13th Generation Intel® Core™ and Intel® Core™ 14th Generation Processors
Datasheet, Volume 1 of 2
Supporting 13th Generation Intel® Core™ Processor for S, H, P, HX, and U Processor Line Platforms, formerly known as Raptor Lake, Intel® Core™ 14th Generation Processor for S, HX, and U Processor Line Platform, formerly known as Raptor Lake Refresh and Intel® Xeon™ E 2400 Processor, formerly known As Raptor Lake–E
Package Mechanical Attributes
The S
Package | Parameter | S LGA Processor Lines |
---|---|---|
Package Technology | Package Type | Flip Chip Land Grid Array |
Interconnect | Land Grid Array (LGA) | |
Lead Free | N/A | |
Halogenated Flame Retardant Free | Yes | |
Package Configuration | Solder Ball Composition | N/A |
Ball/Pin Count | 1700 | |
Grid Array Pattern | Grid Array | |
Land Side Capacitors | Yes | |
Die Side Capacitors | Yes | |
Die Configuration | Single Die Single-Chip Package with HIS | |
Package Dimensions | Nominal Package Size | 45.0 x 37.5 mm |
Z | Substrate Z=1.116 mm +/-0.95 Die Z is 0.37 mm | |
Minimum Ball/Pin pitch | 0.8 mm |
Package | Parameter | HX Processor Lines
|
---|---|---|
Package Technology | Package Type | Flip Chip Ball Grid Array |
Interconnect | Ball Grid Array (BGA) | |
Lead Free | N/A | |
Halogenated Flame Retardant Free | Yes | |
Package Configuration | Solder Ball Composition | Yes |
Ball/Pin Count | 1964 | |
Grid Array Pattern | Grid Array | |
Land Side Capacitors | Yes | |
Die Side Capacitors | Yes (resistor/Capacitors) | |
Die Configuration | Single Die Single-Chip Package | |
Package Dimensions | Nominal Package Size | 45.0 x 37.5 mm |
Z | Substrate Z = 1.119+/-0.095 mm 2.005±0.114 (BOTTOM OF BGA TO TOP OF DIE) | |
Minimum Ball/Pin pitch | 0.8 mm |
Package | Parameter | P/H/U Processor Line
|
---|---|---|
Package Technology | Package Type | Flip Chip Ball Grid Array |
Interconnect | Ball Grid Array (BGA) | |
Lead Free | Yes | |
Halogenated Flame Retardant Free | Yes | |
Package Configuration | Solder Ball Composition | SAC405 |
Ball/Pin Count | 1744 | |
Grid Array Pattern | Balls anywhere | |
Land Side Capacitors | Yes | |
Die Side Capacitors | No | |
Die Configuration | 2 Dice Multi Chip package (MCP) | |
Package Dimensions | Nominal Package Size | 25 x 50 mm |
Z | Substrate Z = 0.594+/-0.08mm 1.185±0.096 (BOTTOM OF BGA TO TOP OF DIE) | |
Minimum Ball/Pin pitch | 0.65 mm BP |
Package | Parameter | PX Processor Line |
---|---|---|
Package Technology | Package Type | Flip Chip Ball Grid Array |
Interconnect | Ball Grid Array (BGA) | |
Lead Free | Yes | |
Halogenated Flame Retardant Free | Yes | |
Package Configuration | Solder Ball Composition | SAC405 |
Ball/Pin Count | 1792 | |
Grid Array Pattern | Ball Anywhere | |
Land Side Capacitors | Yes | |
Die Side Capacitors | No | |
Die Configuration | 2 Dice Multi Chip Package (MCP) | |
Package Dimensions | Nominal Package Size | 25 X 40 mm |
Z | Substrate Z= 0.594+/-0.08 mm 1.171±0.082 (Bottom of BGA to Top of Die) | |
Minimum Ball/Pin pitch | 0.62 mm BP |