Procesador Intel® Atom™ N270 y chipset Intel® 945GSE Express para equipos portátiles Anteriormente tenía el nombre de código: Navy Pier (Diamondville + Calistoga)

+ Especificaciones

+ Puntos destacados de la plataforma

 

Chipset Intel® 945GSE Express para equipos portátiles destinado a informática integrada
Producto	Código de producto	Encapsulado	Características
Concentrador de controladores de gráficos y memoria Intel® 82945GSE	QG82945GSE	998 µFC-BGA	Bus frontal (front side bus, FSB) de 533 MHz; hasta 2 GB de memoria de sistema 400/533 MHz DDR2 (SODIMM y/o memoria abajo); Intel® GMA 950
Concentrador de controladores de E/S Intel® 7-M (ICH7-M)	NH82801GBM	652 µ-BGA	Conexión directa a GMCH a través de interfaz de medios directa; cuatro puertos raíz PCI Express; controlador ATA serie de dos puertos; hasta ocho puertos USB 2.0; interfaz de Sonido de alta definición Intel®; PCI; IDE; LCI

Notas de aplicación

• Application Note: Basic Mobile Platform 2008, Power Management 

  Information for implementing power management features on designs based on the Intel® Atom™ Processor (N270), Intel® 82945GSE Express Chipset and 82801GBM I/O Controller Hub.

  Tipo y tamaño de archivo:  PDF 72KB

  Versión:  0.5 : March 2008

• Application Note: Designing Embedded Systems for Testability

  This document provides a context for using the features for manufacturability and debug implemented on Intel® processors and chipsets.

  Versión:  001 : October 2007

• Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boosts Performance Up to 10X

  The Intel® Atom™ Processor provides OpenPeak with the performance of Intel® architecture in a processor dissipating just 2.2 watts.

  Versión:  001 : November 2008

• Fanless Cooling for Embedded Applications

  This document provides reference fanless system design considerations for embedded applications utilizing CFD simulation, analytic and modeling techniques.

  Versión:  January 2009

• PCB Stackup Overview for Intel® Architecture Platforms—Layout and Signal Integrity Considerations

  An increase in the speed and frequency of a design combined with a need to reduce cost has created a challenge in defining an acceptable stack-up to meet the needs of high-speed designs.

  Versión:  December 2008

• White Paper: Accessing PCI Express* Registers When Using Intel® Chipsets

  This paper discusses the software methods used to access PCI Express* registers, including the formula used to calculate the memory locations needed to access a specific register.

  Versión:  December 2008

• White Paper: Choosing the Right Storage Solution for Your Embedded Application

  This paper examines storage solutions, from USB flash drives to high capacity disk drives, and discusses the trade-offs in finding the right solutions for an embedded application.

  Versión:  December 2008

• White Paper: DDR Signal Integrity (SI) Simulation Process for Intel® Architecture Platforms

  DDR is one of the challenging interfaces for a signal integrity engineer. This paper outlines an approach to divide the task, with an example for each step from the DDR2 interface.

  Versión:  January 2009

• White Paper: Designing Systems without a Suspend Supply

  Here are recommendations for engineers who are designing embedded systems with the minimum number of power rails, including power and reset sequencing for standby and main rails.

  Versión:  December 2008

• White Paper: Embedded Intel® Architecture and High Speed Digital Design Principles

  This paper provides insights on how high speed signals behave on a board, the role played by inductors, resistors and capacitors and available design tools.

  Versión:  January 2009

• White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture

  Since memory latency is an important factor of overall performance, it is important to know what tool to use in order to gather this information.

  Versión:  December 2008

• White Paper: Interfacing I²C Devices to Intel's SMBus Controller

  I²C bus protocols can differ slightly from Intel® Controller Hub (ICH) SMBus protocols.This paper provides a full description of the details of each SMBus cycle supported by the ICH.

  Versión:  January 2009

• White Paper: JTAG 101

  Information on the NEXUS automotive JTAG, the Intel XDP and ITP and available debuggers.

  Versión:  January 2009

• White Paper: Reducing Interrupt Latency in Embedded Systems through Message Signaled Interrupts

  MSI delivery and servicing removes the two big limitations associated with Intel® architecture, the limited number of interrupts and unnecessarily high interrupt latencies.

  Versión:  January 2009

• White Paper: Signal Integrity Pitfalls When You Deviate from Intel Design Guidelines

  Intel delivers platform design guidelines with validated platforms. This document details the signal integrity impacts from every deviation and describes solutions to overcome them.

  Versión:  January 2009

Valores de referencia

• White Paper: Hardware Level I/O Benchmarking of PCI Express on Intel® Platforms

  Ensuring sufficient hardware level I/O capabilities for embedded designs is critical. This paper outlines the PCIe hardware level benchmarking used by Intel to collect I/O performance data.

  Versión:  December 2008

• White Paper: How to Properly Measure Cache Latency, Memory Latency, and CPU to Memory Bandwidth on Intel® Architecture

  Since memory latency is an important factor of overall performance, it is important to know what tool to use in order to gather this information.

  Versión:  December 2008

• White Paper: Layer 3 Forwarding and IPSec Measurement and Optimization

  L3 forwarding measures the Intel® architecture core capability in processing IP packets without any loss. This paper explains L3 forwarding measurement and optimization techniques.

  Versión:  January 2009

Hojas de cálculo y actualizaciones de especificaciones

• Datasheet: Intel® 82583V Gigabit Ethernet Controller Datasheet

  Intel® 82583V Gigabit Ethernet Controller Datasheet

  Versión:  2.0 : June 2009

• Datasheet: Intel® I/O Controller Hub 7 (ICH7)

  Intel® I/O Controller Hub 7 (ICH7) Datasheet

  Versión:  003 : April 2007

• Datasheet: Mobile Intel® 945 Express Chipset Family

  Mobile Intel® 945 Express Chipset Family Datasheet

  Versión:  006 : June 2008

• Datasheet: Mobile Intel® Atom™ Processor N270 Single Core

  Mobile Intel® Atom™ Processor N270 Single Core Datasheet

  Versión:  001 : May 2008

• Electrical, Mechanical, and Thermal Specification (EMTS): Intel® Atom™ Processor N270 

  This is the main processor component specification document, including electrical, mechanical and thermal specifications.

  Tipo y tamaño de archivo:  PDF 990KB

  Versión:  1.5 : May 2008

• External Design Specification (EDS): Mobile Intel® 945 Express Chipset Family Volume 1 of 1 

  External design specification for the Mobile Intel® 945 Express Chipset Family

  Tipo y tamaño de archivo:  PDF 2,986KB

  Versión:  2.9 : February 2008

• External Design Specification (EDS): Mobile Intel® 945 Express Chipset Family Volume 2 of 2 

  External design specification for the Mobile Intel® 945 Express Chipset Family

  Tipo y tamaño de archivo:  PDF 1,589KB

  Versión:  3.0 : April 2008

• Intel® Mobile Voltage Positioning (Intel® MVP), 6 Voltage Regulation—Product Specification 

  An Intel Mobile Voltage Positioning (Intel® MVP) -6 voltage regulator (VR) is used to regulate power to the core of Intel® Mobile processors. This document also contains Intel MVP-6+ features required for the latest mobile and ultra mobile device platforms.

  Tipo y tamaño de archivo:  PDF 2,895KB

  Versión:  1.5 : February 2009

• Specification Update: Intel® 82583V Gigabit Ethernet Controller

  Intel® 82583V Gigabit Ethernet Controller Specification Update

  Versión:  2.2 : August 2009

• Specification Update: Intel® Atom™ Processor N270 Series

  A compilation of device and document errata and specification clarifications and changes intended for hardware system manufacturers.

  Versión:  005 : August 2009

• Specification Update: Intel® I/O Controller Hub 7 (ICH7) Family

  Specification update for the Intel® I/O Controller Hub 7 (ICH7) Family

  Versión:  027 : October 2009

• Specification Update: Intel® ICH7 

  Specification update for the Intel® ICH7

  Tipo y tamaño de archivo:  PDF 119KB

  Versión:  1.0 : September 2008

• Specification Update: Intel® ICH7 BIOS 

  This update contains revised information about products including identification information, specification changes and clarifications, documentation changes and errata.

  Tipo y tamaño de archivo:  PDF 338KB

  Versión:  2.5 : April 2008

• Specification Update: Mobile Intel® 945 Express Chipset Family BIOS Specification Update 

  This update includes fixes and additional information beyond what is contained in the 1.00 version of the Mobile Intel® 945 Express Chipset Family BIOS Specification.

  Tipo y tamaño de archivo:  PDF 129KB

  Versión:  1.14 : August 2007

• Specification Update: Mobile Intel® 945 Express Chipset Family—NDA 

  Specification update for the Mobile Intel® 945 Express Chipset Family

  Tipo y tamaño de archivo:  PDF 117KB

  Versión:  011 : November 2007

Calculadoras, listas de verificación y guías de diseño

• Design Guide: Intel® Atom™ Processor Debug Port Design Guide (DPDG) 

  This document describes all of the best-known methods relating to the design of a debug port on platforms based on the Intel® Atom™ processor series.

  Tipo y tamaño de archivo:  PDF 346KB

  Versión:  1.1 : December 2007

• Design Guide: (Netbook Platform for 2008) Intel® Atom™ Processor N270 with Intel® 945GSE Express Chipset 

  This document contains information supporting the use and implementation of a reference design based on the Intel® Atom™ processor N270 and Mobile Intel® 945GSE Express Chipset.

  Tipo y tamaño de archivo:  PDF 8,098KB

  Versión:  2.0 : February 2009

• Design Guide: Intel® Atom™ Processor N270 and Intel® 945GSE Express Chipset Based Platform for Embedded Applications - Addendum 

  The addendum provides additional information not previously released in the design guide including updates, changes, and clarifications to be used in conjunction with the parent design guide.

  Tipo y tamaño de archivo:  PDF 448KB

  Versión:  .5 : August 2008

• Layout Design Checklist: (Basic Mobile Platform 2008) Mobile Intel® Atom™ Processor N270, Intel® 82945GSE Express Chipset and Intel® 82801GBM ICH 

  Basic Mobile Platform 2008 Layout Design Checklist for the Mobile Intel® Atom™ processor N270, Intel® 82945GSE Express Chipset and Intel® 82801GBM ICH

  Tipo y tamaño de archivo:  PDF 290KB

  Versión:  1.0 : September 2008

• Schematic Design Checklist: (Basic Mobile Platform 2008) Mobile Intel® Atom™ Processor N270, Intel® 82945GSE Express Chipset and Intel® 82801GBM ICH 

  Basic Mobile Platform 2008—Schematic Checklist

  Tipo y tamaño de archivo:  PDF 707KB

  Versión:  1.0 : February 2008

Tableros y kits de desarrollo

Instale y comience a utilizar el software aprovechando los tableros y kits de desarrollo de Intel y de proveedores de terceros.

• Product Brief: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset Development Kit Product Overview

  Product brief for the Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset development kit.

  Versión:  002 : October 2008

• Where to Buy

  Purchase Intel® embedded products from Intel® Authorized Industrial Distributors.

• Additional Development Kits for Intel® Embedded

  If you already have an account set up with Intel, contact your CBA for order placement. If you are not currently set up with Intel, visit the “Where to Buy” section of the EDC.

Controladores Ethernet

• Datasheet: Intel® 82583V Gigabit Ethernet Controller Datasheet

  Intel® 82583V Gigabit Ethernet Controller Datasheet

  Versión:  2.0 : June 2009

• Product Brief: Intel® 82583V Gigabit Ethernet Controller

  Intel® 82583V Gigabit Ethernet Controller Product Brief

  Versión:  001 : May 2009

• Specification Update: Intel® 82583V Gigabit Ethernet Controller

  Intel® 82583V Gigabit Ethernet Controller Specification Update

  Versión:  2.2 : August 2009

Descripciones generales de plataforma

• Design-In Presentation: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platform 

  This presentation covers implementation details including platform design guidelines, platform software and platform technologies.

  Tipo y tamaño de archivo:  PDF 5,844KB

  Versión:  January 2008

• Platform Overview: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset-Based Platform

  Platform information includes features, benefits and functionality.

  Tipo y tamaño de archivo:  PDF 23,459KB

  Versión:  October 2008

Notas sobre el producto

• Product Brief: Intel® 82583V Gigabit Ethernet Controller

  Intel® 82583V Gigabit Ethernet Controller Product Brief

  Versión:  001 : May 2009

• Product Brief: Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset Development Kit Product Overview

  Product brief for the Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset development kit.

  Versión:  002 : October 2008

• Product Brief: Intel® Atom™ Processor N270 for Embedded Computing

  Product brief for the Intel® Atom™ Processor N270, Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset development kit.

  Versión:  001 : August 2008

Archivos de distribución y esquemas

• Intel® Atom™ N270 Processor with Mobile Intel® 945GSE Express Chipset (Embedded)—Customer Reference Board Schematic 

  Design schematics in .pdf format for the Roe River reference board, including schematics for the Intel® Atom™ N270 Processor with Mobile Intel® 945GSE Express Chipset.

  Tipo y tamaño de archivo:  PDF 2,463KB

  Versión:  May 2008

• Layout Design Checklist: (Basic Mobile Platform 2008) Mobile Intel® Atom™ Processor N270, Intel® 82945GSE Express Chipset and Intel® 82801GBM ICH 

  Basic Mobile Platform 2008 Layout Design Checklist for the Mobile Intel® Atom™ processor N270, Intel® 82945GSE Express Chipset and Intel® 82801GBM ICH

  Tipo y tamaño de archivo:  PDF 290KB

  Versión:  1.0 : September 2008

• Mobile Atom™ Solo Processor for Mini-ITX Form Factor with Intel® 945GSE Express Chipset Prototype Schematics 

  Intel® Atom™ N270 processor with Mobile Intel® 945GSE Express Chipset (embedded) Customer Reference Board Schematic—25-Jun-2008.

  Tipo y tamaño de archivo:  ZIP 1,518KB

  Versión:  May 2008

• Schematic Design Checklist: (Basic Mobile Platform 2008) Mobile Intel® Atom™ Processor N270, Intel® 82945GSE Express Chipset and Intel® 82801GBM ICH 

  Basic Mobile Platform 2008—Schematic Checklist

  Tipo y tamaño de archivo:  PDF 707KB

  Versión:  1.0 : February 2008

Modelos de simulación

• Intel® 82801Gx I/O Controller Hub (ICH7) I/O Buffer Information Specification (IBIS) Models 

  The input/output (I/O) buffer information specification model defines a buffer's characteristics for all of the I/O pins of the device.

  Tipo y tamaño de archivo:  ZIP 973KB

  Versión:  1.1 : April 2005

• Intel® 945GMS Express Chipset GMCH Package and IBIS Model 

  This package contains a set of IBIS models for the various interfaces contained in the Intel® 945GMS Express Chipset.

  Tipo y tamaño de archivo:  ZIP 617KB

  Versión:  0.5 : June 2005

• Intel® Atom™ Processor 200 Series (Diamondville) Single Core—I/O Buffer Information Specification (IBIS) Models 

  A set of I/O Buffer Information Specification (IBIS) models for the various interfaces contained in the Intel® Atom™ processor 200 series.

  Tipo y tamaño de archivo:  application/zip 144KB

  Versión:  0.7

Térmicos y mecánicos

• Basic Mobile Platform 2008 Thermal Design Update 

  Basic Mobile Platform 2008 Thermal Design Update

  Tipo y tamaño de archivo:  PDF 128KB

  Versión:  May 2008

• Electrical, Mechanical, and Thermal Specification (EMTS): Intel® Atom™ Processor N270 

  This is the main processor component specification document, including electrical, mechanical and thermal specifications.

  Tipo y tamaño de archivo:  PDF 990KB

  Versión:  1.5 : May 2008

• Intel® Atom™ Processor N270 Thermal Models 

  Intel® Atom™ processor N270 thermal models

  Tipo y tamaño de archivo:  ZIP 130KB

  Versión:  0.7 : March 2008

• Intel® I/O Controller Hub 7 (ICH7) Ballout/Pinlist/Chipset Mechanical Package Files 

  Intel® I/O Controller Hub 7 (ICH7) Ballout/Pinlist/Chipset Mechanical Package Files

  Tipo y tamaño de archivo:  ZIP 582KB

  Versión:  1.0

• Power Profiling for Embedded Applications

  Intel's power profiling kit can accurately measure a platform's total AC, DC and component level power consumption while running standard applications or benchmarks.

  Versión:  January 2009

• Thermal and Mechanical Design Guide

  System and processor thermal design considerations and recommendations for platforms based on the Intel® Atom™ Processor and Intel® System Controller Hub.

  Versión:  001 : June 2008

• White Paper: Thermal Design Considerations for Embedded Applications

  This document defines thermal cooling: passive, active and fanless thermal solutions and their difference via the three modes of heat transfer—conduction, convection and radiation.

  Versión:  December 2008

Controladores de gráficos integrados Intel

• Intel® Embedded Graphics Drivers (IEGD) landing page

  Intel® Embedded Graphics Drivers (IEGD) are a suite of multi-platform graphics drivers designed to meet the requirements of embedded applications.

Cómo migrar a la arquitectura Intel®

• AltiVec* SIMD Macros Translator

  Read and accept the software agreement to download source code from N.A. Software. AltiVec* SIMD macros translator software is provided ‘as is.' Intel does not provide support. Please contact N.A. Software for support.

• Case Study: OpenPeak* Conversion from RISC Architecture with External DSP to Intel® Architecture Boosts Performance Up to 10X

  The Intel® Atom™ Processor provides OpenPeak with the performance of Intel® architecture in a processor dissipating just 2.2 watts.

  Versión:  001 : November 2008

• Design Guide: Implementing Firmware on Embedded Intel® Architecture Designs

  This paper explores technical issues around building, debugging and deploying embedded firmware on an Intel® architecture system.

  Versión:  January 2009

• Tools For Moving AltiVec* DSP Applications to Intel® Processors - Presentation

  Presentation introduces N.A. Software AltiVec* SIMD macros translator software. Software is provided ‘as is.’ Intel does not provide support.

  Tipo y tamaño de archivo:  PDF 865KB

  Versión:  April 2009

Herramientas de desarrollo de software

• Intel® Software Development Products

  Information and demos on the Intel® Compiler, Intel® VTune™ Performance Analyzer, Intel® Thread Checker and Intel® Thread Profiler.

• TenAsys*—INtime* Real Time OS for Windows

  INtime* software combines deterministic, hard real-time control with standard Windows operating systems (Windows XP, Windows XP Embedded, Windows Server, and Windows Vista) with no additional hardware. INtime takes advantage of the powerful virtualization technology built into the x86 processor architecture. Your real-time INtime applications run in a separate virtual machine from your Windows applications, on a single computer.

• TenAsys*—iRMX* for Windows

  iRMX* for Windows features legacy support for existing applications and provides a migration path for real-time applications to move to modern Windows technology.

• Additional Development Tools for the Intel® Atom™ Processor

  Intel’s software group maintains a knowledge base for developers of small form factor mobile devices. Many of these articles also apply to embedded platforms supported by the EDC.

Descargas de software

• Intel® Embedded Graphics Drivers (IEGD) landing page

  Intel® Embedded Graphics Drivers (IEGD) are a suite of multi-platform graphics drivers designed to meet the requirements of embedded applications.

• Mobile Intel® 945GSE Express Chipset

  Drivers and documentation are available for all supported operating systems.

Documentos técnicos

• Accessing the Real Time Clock Registers and NMI Enable Bit—A Study in I/O Locations 0x70-0x77

  This paper explains how I/O address aliasing works with respect to these registers for all ICH modes and provides exact programming instructions and sample code.

  Versión:  January 2009

• Intel® Software Development Products White Papers

  Browse dozens of technical white papers on Intel® Compilers, the Intel® VTune™ Analyzer, Intel® Performance Libraries, Threading Analysis Tools, Cluster Tools, and XML products.

• White Paper: JTAG 101

  Information on the NEXUS automotive JTAG, the Intel XDP and ITP and available debuggers.

  Versión:  January 2009

• White Paper: Reducing Platform Boot Times UEFI-based Performance Optimization

  This paper presents a series of methods and tips that enable a BIOS engineer to optimize the underlying platform BIOS so that it can reduce a platform’s boot speed.

  Versión:  June 2009

– Controlador Ethernet Gigabit Intel® 82583V