13th Generation Intel® Core™ and Intel® Core™ 14th Generation Processors

Datasheet, Volume 1 of 2
Supporting 13th Generation Intel® Core™ Processor for S, H, P, HX, and U Processor Line Platforms, formerly known as Raptor Lake, Intel® Core™ 14th Generation Processor for S, HX, and U Processor Line Platform, formerly known as Raptor Lake Refresh and Intel® Xeon™ E 2400 Processor, formerly known As Raptor Lake–E

ID 743844
Date 05/13/2024
Document Table of Contents

Introduction

These processors are a 64-bit, multi-core processors built on 10-nanometer process technology.

Intel ® Core™ Processors includes the Intel ® Performance Hybrid architecture, P-Cores for performance and E-Cores for Efficiency. Refer to Table: Processor Lines for availability in Intel processor lines. For more details on P-Core and E-Core, refer to Power and Performance Technologies.

The S-Processor Line offered in a 2-Chip Platform that includes the Processor Die and Platform Controller Hub (PCH-S) die in LGA and BGA Package.

The S Refresh-Processor Line offered in a 2-Chip Platform that includes the Processor Die and Platform Controller Hub (PCH-S) die in LGA Package.

S Processor line naming conventions in this document:

  • S Processor when referring to S LGA Processor Line.

  • S LGA when referring to S LGA Processor line.

  • HX when referring S BGA Processor Line.
S-Refresh Processor line naming conventions in this document:
  • S-Refresh Processor when referring to S Refresh LGA Processor Line.

  • S-Refresh LGA when referring to S Refresh LGA Processor line.

  • HX-Refresh when referring S Refresh BGA Processor Line.

The P/H/U-Processor Line offered in a 2 Die Multi Chip Package (MCP) that includes the Processor Die and Platform Controller Hub (PCH-P) die on the same package as the processor die.

The U Refresh-Processor Line offered in a 2 Die Multi Chip Package (MCP) that includes the Processor Die and Platform Controller Hub (PCH-P) die on the same package as the processor die.

The PX-Processor Line offered in a 2 Die Multi Chip Package (MCP) that includes the Processor Die and Platform Controller Hub (PCH-PX) die on the same package as the processor die. The PX has smaller package size compared to the P package.

The E/E Refresh-Processor Line offered in a 2-Chip Platform that includes the Processor Die and Platform Controller Hub (PCH-S) die in LGA Package.

The following table describes the different processor lines:

Processor Lines

Processor Line1

Package

Processor Base Power (a.k.a TDP)2, 3

Processor

IA P-Cores

Processor

IA E-Cores

Graphics Configuration

Platform Type

S-Processor

LGA1700

35W

8

16

32EU

2-Chip

S-Processor

LGA1700

65W

8

16

32EU

2-Chip

S-Processor

LGA1700

125W

8

16

32EU

2-Chip

S-Processor

LGA1700

150W

8

16

32EU

2-Chip

S-Processor

LGA1700

35W

8

8

32EU

2-Chip

S-Processor

LGA1700

65W

8

8

32EU

2-Chip

S-Processor

LGA1700

35W

6

0

32EU

2-Chip

S-Processor

LGA1700

65W

6

0

32EU

2-Chip

S Refresh-Processor

LGA1700

35W

8

16

32EU

2-Chip

S Refresh-Processor

LGA1700

65W

8

16

32EU

2-Chip

S Refresh-Processor

LGA1700

125W

8

16

32EU

2-Chip

S Refresh-Processor

LGA1700

150W

8

16

32EU

2-Chip

S Refresh -Processor

LGA1700

35W

8

8

32EU

2-Chip

S Refresh-Processor

LGA1700

65W

8

8

32EU

2-Chip

S Refresh -Processor

LGA1700

35W

6

0

32EU

2-Chip

S Refresh-Processor

LGA1700

65W

6

0

32EU

2-Chip

HX-Processor 8P+16E

BGA1964

55W

8

16

32EU

2-Chip

HX-Processor 8P+8E

BGA1964

55W

8

8

32EU

2-Chip

HX Refresh-Processor 8P+16E

BGA1964

55W

8

16

32EU

2-Chip

P-Processor 6P+8E

BGA1744

28W

6

8

96EU

1-Chip

H-Processor 6P+8E

BGA1744

45W

6

8

96EU

1-Chip

U-Processor 2P+8E

BGA1744

15W

2

8

96EU

1-Chip

U Refresh-Processor 2P+8E

BGA1744

15W

2

8

96EU

1-Chip

PX-Processor 6P+8E

BGA1792

45W

6

8

96EU

1-Chip

E-Processor 8P + 0E

LGA1700 95W 8 0 0EU 2-Chip

E-Processor 8P + 0E

LGA1700 80W 8 0 0EU 2-Chip

E-Processor 8P + 0E

LGA1700 65W 8 0 0EU 2-Chip

E-Processor 6P + 0E

LGA1700 95W 6 0 0EU 2-Chip

E-Processor 6P + 0E

LGA1700 80W 6 0 0EU 2-Chip

E-Processor 6P + 0E

LGA1700 65W 6 0 0EU 2-Chip

E-Processor 4P + 0E

LGA1700 55W 4 0 0EU 2-Chip
Notes:
  1. Processor lines offering may change.
  2. For additional Processor Base Power (a.k.a TDP) Configurations, refer to Processor Line Power and Frequency Specifications, for adjustment to the Processor Base Power (a.k.a TDP) required to preserve base frequency associated with the sustained long-term thermal capability.
  3. Processor Base Power (a.k.a TDP) workload does not reflect I/O connectivity cases such as Thunderbolt, for power adders estimation for various I/O connectivity scenarios.

S Processor Line Platform Diagram