13th Generation Intel® Core™ Processors
Datasheet, Volume 1 of 2
Supporting 13th Generation Intel® Core™ Processor for S Processor Line Platforms, formerly known as Raptor Lake
A newer version of this document is available. Customers should click here to go to the newest version.
Package Mechanical Attributes
The S Processor Lines use a Flip Chip technology available in a Land Grid Array (LGA) package. The following table provides an overview of the package mechanical attributes. For specific dimensions (die size, die location, and so on), refer to the processor package mechanical drawings.
Package | Parameter | S LGA Processor Lines |
---|---|---|
Package Technology | Package Type | Flip Chip Land Grid Array |
Interconnect | Land Grid Array (LGA) | |
Lead Free | N/A | |
Halogenated Flame Retardant Free | Yes | |
Package Configuration | Solder Ball Composition | N/A |
Ball/Pin Count | 1700 | |
Grid Array Pattern | Grid Array | |
Land Side Capacitors | Yes | |
Die Side Capacitors | Yes | |
Die Configuration | Single Die Single-Chip Package with HIS | |
Package Dimensions | Nominal Package Size | 45.0 x 37.5 mm |
Z | Substrate Z=1.116 mm +/-0.95 Die Z is 0.37 mm | |
Minimum Ball/Pin pitch | 0.8 mm |