Intel® Core™ Ultra Processor
Datasheet, Volume 1 of 2
Supporting Intel® Core™ Ultra Processor for U/H/U-Type4-series Platforms, formerly known as Meteor Lake
| ID | Date | Version | Classification |
|---|---|---|---|
| 792044 | 05/09/2025 | Public |
Package Mechanical Attributes
The
| Package | Parameter | H |
|---|---|---|
| Package Technology | Package Type | Flip Chip Ball Grid Array |
| Interconnect | Ball Grid Array (BGA) | |
| Lead Free | Yes | |
| Halogenated Flame Retardant Free | Yes | |
| Package Configuration | Solder Ball Composition | SAC405 |
| Ball/Pin Count | 2049 | |
| Grid Array Pattern | Balls anywhere | |
| Land Side Capacitors | Yes | |
| Tile Side Capacitors | No | |
| Tile Configuration | Foveros | |
| Package Dimensions | Nominal Package Size | 25 x 50 mm |
| Z | Substrate Z = 0.644 ± 0.095 mm 1.245 ± 0.109 mm (BOTTOM OF BGA TO TOP OF TILE) | |
| Minimum Ball/Pin pitch | 0.65 mm BP |
The U-series processor use a Flip Chip technology available in a Ball Grid Array (BGA) package. The following table provides an overview of the package mechanical attributes.
| Package | Parameter | U-Series Processor |
|---|---|---|
| Package Technology | Package Type | Flip Chip Ball Grid Array |
| Interconnect | Ball Grid Array (BGA) | |
| Lead Free | Yes | |
| Halogenated Flame Retardant Free | Yes | |
| Package Configuration | Solder Ball Composition | LTS |
| Ball/Pin Count | 2551 | |
| Grid Array Pattern | Balls anywhere | |
| Land Side Capacitors | No | |
| Tile Side Capacitors | No | |
| Tile Configuration | Foveros | |
| Package Dimensions | Nominal Package Size | 19 x 23 mm |
| Z | Substrate Z = 0.240 ± 0.05 mm 0.675 ± 0.063 mm (BOTTOM OF BGA TO TOP OF TILE) | |
| Minimum Ball/Pin pitch | 0.37 mm & 0.40mm (Corner & Underneath tile) BP |