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Intel® Embedded Pre-release Seed Board Programs
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Intel, in conjunction with the Intel® Embedded Alliance, is accepting customer applications for the Intel® Embedded Pre-release Seed Board Program. This program is designed to help customers jump-start development of key projects with the latest processor technology on the embedded Intel® architecture roadmap.

To apply you must be a Registered User (public registration requires a valid e-mail address and access is immediate) and you must agree to the INTEL® EMBEDDED PRE-RELEASE MATERIAL PROGRAM TERMS. Register now or Log in.

If your application is accepted¹, you may become eligible to receive a complimentary pre-release motherboard² based on one of Intel’s next generation hardware platforms. These motherboards are based on a pre-release Intel processor and an NDA with Intel is required before the motherboard can be shipped to you. If you do not have a current NDA with Intel and are selected by the program, we will work with you to complete the NDA process.

Active programs

Description Shipments Begin3 Last Day to Apply3 How to Apply

Advantech AIMB-212 Board

Single-core mini-ITX motherboard featuring the next generation Intel® embedded Atom™ Processor-based platform.

 December 11, 2009 TBD

Request a free motherboard

Emerson Deveron Board

MicroATX motherboard featuring the new Intel® Core™ i7 Processor. (formerly Arrandale/Ibex Peak-M)

 November 2, 2009 November 18, 2009

Request a free motherboard

SUBMITTING AN APPLICATION DOES NOT GUARANTEE RECEIPT OF ANY PRE-RELEASE BOARD OR MATERIAL, AND NOTHING SHALL OBLIGATE INTEL TO SUPPLY ANY PRE-RELEASE OR PRODUCTION BOARD OR MATERIAL.

¹ Selection criteria are solely at Intel’s discretion. Applicants will be notified by e-mail if selected.

² Limited to one motherboard per project. Each project requires a separate application.

3 Dates subject to change.