System component that is assembled to the chassis beneath the motherboard to provide structural support for motherboard and components as well as retention for a thermal module.

A system component with the primary role of dissipating heat from the core components. A typical thermal module includes a heatsink for the processor, an air mover such as an axial fan, and a duct to isolate and direct airflow through the system. The flexibility to adapt to many applications are offered through the option to integrate a range of cooling technologies and components to create a thermal module. Modules will be one of two types based on which Zone a component height maximum (Refer Figure 3-3) is selected: Type I (Standard Height) or Type II (Low Profile).