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Implemented in 45nm process technology, power-optimized Intel® Atom™ Processors Z530Δ and Z510Δ provide robust performance/watt. Choose from an ultra-small 13x14 mm package with 0.6 mm ball pitch, or choose Intel Atom Processors Z530P, Z520PTΔ, Z510PΔ, and Z510PTΔ in the large form factor option 22x22 mm package with 1.0 mm ball pitch. These single-core processors are validated with the Intel® System Controller Hub (SCH) US15W, a low-power solution combining the Intel® Graphics Media Accelerator 500, memory controller and I/O controller into a single package size of 22x22 mm, or choose the large form factor Intel SCH US15WP and US15WPT with a package size of 37.5x37.5 mm. This platform has a combined TDP under five watts and embedded lifecycle support, making it ideal for many embedded market segments such as in-vehicle infotainment, medical, retail and transaction solutions (kiosks, point-of-service terminals), gaming and industrial control. The large form factor is available in commercial and industrial temperature ranges to accommodate the needs of many of these segments.
The SCH US15W features advanced 3D graphics and extensive I/O capabilities such as USB 2.0, SDIO and PCI Express.* It supports Intel® High Definition Audio and hardware video decode acceleration, 400/533 MHz CMOS FSB, dual independent display, low-voltage differential signaling (LVDS) and serial DVO display ports, and up to 2 GB max memory in a single channel with one or two ranks.
Intel® 82574L and 82574IT Gigabit Ethernet Controllers Product Brief
Version: 001 : June 2008
Intel® 82583V Gigabit Ethernet Controller Product Brief
Version: 001 : May 2009
Product brief for the Intel® Atom™ Processor Z5xx Series for Embedded Computing.
File Type/Size: PDF 813KB
Version: 006 : March 2009
Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.
¹ TDP specification should be used to design chipset thermal solutions. It is not the maximum theoretical power the chipset can generate.
This document provides a context for using the features for manufacturability and debug implemented on Intel® processors and chipsets.
Version: 001 : October 2007
This application note provides a workaround to enable PCI Express base specification on the Intel® System Controller Hub (SCH) US15W and XL SCH.
File Type/Size: PDF 81KB
Version: 1.1 : November 2008
Recommendations for enabling 1.5V DDR2 memory subsystems with the Intel® System Controller Hub for Intel® Atom™ processor-based designs.
File Type/Size: PDF 188KB
Version: 0.5 : January 2008
The Introduction to Via-In-Pad (VIP) Board Design application note covers the differences between high density interconnect and VIP when designing your board.
Version: 001 : November 2008
This application note describes a method to implement an SPI bridge and power plane management using a low-cost complex programmable logic device (CPLD).
File Type/Size: PDF 534KB
Version: 002 : September 2008
The Intel® Atom™ Processor provides OpenPeak with the performance of Intel® architecture in a processor dissipating just 2.2 watts.
This paper describes a ground breaking, power-efficient DDR2 SODIMM architecture implementation for space-constrained solutions.
File Type/Size: PDF 245KB
Version: 2.1 : September 2008
This document provides reference fanless system design considerations for embedded applications utilizing CFD simulation, analytic and modeling techniques.
Version: January 2009
This paper documents the investigation/POC involving enabling a sub 2-second EFI BIOS boot time on embedded platforms featuring the Intel® Atom™ processor.
Version: September 2008
This white paper describes different types of embedded solar-powered computing devices and provides design suggestions for Intel® Atom™ processor-based platforms.
Version: 001 : September 2008
Application Note: In-Vehicle Infotainment
File Type/Size: PDF 126KB
An increase in the speed and frequency of a design combined with a need to reduce cost has created a challenge in defining an acceptable stack-up to meet the needs of high-speed designs.
Version: December 2008
This paper discusses the software methods used to access PCI Express* registers, including the formula used to calculate the memory locations needed to access a specific register.
This paper examines storage solutions, from USB flash drives to high capacity disk drives, and discusses the trade-offs in finding the right solutions for an embedded application.
DDR is one of the challenging interfaces for a signal integrity engineer. This paper outlines an approach to divide the task, with an example for each step from the DDR2 interface.
Here are recommendations for engineers who are designing embedded systems with the minimum number of power rails, including power and reset sequencing for standby and main rails.
This paper provides insights on how high speed signals behave on a board, the role played by inductors, resistors and capacitors and available design tools.
Since memory latency is an important factor of overall performance, it is important to know what tool to use in order to gather this information.
I²C bus protocols can differ slightly from Intel® Controller Hub (ICH) SMBus protocols.This paper provides a full description of the details of each SMBus cycle supported by the ICH.
Information on the NEXUS automotive JTAG, the Intel XDP and ITP and available debuggers.
MSI delivery and servicing removes the two big limitations associated with Intel® architecture, the limited number of interrupts and unnecessarily high interrupt latencies.
Solve the challenges of implementing the ACPI compliant sleep states in an Atom™US15W SCH based platform.
File Type/Size: PDF 268KB
Intel delivers platform design guidelines with validated platforms. This document details the signal integrity impacts from every deviation and describes solutions to overcome them.
Benchmark data includes memory latency and throughput, CPU performance (DMIPS and CPU2000), embedded application performance, 3D graphics performance and video playback.
File Type/Size: PDF 86KB
Ensuring sufficient hardware level I/O capabilities for embedded designs is critical. This paper outlines the PCIe hardware level benchmarking used by Intel to collect I/O performance data.
L3 forwarding measures the Intel® architecture core capability in processing IP packets without any loss. This paper explains L3 forwarding measurement and optimization techniques.
Intel® 82583V Gigabit Ethernet Controller Datasheet
Version: 2.0 : June 2009
Overview of the Intel® Atom™ Processor Z5xx series (large form factor).
Version: March 2009
Datasheet for the Intel® Atom™ Processor Z5xx Series.
Version: 002 : March 2009
Datasheet for the Intel® System Controller Hub (Intel® SCH).
Overview of the Intel® System Controller Hub (Intel® SCH) (large form factor)
Version: 001 : February 2009
Intel® Atom™ Processor XL Electrical, Mechanical, and Thermal Specifications (EMTS) Addendum (large form factor).
File Type/Size: PDF 478KB
Version: 1.5 : November 2008
This is the main processor component specification document, including electrical, mechanical and thermal specifications.
File Type/Size: PDF 1,343KB
Version: 2.0 : April 2008
Intel® System Controller Hub XL External Design Specification (EDS) Addendum (large form factor).
File Type/Size: PDF 1,386KB
The specification describes the functionality of the Intel® SCH, includes signal register and functional descriptions and electrical and package characteristics.
File Type/Size: PDF 3,663KB
Version: 2.0 : March 2008
Intel® 82574 GbE Controller Family Datasheet
Version: 017/Rev 2.6 : August 2009
An Intel Mobile Voltage Positioning (Intel® MVP) -6 voltage regulator (VR) is used to regulate power to the core of Intel® Mobile processors. This document also contains Intel MVP-6+ features required for the latest mobile and ultra mobile device platforms.
File Type/Size: PDF 2,895KB
Version: 1.5 : February 2009
Intel® 82574 GbE Controller Family Specification Update
Version: 2.7 : August 2009
Intel® 82583V Gigabit Ethernet Controller Specification Update
Version: 2.2 : August 2009
Specification update for the Intel® Atom™ Processor Z5xx Series.
Version: 008 : April 2009
Specification update (subject to NDA) with revised information about products including identification information, specification changes and clarifications, documentation changes and errata.
File Type/Size: PDF 253KB
Version: 009 : December 2008
This specification update provides publically released errata for the Intel® System Controller Hub (SCH).
Version: 008 : June 2009
Specification update (subject to NDA) with revised information about products including identification information, specification changes and clarifications, documentation changes and pre-production errata.
File Type/Size: PDF 299KB
Version: 2.05 : November 2008
This training presentation describes the benefits and challenges of high-density interconnects (HDI) and provides design and PCB manufacturing guidelines.
File Type/Size: PDF 2,560KB
Version: September 2007
This document describes all of the best-known methods relating to the design of a debug port on platforms based on the Intel® Atom™ processor series.
File Type/Size: PDF 346KB
Version: 1.1 : December 2007
Intel® Atom™ Processor Z5xx series and the Intel® System Controller Hub XL Platform Design Guide (large form factor).
File Type/Size: PDF 3,243KB
Version: 1.5 : December 2008
The design guide contains information supporting the use and implementation of a reference design, with information on board layout and system design.
File Type/Size: PDF 3,389KB
Version: 2.1 : March 2009
Embedded Intel® Atom™ Processor XL Platform Layout Checklist (large form factor).
File Type/Size: PDF 203KB
Version: 1.2 : September 2008
Layout checklist for the Intel® Atom™ processor and Intel® System Controller Hub US15W preliminary product preview.
File Type/Size: PDF 278KB
Version: 2.1 : June 2008
Intel® Atom™ Processor Z5xx series and the Intel® System Controller Hub XL Platform Schematic Checklist (large form factor).
File Type/Size: PDF 194KB
Trace Length Calculator for the Intel® Atom™ Processor Z5xx series and the Intel® System Controller Hub-based platform (large form factor).
File Type/Size: application/octet-stream 1,960KB
Version: 1.6 : December 2008
The Trace Length Calculator ensures trace lengths meet recommendations in the associated platform design guide.
File Type/Size: ZIP 487KB
Version: 1.0 : November 2007
The Trace Length Calculator ensures trace lengths meet recommendations in the associated platform design guide. The user enters the board's routed trace length and the calculator automates calculation to see if layout guidelines are met. The guide is meant to be used to aid PCB layout but it is not a replacement for the platform design guide. For related information see platform design guide.
File Type/Size: Microsoft* Excel 1,440KB
Version: 2.0 : November 2008
Get your software up and running using boards and development kits from Intel and third-party vendors.
This is a computer-on-module based on the Intel® Atom™ processor.
Users manual for the Intel® Atom™ processor and Intel® System Controller Hub US15W development kit.
Version: 1.0 : July 2008
BIOS 19 binary and release notes.
File Type/Size: ZIP 1,050KB
Version: 19 : October 2008
Intel® Atom™ Processor: TechOnline* VirtuaLab overview video. Duration: 11:28.
Overview of VirtuaLab for Intel® Atom™ Processor Z530 and Intel® System Controller Hub US15W Platform for Embedded Computing VirtuaLab Overview Rev. 1.0.
File Type/Size: PDF 512KB
Version: 1.0
This VirtuaLab* lets you check out the features of this power optimized, highly integrated platform and optimize your software online, without access to local hardware.
Purchase Intel® embedded products from Intel® Authorized Industrial Distributors.
If you already have an account set up with Intel, contact your CBA for order placement. If you are not currently set up with Intel, visit the “Where to Buy” section of the EDC.
Intel® 82574 GbE Controller Family Driver Download
Platform overview—Intel® Atom&trade Processor Z5xx series and the Intel® System Controller Hub-based platform (large form factor).
File Type/Size: PDF 4,287KB
Version: 9 : January 2009
This presentation covers implementation details including platform design guidelines, platform software and platform technologies.
File Type/Size: PDF 3,370KB
Version: 1.4
File Type/Size: PDF 2,705KB
Version: 0.5 : March 2008
This video examines the features and benefits of using the Intel® Atom™ Processor Z5xx series in embedded platforms. Duration: 4:44.
Platform information includes features, benefits and functionality.
File Type/Size: PDF 3,055KB
Version: 1.2 : April 2008
Product brief for the Intel® Atom™ Processor Z5xx Series and Intel® System Controller Hub US15W Development Kit.
Version: 001 : April 2008
Product brief for the Intel® System Controller Hub US15W for Embedded Computing.
Version: 005 : March 2009
Schematic and layout files.
File Type/Size: PDF 174KB
Version: 2.2 : November 2008
A customer reference board schematic based on the Intel® Atom™ processor Z5xx series and the Intel® System Controller Hub-based platform.
File Type/Size: PDF 682KB
Version: 1.5 : November 2007
Design schematics for the Menlow platform Swift Current 2 reference board, including schematics for the Intel® Atom™ Processor Z5xx Series and Intel® System Controller Hub.
File Type/Size: PDF 376KB
Version: 2.1 : February 2008
Boundary Scan Description Language (BSDL) models for the Intel® Atom™ Processor Z5xx Series.
File Type/Size: ZIP 7KB
Version: 1.5
The input/output (I/O) buffer information specification model defines a buffer's characteristics for all of the I/O pins of the device.
File Type/Size: ZIP 267KB
Version: 1.0 : August 2007
Intel® Atom™ Processor XL Boundary Scan Description Language (BSDL) models (large form factor).
File Type/Size: application/zip 6KB
Intel® Atom™ Processor XL I/O Buffer Information Specification (IBIS) models (large form factor).
File Type/Size: application/zip 224KB
File Type/Size: ZIP 2,620KB
Version: 2.3 : October 2008
Boundary Scan Description Language (BSDL) models for the Intel® System Controller Hub.
File Type/Size: application/zip 14KB
Intel® System Controller Hub XL Boundary Scan Description Language (BSDL) models (large form factor).
Intel® System Controller Hub XL I/O Buffer Information Specification (large form factor).
File Type/Size: application/zip 1,155KB
Version: 1.5 : January 2009
Ballout, signal and mechanical package data for the Intel® Atom™ Processor Z5xx Series and the Intel® System Controller Hub-based platform.
File Type/Size: ZIP 824KB
Version: 1.0 : November 2006
Digital thermal sensor and thermal diode clarification for the Intel® Atom™ Processor.
File Type/Size: PDF 120KB
Version: April 2008
Icepak and Flotherm thermal model and user guide for the Intel® Atom™ processor.
File Type/Size: ZIP 104KB
Version: 2.0 : October 2007
Flotherm and Icepak thermal models and user guide for the Intel® System Controller Hub US15W.
File Type/Size: ZIP 135KB
Version: 1.0 : September 2007
System and processor thermal design considerations and recommendations for platforms based on the Intel® Atom™ Processor and Intel® System Controller Hub.
File Type/Size: PDF 3,101KB
Intel's power profiling kit can accurately measure a platform's total AC, DC and component level power consumption while running standard applications or benchmarks.
This document defines thermal cooling: passive, active and fanless thermal solutions and their difference via the three modes of heat transfer—conduction, convection and radiation.
Intel® Embedded Graphics Drivers (IEGD) are a suite of multi-platform graphics drivers designed to meet the requirements of embedded applications.
Intel provides development drivers for Intel® Integrated Graphics to the open source community.
Version: November 2008
Read and accept the software agreement to download source code from N.A. Software. AltiVec* SIMD macros translator software is provided ‘as is.' Intel does not provide support. Please contact N.A. Software for support.
This paper explores technical issues around building, debugging and deploying embedded firmware on an Intel® architecture system.
Presentation introduces N.A. Software AltiVec* SIMD macros translator software. Software is provided ‘as is.’ Intel does not provide support.
File Type/Size: PDF 865KB
Version: April 2009
Information and demos on the Intel® Compiler, Intel® VTune™ Performance Analyzer, Intel® Thread Checker and Intel® Thread Profiler.
The AdaptiveMobile* Policy Control Framework provides protection against illegal or inappropriate content, mobile viruses and malware and unsolicited or unauthorized communications.
Adeneo* provides a broad range of systems integration services including hardware/software turnkey designs, BSPs, drivers and application development WinCE*, WinMO*, .NETMF* and Linux*.
ALT Software* is a leader in optimized 2D/3D embedded OpenGL graphics products as well as general and DO-178B professional development services.
Alt Software* provides high- performance 2D/3D graphics embedded OpenGL display driver kits or ""Graphic Binary Kits"" for safety-critical (DO-178B, Level A) and general purpose environments.
AMIBIOS8* is a well supported and stable BIOS product adopted by all computing market segments.
AMI* Aptio provides a firmware solution based on EFI, UEFI and Intel® Platform Innovation Framework for EFI specifications.
American Megatrends* offers a hardware diagnostic solution for the Unified Extensible Firmware Interface (UEFI).
An Embedded Controller (EC) subsystem enables energy-conscious designs to obtain power savings.
Bsquare* provides a Windows CE 6.0* Board Support Package for the Intel® Atom™ platform, targeted at UMPC, MID, industrial control, kiosk, gaming, and medical device applications.
The boot security application establishes trust between platform hardware and the user application, preventing the operation of systems compromised by unauthorized tampering.
Embedded BIOS* with StrongFrame* Technology is the sixth evolution of General Software's firmware SDK solution for Intel® architecture designs.
General Software* Embedded UEFI Core with StrongFrame* Technology is UEFI 2.1-specification compliant, giving customers the latest proven EFI technology commercially available.
The Firmbase* SDK is a software development kit that provides customers with the ability to embed General Software's Firmbase Technology into application software.
General Software* High Availability (HA) Monitor* enables embedded systems to autonomously detect and correct including OS crashes, degraded hardware performance and failing hardware.
The platform update facility is firmware that allows manual replacement of disk partitions, files within partitions, CMOS contents and flash memory at any time during its operation.
InsydeH2O* is Insyde Software's newest and most advanced product family for managing PC compatibility and interoperability based on Extensible Firmware Interface (EFI) and implements the Intel® Platform Innovation Framework for EFI.
QNX* Momentics* is a multi-language, multi-host, multi-target development suite. QNX Momentics includes tightly integrated tools, time-saving wizards and a rich complement of board support packages, libraries and driver source kits.
The QNX* Neutrino* RTOS has an ultra-reliable microkernel architecture with robust memory protection, transparent networking, POSIX-based portability and a high-performance embeddable windowing system.
Samplify for Windows* is a compression analysis tool that allows system architects to evaluate the use of compression on signals captured from their system.
Xyco* is an independent BIOS developer for Intel® architecture-based solutions.
Intel’s software group maintains a knowledge base for developers of small form factor mobile devices. Many of these articles also apply to embedded platforms supported by the EDC.
Use SoftStraps Editor and SCH Microcode Merge utility to update/merge Intel® System Controller Hub microcode into a BIOS ROM image, modify SoftStraps in either SCH micorcode, or BIOS ROM file.
File Type/Size: ZIP 220KB
Version: 2.72 : May 2009
INF Utility Microsoft Operating Systems updates Windows* operating system with server chipset branding information and instructs the OS to load appropriate drivers.
File Type/Size: ZIP 2,219KB
This package contains USB client drivers for Windows XP, Embedded XP and WEPOS*.
This paper explains how I/O address aliasing works with respect to these registers for all ICH modes and provides exact programming instructions and sample code.
Browse dozens of technical white papers on Intel® Compilers, the Intel® VTune™ Analyzer, Intel® Performance Libraries, Threading Analysis Tools, Cluster Tools, and XML products.
Developers can achieve dramatic boot-time and performance gains by replacing the BIOS with customized early initialization of peripherals.
File Type/Size: PDF 569KB
This paper presents a series of methods and tips that enable a BIOS engineer to optimize the underlying platform BIOS so that it can reduce a platform’s boot speed.
Version: June 2009
Intel® 82574L/IT Gigabit Ethernet Controllers are ideal for GbE implementations on small form-factor embedded designs as well as client and server LAN on motherboard (LOM) configurations. This 9mm x 9mm, 64-pin, QFN (Quad Flatpack No-lead) silicon package provides a 40 percent reduction in total footprint over the previous generation. Intel 82574L/IT Gigabit Ethernet Controllers consume less than 710mW in GbE mode and less than 300mW in 10/100 mode.
The Intel® 82583V Gigabit Ethernet Controller is a small 9 mm x 9 mm, 64-pin, QFN silicon package that is ideal for GbE implementations on small form-factor embedded designs. The device consumes less than 750 mW in GbE mode and less than 300 mW in 10/100 mode.
Intel-qualified answers to your technical questions.
Online hardware & software product evaluation.
Get development tools on a 30-day loan basis.
Videos, online classes & eLearning by Mindshare*.
Terms for embedded developers with definitions from Intel.
Intel® Embedded Alliance is a trusted supply line of Intel-based products and services where member companies offer solutions to speed development, design and reduce costs.