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Featuring 45nm process technology and based on Intel® Core™ microarchitecture, the Intel® Core™2 Quad Processor Q9400Δ and Intel® Core™2 Duo Processor E8400Δ provide advancements in simultaneous computing for multi-threaded applications and multi-tasking environments. Both are validated with the Intel® Q45 Express Chipset—consisting of the Intel® 82Q45 Graphics and Memory Controller Hub and Intel® I/O Controller Hub 10 DO—to provide the latest advancements in graphics, security and always-available manageability for embedded applications.
These platforms are ideal for developing high-performance systems for industrial control and automation, retail and hospitality, gaming, print imaging, digital signage, digital surveillance and network security applications. Along with the Intel® Graphics Media Accelerator 4500 and Intel® Trusted Execution Technology, the chipset supports Intel® Virtualization Technology, Intel® Active Management Technology version 5.0, Intel® 64 Architecture and Execute Disable Bit.
Intel® 82576 Gigabit Ethernet Controller Product Brief
Version: 001 : June 2008
Product brief for the Intel® Core™2 Duo processors E8400, E7400, E6400 and E4300 for Embedded Computing
Version: 006 : July 2009
Product brief for the Intel® Core™2 Quad processor Q9400 for Embedded Computing
Version: 002 : February 2009
Suppliers of support components have developed products for system designs based on the Intel® Core™2 Duo processor family in the 775-land LGA package.
Third-party suppliers have developed cooling solutions for systems based on the Intel® Core™2 Quad Desktop Processor that have been tested by an Intel-enabled independent test house.
This application note explains how to use the CPUID instruction in software applications, BIOS implementations and processor tools.
Version: 036 : August 2009
This document provides a context for using the features for manufacturability and debug implemented on Intel® processors and chipsets.
Version: 001 : October 2007
This manual provides information about programming SPI flash on ICH family based platforms.
File Type/Size: PDF 929KB
Version: 2.4 : September 2008
An increase in the speed and frequency of a design combined with a need to reduce cost has created a challenge in defining an acceptable stack-up to meet the needs of high-speed designs.
Version: December 2008
This paper discusses the software methods used to access PCI Express* registers, including the formula used to calculate the memory locations needed to access a specific register.
This paper covers what it takes to set up the IA-32 architecture and potential usage models for asymmetric multiprocessing.
Version: January 2009
This paper examines storage solutions, from USB flash drives to high capacity disk drives, and discusses the trade-offs in finding the right solutions for an embedded application.
DDR is one of the challenging interfaces for a signal integrity engineer. This paper outlines an approach to divide the task, with an example for each step from the DDR2 interface.
Here are recommendations for engineers who are designing embedded systems with the minimum number of power rails, including power and reset sequencing for standby and main rails.
This paper provides insights on how high speed signals behave on a board, the role played by inductors, resistors and capacitors and available design tools.
Since memory latency is an important factor of overall performance, it is important to know what tool to use in order to gather this information.
I²C bus protocols can differ slightly from Intel® Controller Hub (ICH) SMBus protocols.This paper provides a full description of the details of each SMBus cycle supported by the ICH.
Information on the NEXUS automotive JTAG, the Intel XDP and ITP and available debuggers.
This paper explores design paradigms for data plane packet processing on multi-core Intel architecture systems and their impact on data structure design and synchronization primitives.
MSI delivery and servicing removes the two big limitations associated with Intel® architecture, the limited number of interrupts and unnecessarily high interrupt latencies.
Based on real-world applications, these tips will help programmers migrating to multi-core systems avoid some of the pitfalls that can come with the new parallel paradigm.
Intel delivers platform design guidelines with validated platforms. This document details the signal integrity impacts from every deviation and describes solutions to overcome them.
This paper uses PiAutoSim*, a bench-top simulator, to show how upgrading the hardware and software development environment of an embedded product enables significant performance improvements.
Ensuring sufficient hardware level I/O capabilities for embedded designs is critical. This paper outlines the PCIe hardware level benchmarking used by Intel to collect I/O performance data.
L3 forwarding measures the Intel® architecture core capability in processing IP packets without any loss. This paper explains L3 forwarding measurement and optimization techniques.
Datasheet for Original Equipment Manufacturers and BIOS vendors creating products based on the Intel® I/O Controller Hub 10 (ICH10) family.
Version: 003 : October 2008
Intel® 4 Series Express Chipset Family Datasheet
Version: 005 : May 2009
Intel® 82576 Gigabit Ethernet Controller Datasheet
Version: 2.41 : April 2009
Intel® Core™2 Duo Processor E8000 and E7000 Series Datasheet
Version: 006 : June 2009
Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series Datasheet
Version: 010 : August 2009
This is the main processor component specification document, including electrical, mechanical and thermal specifications.
File Type/Size: PDF 1,765KB
Version: 2.3 : July 2008
File Type/Size: PDF 1,864KB
These specifications are intended for original equipment manufacturers and BIOS vendors creating products based on the Intel® I/O Controller Hub 10 (ICH10).
File Type/Size: PDF 6,235KB
Version: 2.1 : September 2008
Intel® Q45 Express Chipset External Design Specification (EDS)
File Type/Size: PDF 4,820KB
Version: 2.0 : June 2008
Manufacturing advantage service (MAS) collateral is focused on improving the ramp of Intel platforms and technologies in the customer's manufacturing line.
File Type/Size: PDF 75KB
Version: 0.8
Product brief for the Intel® Q45 Express Chipset for Embedded Computing
Version: 003 : August 2009
Intel® 82576 Gigabit Ethernet Controller Specification Update
Version: 2.3 : May 2009
Specification update for the Intel® ICH10 datasheet.
File Type/Size: PDF 261KB
Version: 1.0/Rev004 : December 2008
Intel® Core™2 Duo processor E8400 Specification Update
Version: June 2009
Specification update for the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad Processor Q9000 and Q8000 Series
File Type/Size: PDF 345KB
Version: 1.0/Rev014 : November 2008
Version: May 2009
Specification update for the Intel® I/O Controller Hub 10 (ICH10) Family
Version: July 2009
The design guide contains information supporting the use and implementation of a reference design, with information on board layout and system design.
File Type/Size: PDF 9,157KB
Version: 2.1.1 : October 2008
This document describes the power delivery feature set necessary to support Vcc power delivery requirements of Intel processors.
File Type/Size: PDF 3,410KB
Version: 1.1 : October 2008
The Trace Length Calculator ensures trace lengths meet recommendations in the associated Platform Design Guide.
File Type/Size: ZIP 329KB
Version: 1.3 : February 2008
Get your software up and running using boards and development kits from Intel and third-party vendors.
These manuals describe the architecture and programming environment of Intel® 64 and IA-32 processors. Electronic versions allow you to quickly get to the information you need.
User's manual for the Intel® Core™2 Duo processor and Intel® Q45 Express Chipset Development Kit
Version: 001 : September 2008
Purchase Intel® embedded products from Intel® Authorized Industrial Distributors.
If you already have an account set up with Intel, contact your CBA for order placement. If you are not currently set up with Intel, visit the “Where to Buy” section of the EDC.
Intel® 82576 Gigabit Ethernet Controller Driver Download
Intel® 82576 Gigabit Ethernet Controller Boundary Scan Description Language models for board level scan testing. Models describe boundary scan chain internal to the processor.
File Type/Size: ZIP 7KB
Version: 2.2 : July 2008
This presentation covers implementation details including platform design guidelines, platform software and platform technologies.
File Type/Size: PDF 8,832KB
Version: 1.3
Platform information includes features, benefits and functionality.
File Type/Size: PDF 6,535KB
Version: 1.1
Processors based on Intel® Core™ Microarchitecture are being designed in to a broad range of demanding embedded application environments.
Version: 001 : March 2009
Intel® Q45 Express Chipset DDR2 BTX board file
File Type/Size: application/zip 8,080KB
Version: 2.0 : August 2008
Intel® Q45 Express Chipset DDR2 BTX schematics
File Type/Size: application/zip 732KB
Intel® Q45 Express Chipset DDR3 ATX schematics
File Type/Size: application/zip 1,874KB
The document applies to the Intel® Core™2 Extreme Processor QX9000 Series and Intel® Core™2 Quad processor Q9000 Series.
File Type/Size: PDF 67KB
Version: 0.5 : March 2007
The input/output (I/O) buffer information specification model defines a buffer's characteristics for all of the I/O pins of the device.
File Type/Size: ZIP 1,133KB
File Type/Size: ZIP 5,069KB
Version: 1.0 : December 2007
Thermal and mechanical design guide contains system and processor thermal design considerations and recommendations. The guide outlines the operating limits of the product and discusses a generic thermal solution. It suggests proper thermal design techniques based on a particular configuration and system boundary conditions and assumptions. The guide may also include experimental data for recommended fans, heat pipes and interface materials as well as simulation data.
File Type/Size: PDF 2,158KB
Version: 1.0
Intel® 4 Series Chipset Family Thermal and Mechanical Design Guidelines
Version: 004 : September 2008
Mechanical package details, schematics, reference layout and drop-in core layout.
File Type/Size: ZIP 370KB
Version: 0.73
The maximum power application is software that runs on the CPU for thermal evaluation. It enables the processor to run various power workloads up to and including maximum power.
File Type/Size: ZIP 3,017KB
Version: 1.0.1
Guidelines for meeting the thermal requirements of single processor systems using the Intel® Core™2 Duo processor E8000 and E7000 series and the Intel® Pentium® Processor E50
Version: 011 : August 2009
The thermal design guide contains system and processor thermal design considerations and recommendations to aid system designers in the proper implementation of thermal management solutions.
File Type/Size: PDF 4,237KB
Version: 2.2
File Type/Size: ZIP 2,747KB
Version: 1.01
Thermal design guidelines for embedded Intel® G45, G41, Q45, Q35 and Q965 Express Chipsets (GMCH) in 1U and PICMG 1.3 form factors.
File Type/Size: PDF 1,345KB
Version: 1.5
Intel® I/O Controller Hub 10 (ICH10) Family Thermal and Mechanical Design Guidelines
Intel® Q45 Express Chipset Ballout
File Type/Size: ZIP 842KB
Intel® Q45 Express Chipset Thermal and Mechanical Design Guidelines
File Type/Size: PDF 1,600KB
Version: 2.1 : August 2008
The component thermal model assists in development of system level thermal solutions. It contains the thermal models for the chipset/processor package and the reference heatsink assembly.
File Type/Size: ZIP 45KB
Version: 1.0 : August 2008
For LGA775 processors Mechanical Models are Pro-E and IGES design files for enabled components for the optimized platform (retention, heatsink and clips).
File Type/Size: ZIP 223KB
Intel's power profiling kit can accurately measure a platform's total AC, DC and component level power consumption while running standard applications or benchmarks.
Presler TTV Component Thermal Models
File Type/Size: ZIP 40KB
Version: 1.0 : July 2007
This document provides general mechanical design guidance to improve shock performance.
File Type/Size: PDF 935KB
This document defines thermal cooling: passive, active and fanless thermal solutions and their difference via the three modes of heat transfer—conduction, convection and radiation.
Intel® Embedded Graphics Drivers (IEGD) are a suite of multi-platform graphics drivers designed to meet the requirements of embedded applications.
Intel provides development drivers for Intel® Integrated Graphics to the open source community.
Version: November 2008
Read and accept the software agreement to download source code from N.A. Software. AltiVec* SIMD macros translator software is provided ‘as is.' Intel does not provide support. Please contact N.A. Software for support.
This paper explores technical issues around building, debugging and deploying embedded firmware on an Intel® architecture system.
Presentation introduces N.A. Software AltiVec* SIMD macros translator software. Software is provided ‘as is.’ Intel does not provide support.
File Type/Size: PDF 865KB
Version: April 2009
Information and demos on the Intel® Compiler, Intel® VTune™ Performance Analyzer, Intel® Thread Checker and Intel® Thread Profiler.
OpenMP* is a set of pragmas, function calls and environment variables that simplify the creation, synchronization and deletion of threads in your applications.
Version: September 2007
The USB driver is included in the Intel® Q45 Express Chipset in the Intel® Chipset Device Software zip file available on the Web.
This paper explains how I/O address aliasing works with respect to these registers for all ICH modes and provides exact programming instructions and sample code.
The In-Circuit Tester zip file contains a document that describes the XOR Chain test mode and enabling the JTAG interface, the in circuit test file, and the JTAG access file.
File Type/Size: ZIP 84KB
Version: 1.0 : June 2008
Browse dozens of technical white papers on Intel® Compilers, the Intel® VTune™ Analyzer, Intel® Performance Libraries, Threading Analysis Tools, Cluster Tools, and XML products.
This presentation from QNX covers Intel's breadth of multi-core solutions and discusses issues developers face when moving to multi-core, with examples.
File Type/Size: PDF 1,534KB
Version: 4 : February 2009
The Intel® 82576 Gigabit Ethernet Controller provides high performance dual-port gigabit connectivity in a multi-core platform, as well as in a virtualized platform. In a multi-core platform it supports technologies including Intel® QuickData Technology, MSI-X, and Low Latency Interrupts that help accelerate the movement of data across the platform, improving application response times. In a virtualized environment, it supports Intel® Virtualization Technology for Connectivity that helps improve I/O performance by reducing I/O overhead.
Videos, online classes & eLearning by Mindshare*.
Terms for embedded developers with definitions from Intel.
Intel® Embedded Alliance is a trusted supply line of Intel-based products and services where member companies offer solutions to speed development, design and reduce costs.
from Nexcom The NSA 3110 is a 1U 19" rack-mount form factor platform, which is based on the Intel® G41 chipset and ICH7R controller. The standard NSA3110 is equipped with eight Intel 82541 LAN chips with four bypass segments. With the enhanced performance, the NSA311... ...
from ADLINK The ADLINK M-321 is a FlexATX industrial motherboard supporting the next-generation Intel® Core™2 Quad/Duo, Pentium® Dual Core and Celeron® processors in the LGA775 package to deliver a high performance platform for a wide array of industrial applic... ...
from DFI-ITOX DFI today introduces a new industrial mini-ITX form factor motherboard utilizing the Intel® G41 Express chipset with Intel® ICH7 I/O controller hub. This new embedded board supports 45nm Intel® Core™2 Quad and Intel® Core™2 Duo processors with... ...