Thermal models are used in commercially available Computational Fluid Dynamics thermal analysis tools. It contains the thermal models for the chipset/processor package and the reference heat sink assembly. It consists of a processor package and a socket assembly. The die, C4 attach, substrate, socket body, and BGA layer are modeled as blocks with orthotropic properties, the die power is modeled in one source sized and located so that it captures the power density effects of the processor.
File Type/Size: ZIP 270KB
Version: 0.5 : August 2007