13th Generation Intel® Core™, Intel® Core™ 14th Generation, Intel® Core™ Processor (Series 1) and (Series 2), Intel® Xeon™ E 2400 Processor and Intel® Xeon™ 6300 Processor

Datasheet, Volume 1 of 2
Supporting 13th Generation Intel® Core™ Processor for S, H, P, HX, and U Processor Line Platforms, formerly known as Raptor Lake.
Supporting Intel® Core™ 14th Generation Processor for S, HX formerly known As Raptor Lake Refresh.
Supporting Intel® Core™ Processor (Series 1) for U Processor Line Platform, formerly known As Raptor Lake refresh
Supporting Intel® Core™ Processor (Series 2) for H Processor Line Platform, formerly known As Raptor Lake Refresh.
Supporting Intel® Xeon® E 2400 Processor and Intel® Xeon® 6300 Processor, formerly known As Raptor Lake–E Refresh

ID Date Version Classification
743844 02/28/2025 Public
Document Table of Contents
Document Table of Contents
Legal Disclaimer Revision History Introduction Technologies Power Management Thermal Management Memory USB-C* Sub System PCIe* Interface Direct Media Interface and On Package Interface Graphics Display Camera/MIPI Signal Description Electrical Specifications Package Mechanical Specifications CPU And Device IDs
Legal Disclaimer
Revision History
Introduction
Introduction Processor Volatility Statement Package Support Supported Technologies Power Management Support Thermal Management Support Ball-out Information Processor Testability Operating Systems Support Terminology and Special Marks Related Documents
Processor Volatility Statement
Package Support
Supported Technologies
Supported Technologies API Support (Windows*)
API Support (Windows*)
Power Management Support
Power Management Support Processor Core Power Management System Power Management Memory Controller Power Management Processor Graphics Power Management
Processor Core Power Management
System Power Management
Memory Controller Power Management
Processor Graphics Power Management
Thermal Management Support
Ball-out Information
Processor Testability
Operating Systems Support
Terminology and Special Marks
Related Documents
Technologies
Technologies Platform Environmental Control Interface Intel® Virtualization Technology Security Technologies Power and Performance Technologies Intel® Image Processing Unit Debug Technologies Clock Topology Intel Volume Management Device Technology Deprecated Technologies
Platform Environmental Control Interface
Platform Environmental Control Interface PECI Bus Architecture
PECI Bus Architecture
Intel® Virtualization Technology
Intel® Virtualization Technology Intel® VT for Intel® 64 and Intel® Architecture Intel® Virtualization Technology for Directed I/O Intel® APIC Virtualization Technology (Intel® APICv) Hypervisor-Managed Linear Address Translation
Intel® VT for Intel® 64 and Intel® Architecture
Intel® Virtualization Technology for Directed I/O
Intel® APIC Virtualization Technology (Intel® APICv)
Hypervisor-Managed Linear Address Translation
Security Technologies
Security Technologies Intel® Trusted Execution Technology Intel® Advanced Encryption Standard New Instructions Perform Carry-Less Multiplication Quad Word Instruction Intel® Secure Key Execute Disable Bit Boot Guard Technology Intel® Supervisor Mode Execution Protection Intel® Supervisor Mode Access Protection Intel® Secure Hash Algorithm Extensions User Mode Instruction Prevention Read Processor ID Intel® Total Memory Encryption - Multi-Key Intel® Control-flow Enforcement Technology KeyLocker Technology Devil’s Gate Rock
Intel® Trusted Execution Technology
Intel® Advanced Encryption Standard New Instructions
Perform Carry-Less Multiplication Quad Word Instruction
Intel® Secure Key
Execute Disable Bit
Boot Guard Technology
Intel® Supervisor Mode Execution Protection
Intel® Supervisor Mode Access Protection
Intel® Secure Hash Algorithm Extensions
User Mode Instruction Prevention
Read Processor ID
Intel® Total Memory Encryption - Multi-Key
Intel® Control-flow Enforcement Technology
Intel® Control-flow Enforcement Technology Shadow Stack Indirect Branch Tracking
Shadow Stack
Indirect Branch Tracking
KeyLocker Technology
Devil’s Gate Rock
Power and Performance Technologies
Power and Performance Technologies Intel® Smart Cache Technology IA Cores Level 1 and Level 2 Caches Ring Interconnect Intel® Performance Hybrid Architecture Intel® Turbo Boost Max Technology 3.0 Power Aware Interrupt Routing (PAIR) Intel® Hyper-Threading Technology Intel® Turbo Boost Technology 2.0 Enhanced Intel SpeedStep® Technology Intel® Thermal Velocity Boost (Intel® TVB) Intel® Speed Shift Technology Intel® Advanced Vector Extensions 2 (Intel® AVX2) Intel® 64 Architecture x2APIC Intel® Dynamic Tuning Technology Intel® GMM and Neural Network Accelerator Cache Line Write Back Remote Action Request User Mode Wait Instructions Intel® Adaptive Boost Technology
Intel® Smart Cache Technology
IA Cores Level 1 and Level 2 Caches
Ring Interconnect
Intel® Performance Hybrid Architecture
Intel® Turbo Boost Max Technology 3.0
Power Aware Interrupt Routing (PAIR)
Intel® Hyper-Threading Technology
Intel® Turbo Boost Technology 2.0
Intel® Turbo Boost Technology 2.0 Intel® Turbo Boost Technology 2.0 Frequency Intel® Turbo Boost Technology 2.0 Power Control Intel® Turbo Boost Technology 2.0 Power Monitoring
Intel® Turbo Boost Technology 2.0 Frequency
Intel® Turbo Boost Technology 2.0 Power Control
Intel® Turbo Boost Technology 2.0 Power Monitoring
Enhanced Intel SpeedStep® Technology
Intel® Thermal Velocity Boost (Intel® TVB)
Intel® Speed Shift Technology
Intel® Advanced Vector Extensions 2 (Intel® AVX2)
Intel® Advanced Vector Extensions 2 (Intel® AVX2) Intel® AVX2 Vector Neural Network Instructions (AVX2 VNNI)
Intel® AVX2 Vector Neural Network Instructions (AVX2 VNNI)
Intel® 64 Architecture x2APIC
Intel® Dynamic Tuning Technology
Intel® GMM and Neural Network Accelerator
Cache Line Write Back
Remote Action Request
User Mode Wait Instructions
Intel® Adaptive Boost Technology
Intel® Image Processing Unit
Platform Imaging Infrastructure Intel® Image Processing Unit
Platform Imaging Infrastructure
Intel® Image Processing Unit
Debug Technologies
Debug Technologies Intel® Processor Trace Platform CrashLog Telemetry Aggregator
Intel® Processor Trace
Platform CrashLog
Telemetry Aggregator
Clock Topology
Clock Topology Integrated Reference Clock PLL
Integrated Reference Clock PLL
Intel Volume Management Device Technology
Deprecated Technologies
Power Management
Power Management Advanced Configuration and Power Interface (ACPI) States Supported Processor IA Core Power Management Processor AUX Power Management Processor Graphics Power Management System Agent Enhanced Intel SpeedStep® Technology Rest Of Platform (ROP) PMIC PCI Express* Power Management TCSS Power State
Advanced Configuration and Power Interface (ACPI) States Supported
Processor IA Core Power Management
Processor IA Core Power Management OS/HW Controlled P-states Low-Power Idle States Requesting the Low-Power Idle States Processor IA Core C-State Rules Package C-States Package C-States and Display Resolutions
OS/HW Controlled P-states
Enhanced Intel SpeedStep® Technology Intel® Speed Shift Technology
Enhanced Intel SpeedStep® Technology
Intel® Speed Shift Technology
Low-Power Idle States
Requesting the Low-Power Idle States
Processor IA Core C-State Rules
Package C-States
Package C-States and Display Resolutions
Processor AUX Power Management
Processor Graphics Power Management
Processor Graphics Power Management Memory Power Savings Technologies Display Power Savings Technologies Processor Graphics Core Power Savings Technologies
Memory Power Savings Technologies
Display Power Savings Technologies
Processor Graphics Core Power Savings Technologies
System Agent Enhanced Intel SpeedStep® Technology
Rest Of Platform (ROP) PMIC
PCI Express* Power Management
TCSS Power State
Thermal Management
Thermal Management Processor Thermal Management General Notes Processor Line Power and Frequency Specifications Processor Line Thermal and Power Specifications
Processor Thermal Management
Processor Thermal Management Thermal Considerations Assured Power (cTDP) Thermal Management Features Intel® Memory Thermal Management
Thermal Considerations
Thermal Considerations Package Power Control Platform Power Control Turbo Time Parameter (Tau)
Package Power Control
Platform Power Control
Turbo Time Parameter (Tau)
Assured Power (cTDP)
Assured Power (cTDP) Assured Power (cTDP)
Assured Power (cTDP)
Thermal Management Features
Thermal Management Features Adaptive Thermal Monitor Digital Thermal Sensor PROCHOT# Signal PROCHOT Output Only Bi-Directional PROCHOT# PROCHOT Demotion Algorithm Voltage Regulator Protection using PROCHOT# Thermal Solution Design and PROCHOT# Behavior Low-Power States and PROCHOT# Behavior THRMTRIP# Signal Critical Temperature Detection On-Demand Mode MSR Based On-Demand Mode I/O Emulation-Based On-Demand Mode
Adaptive Thermal Monitor
Digital Thermal Sensor
PROCHOT# Signal
PROCHOT Output Only
Bi-Directional PROCHOT#
PROCHOT Demotion Algorithm
Voltage Regulator Protection using PROCHOT#
Thermal Solution Design and PROCHOT# Behavior
Low-Power States and PROCHOT# Behavior
THRMTRIP# Signal
Critical Temperature Detection
On-Demand Mode
MSR Based On-Demand Mode
I/O Emulation-Based On-Demand Mode
Intel® Memory Thermal Management
General Notes
Processor Line Power and Frequency Specifications
Processor Line Thermal and Power Specifications
Memory
Memory System Memory Interface Integrated Memory Controller (IMC) Power Management
System Memory Interface
System Memory Interface Processor SKU Support Matrix Supported Memory Modules and Devices System Memory Timing Support Memory Controller (MC) Memory Controller Power Gate System Memory Controller Organization Mode (DDR4/5 Only) System Memory Frequency Technology Enhancements of Intel® FMA Data Scrambling ECC H-Matrix Syndrome Codes Data Swapping LPDDR5/x Ascending and Descending LPDDR4x CMD Mirroring DDR I/O Interleaving DRAM Clock Generation DRAM Reference Voltage Generation Data Swizzling Error Correction With Standard RAM Post Package Repair Refresh Management (RFM)
Processor SKU Support Matrix
Supported Memory Modules and Devices
System Memory Timing Support
System Memory Timing Support System Memory Timing Support SAGV Points DDR Frequency Shifting
System Memory Timing Support
SAGV Points
DDR Frequency Shifting
Memory Controller (MC)
Memory Controller Power Gate
System Memory Controller Organization Mode (DDR4/5 Only)
System Memory Frequency
Technology Enhancements of Intel® FMA
Data Scrambling
ECC H-Matrix Syndrome Codes
Data Swapping
LPDDR5/x Ascending and Descending
LPDDR4x CMD Mirroring
DDR I/O Interleaving
DRAM Clock Generation
DRAM Reference Voltage Generation
Data Swizzling
Error Correction With Standard RAM
Post Package Repair
Refresh Management (RFM)
Integrated Memory Controller (IMC) Power Management
Integrated Memory Controller (IMC) Power Management Disabling Unused System Memory Outputs DRAM Power Management and Initialization DDR Electrical Power Gating Power Training
Disabling Unused System Memory Outputs
DRAM Power Management and Initialization
DRAM Power Management and Initialization Initialization Role of CKE Conditional Self-Refresh Dynamic Power-Down DRAM I/O Power Management
Initialization Role of CKE
Conditional Self-Refresh
Dynamic Power-Down
DRAM I/O Power Management
DDR Electrical Power Gating
Power Training
USB-C* Sub System
USB-C* Sub System General Capabilities USB* 4 Router USB-C Sub-system xHCI/xDCI Controllers USB-C Sub-System Display Interface
General Capabilities
USB* 4 Router
USB* 4 Router USB 4 Host Router Implementation Capabilities
USB 4 Host Router Implementation Capabilities
USB-C Sub-system xHCI/xDCI Controllers
USB-C Sub-system xHCI/xDCI Controllers USB 3 Controllers USB-C Sub-System PCIe Interface
USB 3 Controllers
USB-C Sub-System PCIe Interface
USB-C Sub-System Display Interface
PCIe* Interface
PCIe* Interface Processor PCI Express* Interface
Processor PCI Express* Interface
Processor PCI Express* Interface PCI Express* Support PCI Express* Architecture PCI Express* Configuration Mechanism PCI Express* Equalization Methodology PCI Express* Hot Plug
PCI Express* Support
PCI Express* Architecture
PCI Express* Configuration Mechanism
PCI Express* Equalization Methodology
PCI Express* Hot Plug
Direct Media Interface and On Package Interface
Direct Media Interface (DMI) On Package Interface (OPI)
Direct Media Interface (DMI)
Direct Media Interface (DMI) DMI Error Flow DMI Link Down
DMI Error Flow
DMI Link Down
On Package Interface (OPI)
OPI Support Functional Description
OPI Support
Functional Description
Graphics
Graphics Processor Graphics
Processor Graphics
Processor Graphics Media Support (Intel® QuickSync and Clear Video Technology HD) Platform Graphics Hardware Feature
Media Support (Intel® QuickSync and Clear Video Technology HD)
Media Support (Intel® QuickSync and Clear Video Technology HD) Hardware Accelerated Video Decode Hardware Accelerated Video Encode Hardware Accelerated Video Processing Hardware Accelerated Transcoding
Hardware Accelerated Video Decode
Hardware Accelerated Video Encode
Hardware Accelerated Video Processing
Hardware Accelerated Transcoding
Platform Graphics Hardware Feature
Platform Graphics Hardware Feature Hybrid Graphics
Hybrid Graphics
Display
Display Display Technologies Support Display Configuration Display Features
Display Technologies Support
Display Configuration
Display Features
Display Features General Capabilities Multiple Display Configurations High-bandwidth Digital Content Protection (HDCP) DisplayPort* High-Definition Multimedia Interface (HDMI*) embedded DisplayPort* (eDP*) MIPI* DSI Integrated Audio
General Capabilities
Multiple Display Configurations
High-bandwidth Digital Content Protection (HDCP)
DisplayPort*
DisplayPort* Multi-Stream Transport (MST)
Multi-Stream Transport (MST)
High-Definition Multimedia Interface (HDMI*)
embedded DisplayPort* (eDP*)
MIPI* DSI
Integrated Audio
Camera/MIPI
Camera/MIPI Camera Pipe Support MIPI* CSI-2 Camera Interconnect
Camera Pipe Support
MIPI* CSI-2 Camera Interconnect
MIPI* CSI-2 Camera Interconnect Camera Control Logic Camera Modules CSI-2 Lane Configurations
Camera Control Logic
Camera Modules
CSI-2 Lane Configurations
Signal Description
Signal Description System Memory Interface PCI Express* Graphics (PEG) Signals Direct Media Interface (DMI) Signals Reset and Miscellaneous Signals Display Interfaces USB Type-C Signals MIPI CSI 2 Interface Signals Processor Clocking Signals Testability and Monitoring Signals Error and Thermal Protection Signals Processor Power Rails Ground and Reserved Signals Processor Internal Pull-Up / Pull- Down on Package
System Memory Interface
System Memory Interface DDR4 Memory Interface LP4x-LP5 Memory Interface DDR5 Memory Interface
DDR4 Memory Interface
LP4x-LP5 Memory Interface
DDR5 Memory Interface
PCI Express* Graphics (PEG) Signals
Direct Media Interface (DMI) Signals
Reset and Miscellaneous Signals
Display Interfaces
Display Interfaces Digital Display Interface (DDI) Signals Digital Display Audio Signals
Digital Display Interface (DDI) Signals
Digital Display Audio Signals
USB Type-C Signals
MIPI CSI 2 Interface Signals
Processor Clocking Signals
Testability and Monitoring Signals
Error and Thermal Protection Signals
Processor Power Rails
Ground and Reserved Signals
Processor Internal Pull-Up / Pull- Down on Package
Electrical Specifications
Electrical Specifications Power Delivery DC Specifications
Power Delivery
Power Delivery Power and Ground Pins Digital Linear Voltage Regulator (DLVR) VCC Voltage Identification (VID) Fast V-Mode Current Excursion Protection (CEP)
Power and Ground Pins
Digital Linear Voltage Regulator (DLVR)
VCC Voltage Identification (VID)
Fast V-Mode
Current Excursion Protection (CEP)
DC Specifications
DC Specifications Processor Power Rails DC Specifications Processor Interfaces DC Specifications
Processor Power Rails DC Specifications
Processor Power Rails DC Specifications VCCCORE DC Specifications VccGT DC Specifications VDD2 DC Specifications Vcc1P05_PROC DC Specifications Vcc1P8_PROC DC Specifications
VCCCORE DC Specifications
VccGT DC Specifications
VDD2 DC Specifications
Vcc1P05_PROC DC Specifications
Vcc1P8_PROC DC Specifications
Processor Interfaces DC Specifications
Processor Interfaces DC Specifications DDR4 DC Specifications DDR5 DC Specifications LPDDR4x DC Specification LPDDR5/x DC Specification PCIe* DC and Timing Specifications PCI Express* Graphics (PEG) Group DC Specifications Digital Display Interface (DDI) DC Specifications CMOS DC Specifications GTL and OD DC Specification PECI DC Characteristics
DDR4 DC Specifications
DDR5 DC Specifications
LPDDR4x DC Specification
LPDDR5/x DC Specification
PCIe* DC and Timing Specifications
PCI Express* Graphics (PEG) Group DC Specifications
Digital Display Interface (DDI) DC Specifications
CMOS DC Specifications
GTL and OD DC Specification
PECI DC Characteristics
Package Mechanical Specifications
Package Mechanical Specifications Package Mechanical Attributes Package Storage Specifications
Package Mechanical Attributes
Package Storage Specifications
CPU And Device IDs
CPU And Device IDs CPUID PCI Configuration Header Device IDs
CPUID
PCI Configuration Header
Device IDs

Introduction

These processors are a 64-bit, multi-core processors built on 10-nanometer process technology.

Intel ® Core™ Processors includes the Intel ® Performance Hybrid architecture, P-Cores for performance and E-Cores for Efficiency. Refer to Table: Processor Lines for availability in Intel processor lines. For more details on P-Core and E-Core, refer to Power and Performance Technologies.

The S-Processor Line offered in a 2-Chip Platform that includes the Processor Die and Platform Controller Hub (PCH-S) die in LGA and BGA Package.

The S Refresh-Processor Line offered in a 2-Chip Platform that includes the Processor Die and Platform Controller Hub (PCH-S) die in LGA Package.

S Processor line naming conventions in this document:

  • S Processor when referring to S LGA Processor Line.

  • S LGA when referring to S LGA Processor line.

  • HX when referring S BGA Processor Line.
S-Refresh Processor line naming conventions in this document:

  • S-Refresh Processor when referring to S Refresh LGA Processor Line.

  • S-Refresh LGA when referring to S Refresh LGA Processor line.

  • HX-Refresh when referring S Refresh BGA Processor Line.

The P/H/U-Processor Line offered in a 2 Die Multi Chip Package (MCP) that includes the Processor Die and Platform Controller Hub (PCH-P) die on the same package as the processor die.

The H Refresh-Processor Line offered in a 2 Die Multi Chip Package (MCP) that includes the Processor Die and Platform Controller Hub (PCH-P) die on the same package as the processor die.

The U Refresh-Processor Line offered in a 2 Die Multi Chip Package (MCP) that includes the Processor Die and Platform Controller Hub (PCH-P) die on the same package as the processor die.

The PX-Processor Line offered in a 2 Die Multi Chip Package (MCP) that includes the Processor Die and Platform Controller Hub (PCH-PX) die on the same package as the processor die. The PX has smaller package size compared to the P package.

The E/E Refresh-Processor Line offered in a 2-Chip Platform that includes the Processor Die and Platform Controller Hub (PCH-S) die in LGA Package.

Other naming conventions in this document:

  • S, H, P, HX, and U Processor Line when referring to 13th Generation Intel® Core™.
  • S -Refresh, HX -Refresh Processor when referring to Intel® Core™ 14th Generation.
  • U-Refresh Processor when referring to Intel® Core™ Processor ("Series 1") and ("Series 2").
  • H-Refresh Processor when referring to Intel® Core™ Processor ("Series 2").
  • E Processor when referring to Intel® Xeon® E 2400 Processor.
  • E- Refresh Processor when referring to Intel® Xeon® 6300 Processor.

The following table describes the different processor lines:

Processor Lines

Processor Line1

Package

Processor Base Power (a.k.a TDP)2, 3

Processor

IA P-Cores

Processor

IA E-Cores

Graphics Configuration

Platform Type

S-Processor

LGA1700

35W

8

16

32EU

2-Chip

S-Processor

LGA1700

65W

8

16

32EU

2-Chip

S-Processor

LGA1700

125W

8

16

32EU

2-Chip

S-Processor

LGA1700

150W

8

16

32EU

2-Chip

S-Processor

LGA1700

35W

8

8

32EU

2-Chip

S-Processor

LGA1700

65W

8

8

32EU

2-Chip

S-Processor

LGA1700

35W

6

0

32EU

2-Chip

S-Processor

LGA1700

65W

6

0

32EU

2-Chip

S Refresh-Processor

LGA1700

35W

8

16

32EU

2-Chip

S Refresh-Processor

LGA1700

65W

8

16

32EU

2-Chip

S Refresh-Processor

LGA1700

125W

8

16

32EU

2-Chip

S Refresh-Processor

LGA1700

150W

8

16

32EU

2-Chip

S Refresh -Processor

LGA1700

35W

8

8

32EU

2-Chip

S Refresh-Processor

LGA1700

65W

8

8

32EU

2-Chip

S Refresh -Processor

LGA1700

35W

6

0

32EU

2-Chip

S Refresh-Processor

LGA1700

65W

6

0

32EU

2-Chip

HX-Processor 8P+16E

BGA1964

55W

8

16

32EU

2-Chip

HX-Processor 8P+8E

BGA1964

55W

8

8

32EU

2-Chip

HX Refresh-Processor 8P+16E

BGA1964

55W

8

16

32EU

2-Chip

P-Processor 6P+8E

BGA1744

28W

6

8

96EU

1-Chip

H-Processor 6P+8E

BGA1744

45W

6

8

96EU

1-Chip

H Refresh-Processor 6P+8E

BGA1744

45W

6

8

96EU

1-Chip

U-Processor 2P+8E

BGA1744

15W

2

8

96EU

1-Chip

U Refresh-Processor 2P+8E

BGA1744

15W

2

8

96EU

1-Chip

PX-Processor 6P+8E

BGA1792

45W

6

8

96EU

1-Chip

E-Processor 8P + 0E

LGA1700 95W 8 0 0EU 2-Chip

E-Processor 8P + 0E

LGA1700 80W 8 0 0EU 2-Chip

E-Processor 8P + 0E

LGA1700 65W 8 0 0EU 2-Chip

E-Processor 6P + 0E

LGA1700 95W 6 0 0EU 2-Chip

E-Processor 6P + 0E

LGA1700 80W 6 0 0EU 2-Chip

E-Processor 6P + 0E

LGA1700 65W 6 0 0EU 2-Chip

E-Processor 4P + 0E

LGA1700 55W 4 0 0EU 2-Chip

E Refresh-Processor 8P + 0E

LGA1700 95W 8 0 0EU 2-Chip

E Refresh-Processor 8P + 0E

LGA1700 80W 8 0 0EU 2-Chip

E Refresh-Processor 8P + 0E

LGA1700 65W 8 0 0EU 2-Chip

E Refresh-Processor 6P + 0E

LGA1700 95W 6 0 0EU 2-Chip

E Refresh-Processor 6P + 0E

LGA1700 80W 6 0 0EU 2-Chip

E Refresh-Processor 6P + 0E

LGA1700 65W 6 0 0EU 2-Chip

E Refresh-Processor 4P + 0E

LGA1700 55W 4 0 0EU 2-Chip
Notes:
  1. Processor lines offering may change.
  2. For additional Processor Base Power (a.k.a TDP) Configurations, refer to Processor Line Power and Frequency Specifications, for adjustment to the Processor Base Power (a.k.a TDP) required to preserve base frequency associated with the sustained long-term thermal capability.
  3. Processor Base Power (a.k.a TDP) workload does not reflect I/O connectivity cases such as Thunderbolt, for power adders estimation for various I/O connectivity scenarios.

S Processor Line Platform Diagram

E/E Refresh Processor Line Platform Diagram

S Refresh Processor Line Platform Diagram

P/H/H Refresh Processor Line Platform Diagram

U/U Refresh Processor Line Platform Diagram

HX /HX RefreshProcessor Line Platform Diagram

PX Processor Line Platform Diagram