Chassis Interface to Thermal Module

In order to provide a standard interface between a thermal module and the chassis, a common physical interface plane and geometry are required. The following figure shows the relationship between the motherboard zones, the thermal module, the chassis/thermal module interface, and the chassis zones.

Figure 3-8. Chassis to Thermal Module Interface and Relation to Chassis and Motherboard Zones

The following figure defines a plane relative to both the motherboard datums as well as the surface geometry that should be provided on that plane by the chassis (and designed for the thermal module). The surface consists of a frame of minimum width around the window defined for airflow to the thermal module.

The primary purpose for this interface and connection is to provide external air from a vent in the chassis to the thermal module. For this reason, the air channel and the chassis vent should be designed so that there is minimal impedance to airflow from outside the chassis to the defined interface.

Figure 3-9. Chassis Requirements for Thermal Module Interface Definition