
This paper discusses the software methods used to access PCI Express* registers, including the formula used to calculate the memory locations needed to access a specific register.
This paper examines storage solutions, from USB flash drives to high capacity disk drives, and discusses the trade-offs in finding the right solutions for an embedded application.
DDR is one of the challenging interfaces for a signal integrity engineer. This paper outlines an approach to divide the task, with an example for each step from the DDR2 interface.
Here are recommendations for engineers who are designing embedded systems with the minimum number of power rails, including power and reset sequencing for standby and main rails.
This paper provides insights on how high speed signals behave on a board, the role played by inductors, resistors and capacitors and available design tools.
Since memory latency is an important factor of overall performance, it is important to know what tool to use in order to gather this information.
I²C bus protocols can differ slightly from Intel® Controller Hub (ICH) SMBus protocols.This paper provides a full description of the details of each SMBus cycle supported by the ICH.
Information on the NEXUS automotive JTAG, the Intel XDP and ITP and available debuggers.
MSI delivery and servicing removes the two big limitations associated with Intel® architecture, the limited number of interrupts and unnecessarily high interrupt latencies.
Intel delivers platform design guidelines with validated platforms. This document details the signal integrity impacts from every deviation and describes solutions to overcome them.
Ensuring sufficient hardware level I/O capabilities for embedded designs is critical. This paper outlines the PCIe hardware level benchmarking used by Intel to collect I/O performance data.
L3 forwarding measures the Intel® architecture core capability in processing IP packets without any loss. This paper explains L3 forwarding measurement and optimization techniques.
Intel® 82583V Gigabit Ethernet Controller Datasheet
Version: 2.0 : June 2009
Intel® I/O Controller Hub 7 (ICH7) Datasheet
Version: 003 : April 2007
Mobile Intel® 945 Express Chipset Family Datasheet
Version: 006 : June 2008
Mobile Intel® Atom™ Processor N270 Single Core Datasheet
Version: 001 : May 2008
This is the main processor component specification document, including electrical, mechanical and thermal specifications.
File Type/Size: PDF 990KB
Version: 1.5 : May 2008
External design specification for the Mobile Intel® 945 Express Chipset Family
File Type/Size: PDF 2,986KB
Version: 2.9 : February 2008
File Type/Size: PDF 1,589KB
Version: 3.0 : April 2008
An Intel Mobile Voltage Positioning (Intel® MVP) -6 voltage regulator (VR) is used to regulate power to the core of Intel® Mobile processors. This document also contains Intel MVP-6+ features required for the latest mobile and ultra mobile device platforms.
File Type/Size: PDF 2,895KB
Version: 1.5 : February 2009
Intel® 82583V Gigabit Ethernet Controller Specification Update
Version: 2.2 : August 2009
A compilation of device and document errata and specification clarifications and changes intended for hardware system manufacturers.
Version: 005 : August 2009
Specification update for the Intel® I/O Controller Hub 7 (ICH7) Family
Version: 027 : October 2009
Specification update for the Intel® ICH7
File Type/Size: PDF 119KB
Version: 1.0 : September 2008
This update contains revised information about products including identification information, specification changes and clarifications, documentation changes and errata.
File Type/Size: PDF 338KB
Version: 2.5 : April 2008
This update includes fixes and additional information beyond what is contained in the 1.00 version of the Mobile Intel® 945 Express Chipset Family BIOS Specification.
File Type/Size: PDF 129KB
Version: 1.14 : August 2007
Specification update for the Mobile Intel® 945 Express Chipset Family
File Type/Size: PDF 117KB
Version: 011 : November 2007
This document describes all of the best-known methods relating to the design of a debug port on platforms based on the Intel® Atom™ processor series.
File Type/Size: PDF 346KB
Version: 1.1 : December 2007
This document contains information supporting the use and implementation of a reference design based on the Intel® Atom™ processor N270 and Mobile Intel® 945GSE Express Chipset.
File Type/Size: PDF 8,098KB
Version: 2.0 : February 2009
The addendum provides additional information not previously released in the design guide including updates, changes, and clarifications to be used in conjunction with the parent design guide.
File Type/Size: PDF 448KB
Version: .5 : August 2008
Basic Mobile Platform 2008 Layout Design Checklist for the Mobile Intel® Atom™ processor N270, Intel® 82945GSE Express Chipset and Intel® 82801GBM ICH
File Type/Size: PDF 290KB
Basic Mobile Platform 2008—Schematic Checklist
File Type/Size: PDF 707KB
Version: 1.0 : February 2008
Get your software up and running using boards and development kits from Intel and third-party vendors.
Product brief for the Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset development kit.
Version: 002 : October 2008
Purchase Intel® embedded products from Intel® Authorized Industrial Distributors.
If you already have an account set up with Intel, contact your CBA for order placement. If you are not currently set up with Intel, visit the “Where to Buy” section of the EDC.
This presentation covers implementation details including platform design guidelines, platform software and platform technologies.
File Type/Size: PDF 5,844KB
Version: January 2008
Platform information includes features, benefits and functionality.
File Type/Size: PDF 23,459KB
Version: October 2008
Design schematics in .pdf format for the Roe River reference board, including schematics for the Intel® Atom™ N270 Processor with Mobile Intel® 945GSE Express Chipset.
File Type/Size: PDF 2,463KB
Version: May 2008
Intel® Atom™ N270 processor with Mobile Intel® 945GSE Express Chipset (embedded) Customer Reference Board Schematic—25-Jun-2008.
File Type/Size: ZIP 1,518KB
The input/output (I/O) buffer information specification model defines a buffer's characteristics for all of the I/O pins of the device.
File Type/Size: ZIP 973KB
Version: 1.1 : April 2005
This package contains a set of IBIS models for the various interfaces contained in the Intel® 945GMS Express Chipset.
File Type/Size: ZIP 617KB
Version: 0.5 : June 2005
A set of I/O Buffer Information Specification (IBIS) models for the various interfaces contained in the Intel® Atom™ processor 200 series.
File Type/Size: application/zip 144KB
Version: 0.7
Basic Mobile Platform 2008 Thermal Design Update
File Type/Size: PDF 128KB
Intel® Atom™ processor N270 thermal models
File Type/Size: ZIP 130KB
Version: 0.7 : March 2008
Intel® I/O Controller Hub 7 (ICH7) Ballout/Pinlist/Chipset Mechanical Package Files
File Type/Size: ZIP 582KB
Version: 1.0
Intel's power profiling kit can accurately measure a platform's total AC, DC and component level power consumption while running standard applications or benchmarks.
System and processor thermal design considerations and recommendations for platforms based on the Intel® Atom™ Processor and Intel® System Controller Hub.
Version: 001 : June 2008
This document defines thermal cooling: passive, active and fanless thermal solutions and their difference via the three modes of heat transfer—conduction, convection and radiation.
Intel® Embedded Graphics Drivers (IEGD) are a suite of multi-platform graphics drivers designed to meet the requirements of embedded applications.
Read and accept the software agreement to download source code from N.A. Software. AltiVec* SIMD macros translator software is provided ‘as is.' Intel does not provide support. Please contact N.A. Software for support.
This paper explores technical issues around building, debugging and deploying embedded firmware on an Intel® architecture system.
Presentation introduces N.A. Software AltiVec* SIMD macros translator software. Software is provided ‘as is.’ Intel does not provide support.
File Type/Size: PDF 865KB
Version: April 2009
Information and demos on the Intel® Compiler, Intel® VTune™ Performance Analyzer, Intel® Thread Checker and Intel® Thread Profiler.
INtime* software combines deterministic, hard real-time control with standard Windows operating systems (Windows XP, Windows XP Embedded, Windows Server, and Windows Vista) with no additional hardware. INtime takes advantage of the powerful virtualization technology built into the x86 processor architecture. Your real-time INtime applications run in a separate virtual machine from your Windows applications, on a single computer.
iRMX* for Windows features legacy support for existing applications and provides a migration path for real-time applications to move to modern Windows technology.
Intel’s software group maintains a knowledge base for developers of small form factor mobile devices. Many of these articles also apply to embedded platforms supported by the EDC.
Drivers and documentation are available for all supported operating systems.
This paper explains how I/O address aliasing works with respect to these registers for all ICH modes and provides exact programming instructions and sample code.
Browse dozens of technical white papers on Intel® Compilers, the Intel® VTune™ Analyzer, Intel® Performance Libraries, Threading Analysis Tools, Cluster Tools, and XML products.
This paper presents a series of methods and tips that enable a BIOS engineer to optimize the underlying platform BIOS so that it can reduce a platform’s boot speed.
Version: June 2009
The Intel® 82583V Gigabit Ethernet Controller is a small 9 mm x 9 mm, 64-pin, QFN silicon package that is ideal for GbE implementations on small form-factor embedded designs. The device consumes less than 750 mW in GbE mode and less than 300 mW in 10/100 mode.
Intel-qualified answers to your technical questions.
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Videos, online classes & eLearning by Mindshare*.
Terms for embedded developers with definitions from Intel.
Intel® Embedded Alliance is a trusted supply line of Intel-based products and services where member companies offer solutions to speed development, design and reduce costs.