12th Generation Intel® Core™ Processors

Datasheet, Volume 1 of 2

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ID 655258
Date 06/15/2023
Document Table of Contents
Document Table of Contents
Legal Disclaimer Revision History Introduction Technologies Power Management Thermal Management Memory USB-C* Sub System PCIe* Interface Direct Media Interface and On Package Interface Graphics Display Camera/MIPI Signal Description Electrical Specifications Package Mechanical Specifications CPU And Device IDs
Legal Disclaimer
Revision History
Introduction
Introduction Processor Volatility Statement Package Support Supported Technologies Power Management Support Thermal Management Support Ball-out Information Processor Testability Operating Systems Support Terminology and Special Marks Related Documents
Processor Volatility Statement
Package Support
Supported Technologies
Supported Technologies API Support (Windows*)
API Support (Windows*)
Power Management Support
Power Management Support Processor Core Power Management System Power Management Memory Controller Power Management Processor Graphics Power Management
Processor Core Power Management
System Power Management
Memory Controller Power Management
Processor Graphics Power Management
Thermal Management Support
Ball-out Information
Processor Testability
Operating Systems Support
Terminology and Special Marks
Related Documents
Technologies
Technologies Platform Environmental Control Interface Intel® Virtualization Technology Security Technologies Power and Performance Technologies Intel® Image Processing Unit Debug Technologies Clock Topology Intel Volume Management Device Technology Deprecated Technologies
Platform Environmental Control Interface
Platform Environmental Control Interface PECI Bus Architecture
PECI Bus Architecture
Intel® Virtualization Technology
Intel® Virtualization Technology Intel® VT for Intel® 64 and Intel® Architecture Intel® Virtualization Technology for Directed I/O Intel® APIC Virtualization Technology (Intel® APICv) Hypervisor-Managed Linear Address Translation
Intel® VT for Intel® 64 and Intel® Architecture
Intel® Virtualization Technology for Directed I/O
Intel® APIC Virtualization Technology (Intel® APICv)
Hypervisor-Managed Linear Address Translation
Security Technologies
Security Technologies Intel® Trusted Execution Technology Intel® Advanced Encryption Standard New Instructions Perform Carry-Less Multiplication Quad Word Instruction Intel® Secure Key Execute Disable Bit Boot Guard Technology Intel® Supervisor Mode Execution Protection Intel® Supervisor Mode Access Protection Intel® Secure Hash Algorithm Extensions User Mode Instruction Prevention Read Processor ID Intel® Total Memory Encryption - Multi-Key Intel® Control-flow Enforcement Technology KeyLocker Technology Devil’s Gate Rock
Intel® Trusted Execution Technology
Intel® Advanced Encryption Standard New Instructions
Perform Carry-Less Multiplication Quad Word Instruction
Intel® Secure Key
Execute Disable Bit
Boot Guard Technology
Intel® Supervisor Mode Execution Protection
Intel® Supervisor Mode Access Protection
Intel® Secure Hash Algorithm Extensions
User Mode Instruction Prevention
Read Processor ID
Intel® Total Memory Encryption - Multi-Key
Intel® Control-flow Enforcement Technology
Intel® Control-flow Enforcement Technology Shadow Stack Indirect Branch Tracking
Shadow Stack
Indirect Branch Tracking
KeyLocker Technology
Devil’s Gate Rock
Power and Performance Technologies
Power and Performance Technologies Intel® Smart Cache Technology IA Cores Level 1 and Level 2 Caches Ring Interconnect Intel® Performance Hybrid Architecture Intel® Turbo Boost Max Technology 3.0 Intel® Hyper-Threading Technology Intel® Turbo Boost Technology 2.0 Enhanced Intel SpeedStep® Technology Intel® Thermal Velocity Boost (Intel® TVB) Intel® Speed Shift Technology Intel® Advanced Vector Extensions 2 (Intel® AVX2) Intel® 64 Architecture x2APIC Intel® Dynamic Tuning Technology Intel® GMM and Neural Network Accelerator Cache Line Write Back Remote Action Request User Mode Wait Instructions
Intel® Smart Cache Technology
IA Cores Level 1 and Level 2 Caches
Ring Interconnect
Intel® Performance Hybrid Architecture
Intel® Turbo Boost Max Technology 3.0
Intel® Hyper-Threading Technology
Intel® Turbo Boost Technology 2.0
Intel® Turbo Boost Technology 2.0 Intel® Turbo Boost Technology 2.0 Power Monitoring Intel® Turbo Boost Technology 2.0 Power Control Intel® Turbo Boost Technology 2.0 Frequency
Intel® Turbo Boost Technology 2.0 Power Monitoring
Intel® Turbo Boost Technology 2.0 Power Control
Intel® Turbo Boost Technology 2.0 Frequency
Enhanced Intel SpeedStep® Technology
Intel® Thermal Velocity Boost (Intel® TVB)
Intel® Speed Shift Technology
Intel® Advanced Vector Extensions 2 (Intel® AVX2)
Intel® Advanced Vector Extensions 2 (Intel® AVX2) Intel® AVX2 Vector Neural Network Instructions (AVX2 VNNI)
Intel® AVX2 Vector Neural Network Instructions (AVX2 VNNI)
Intel® 64 Architecture x2APIC
Intel® Dynamic Tuning Technology
Intel® GMM and Neural Network Accelerator
Cache Line Write Back
Remote Action Request
User Mode Wait Instructions
Intel® Image Processing Unit
Platform Imaging Infrastructure Intel® Image Processing Unit
Platform Imaging Infrastructure
Intel® Image Processing Unit
Debug Technologies
Debug Technologies Intel® Processor Trace Platform CrashLog Telemetry Aggregator
Intel® Processor Trace
Platform CrashLog
Telemetry Aggregator
Clock Topology
Clock Topology Integrated Reference Clock PLL
Integrated Reference Clock PLL
Intel Volume Management Device Technology
Deprecated Technologies
Power Management
Power Management Advanced Configuration and Power Interface (ACPI) States Supported Processor IA Core Power Management Processor AUX Power Management Processor Graphics Power Management System Agent Enhanced Intel SpeedStep® Technology Rest Of Platform (ROP) PMIC PCI Express* Power Management TCSS Power State
Advanced Configuration and Power Interface (ACPI) States Supported
Processor IA Core Power Management
Processor IA Core Power Management OS/HW Controlled P-states Low-Power Idle States Requesting the Low-Power Idle States Processor IA Core C-State Rules Package C-States Package C-States and Display Resolutions
OS/HW Controlled P-states
Enhanced Intel SpeedStep® Technology Intel® Speed Shift Technology
Enhanced Intel SpeedStep® Technology
Intel® Speed Shift Technology
Low-Power Idle States
Requesting the Low-Power Idle States
Processor IA Core C-State Rules
Package C-States
Package C-States and Display Resolutions
Processor AUX Power Management
Processor Graphics Power Management
Processor Graphics Power Management Memory Power Savings Technologies Display Power Savings Technologies Processor Graphics Core Power Savings Technologies
Memory Power Savings Technologies
Display Power Savings Technologies
Processor Graphics Core Power Savings Technologies
System Agent Enhanced Intel SpeedStep® Technology
Rest Of Platform (ROP) PMIC
PCI Express* Power Management
TCSS Power State
Thermal Management
Thermal Management Processor Thermal Management Processor Line Thermal and Power Specifications Thermal Profile for PCG 2020 Processor Thermal Metrology Fan Speed Control Scheme with DTS
Processor Thermal Management
Processor Thermal Management Thermal Considerations Assured Power (cTDP) Thermal Management Features Intel® Memory Thermal Management
Thermal Considerations
Thermal Considerations Package Power Control Platform Power Control Turbo Time Parameter (Tau)
Package Power Control
Platform Power Control
Turbo Time Parameter (Tau)
Assured Power (cTDP)
Assured Power (cTDP) Assured Power (cTDP)
Assured Power (cTDP)
Thermal Management Features
Thermal Management Features Adaptive Thermal Monitor Digital Thermal Sensor PROCHOT# Signal PROCHOT Output Only Bi-Directional PROCHOT# PROCHOT Demotion Algorithm Voltage Regulator Protection using PROCHOT# Thermal Solution Design and PROCHOT# Behavior Low-Power States and PROCHOT# Behavior THRMTRIP# Signal Critical Temperature Detection On-Demand Mode MSR Based On-Demand Mode I/O Emulation-Based On-Demand Mode
Adaptive Thermal Monitor
Digital Thermal Sensor
PROCHOT# Signal
PROCHOT Output Only
Bi-Directional PROCHOT#
PROCHOT Demotion Algorithm
Voltage Regulator Protection using PROCHOT#
Thermal Solution Design and PROCHOT# Behavior
Low-Power States and PROCHOT# Behavior
THRMTRIP# Signal
Critical Temperature Detection
On-Demand Mode
MSR Based On-Demand Mode
I/O Emulation-Based On-Demand Mode
Intel® Memory Thermal Management
Processor Line Thermal and Power Specifications
Processor Line Thermal and Power Specifications Processor Line Power and Frequency Specifications Processor Line Thermal and Power
Processor Line Power and Frequency Specifications
Processor Line Thermal and Power
Thermal Profile for PCG 2020 Processor
Thermal Profile for PCG 2020 Processor Thermal Profile for PCG 2022E Processor Thermal Profile for PCG 2020A Processor Thermal Profile for PCG 2020C Processor Thermal Profile for PCG 2020D Processor
Thermal Profile for PCG 2022E Processor
Thermal Profile for PCG 2020A Processor
Thermal Profile for PCG 2020C Processor
Thermal Profile for PCG 2020D Processor
Thermal Metrology
Fan Speed Control Scheme with DTS
Memory
Memory System Memory Interface Integrated Memory Controller (IMC) Power Management
System Memory Interface
System Memory Interface Processor SKU Support Matrix Supported Memory Modules and Devices System Memory Timing Support Memory Controller (MC) Memory Controller Power Gate System Memory Controller Organization Mode (DDR4/5 Only) System Memory Frequency Technology Enhancements of Intel® Fast Memory Access (Intel® FMA) Data Scrambling Data Swapping LPDDR5/x Ascending and Descending LPDDR4x CMD Mirroring DDR I/O Interleaving DRAM Clock Generation DRAM Reference Voltage Generation Data Swizzling Error Correction With Standard RAM Post Package Repair (PPR)
Processor SKU Support Matrix
Supported Memory Modules and Devices
System Memory Timing Support
System Memory Timing Support System Memory Timing Support SAGV Points DDR Frequency Shifting
System Memory Timing Support
SAGV Points
DDR Frequency Shifting
Memory Controller (MC)
Memory Controller Power Gate
System Memory Controller Organization Mode (DDR4/5 Only)
System Memory Frequency
Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)
Data Scrambling
Data Swapping
LPDDR5/x Ascending and Descending
LPDDR4x CMD Mirroring
DDR I/O Interleaving
DRAM Clock Generation
DRAM Reference Voltage Generation
Data Swizzling
Error Correction With Standard RAM
Post Package Repair (PPR)
Integrated Memory Controller (IMC) Power Management
Integrated Memory Controller (IMC) Power Management Disabling Unused System Memory Outputs DRAM Power Management and Initialization DDR Electrical Power Gating Power Training
Disabling Unused System Memory Outputs
DRAM Power Management and Initialization
DRAM Power Management and Initialization Initialization Role of CKE Conditional Self-Refresh Dynamic Power-Down DRAM I/O Power Management
Initialization Role of CKE
Conditional Self-Refresh
Dynamic Power-Down
DRAM I/O Power Management
DDR Electrical Power Gating
Power Training
USB-C* Sub System
USB-C* Sub System General Capabilities USB™ 4 Router USB-C Sub-system xHCI/xDCI Controllers USB-C Sub-System Display Interface
General Capabilities
USB™ 4 Router
USB™ 4 Router USB 4 Host Router Implementation Capabilities
USB 4 Host Router Implementation Capabilities
USB-C Sub-system xHCI/xDCI Controllers
USB-C Sub-system xHCI/xDCI Controllers USB 3 Controllers USB-C Sub-System PCIe Interface
USB 3 Controllers
USB 3 Controllers Extensible Host Controller Interface (xHCI) Extensible Device Controller Interface (xDCI)
Extensible Host Controller Interface (xHCI)
Extensible Device Controller Interface (xDCI)
USB-C Sub-System PCIe Interface
USB-C Sub-System Display Interface
PCIe* Interface
PCIe* Interface Processor PCI Express* Interface
Processor PCI Express* Interface
Processor PCI Express* Interface PCI Express* Support PCI Express* Architecture PCI Express* Configuration Mechanism PCI Express* Equalization Methodology PCI Express* Hot Plug
PCI Express* Support
PCI Express* Architecture
PCI Express* Configuration Mechanism
PCI Express* Equalization Methodology
PCI Express* Hot Plug
Direct Media Interface and On Package Interface
Direct Media Interface (DMI) On Package Interface (OPI)
Direct Media Interface (DMI)
Direct Media Interface (DMI) DMI Lane Reversal and Polarity Inversion DMI Error Flow DMI Link Down
DMI Lane Reversal and Polarity Inversion
DMI Error Flow
DMI Link Down
On Package Interface (OPI)
OPI Support Functional Description
OPI Support
Functional Description
Graphics
Graphics Processor Graphics Platform Graphics Hardware Feature
Processor Graphics
Processor Graphics Media Support (Intel® QuickSync and Clear Video Technology HD)
Media Support (Intel® QuickSync and Clear Video Technology HD)
Media Support (Intel® QuickSync and Clear Video Technology HD) Hardware Accelerated Video Decode Hardware Accelerated Video Encode Hardware Accelerated Video Processing Hardware Accelerated Transcoding
Hardware Accelerated Video Decode
Hardware Accelerated Video Encode
Hardware Accelerated Video Processing
Hardware Accelerated Transcoding
Platform Graphics Hardware Feature
Platform Graphics Hardware Feature Hybrid Graphics
Hybrid Graphics
Display
Display Display Technologies Support Display Configuration Display Features
Display Technologies Support
Display Configuration
Display Features
Display Features General Capabilities Multiple Display Configurations High-bandwidth Digital Content Protection (HDCP) DisplayPort* High-Definition Multimedia Interface (HDMI*) embedded DisplayPort* (eDP*) MIPI* DSI Integrated Audio
General Capabilities
Multiple Display Configurations
High-bandwidth Digital Content Protection (HDCP)
DisplayPort*
DisplayPort* Multi-Stream Transport (MST)
Multi-Stream Transport (MST)
High-Definition Multimedia Interface (HDMI*)
embedded DisplayPort* (eDP*)
MIPI* DSI
Integrated Audio
Camera/MIPI
Camera/MIPI Camera Pipe Support MIPI* CSI-2 Camera Interconnect
Camera Pipe Support
MIPI* CSI-2 Camera Interconnect
MIPI* CSI-2 Camera Interconnect Camera Control Logic Camera Modules CSI-2 Lane Configuration
Camera Control Logic
Camera Modules
CSI-2 Lane Configuration
Signal Description
Signal Description System Memory Interface PCI Express* Graphics (PEG) Signals Direct Media Interface (DMI) Signals Reset and Miscellaneous Signals Display Interfaces USB Type-C Signals MIPI* CSI-2 Interface Signals Processor Clocking Signals Testability Signals Error and Thermal Protection Signals Power Sequencing Signals Processor Power Rails Ground and Reserved Signals Processor Internal Pull-Up / Pull-Down Terminations
System Memory Interface
System Memory Interface DDR4 Memory Interface LP4x-LP5 Memory Interface DDR5 Memory Interface
DDR4 Memory Interface
LP4x-LP5 Memory Interface
DDR5 Memory Interface
PCI Express* Graphics (PEG) Signals
Direct Media Interface (DMI) Signals
Reset and Miscellaneous Signals
Display Interfaces
Display Interfaces Digital Display Interface (DDI) Signals Digital Display Audio Signals
Digital Display Interface (DDI) Signals
Digital Display Audio Signals
USB Type-C Signals
MIPI* CSI-2 Interface Signals
Processor Clocking Signals
Testability Signals
Error and Thermal Protection Signals
Power Sequencing Signals
Processor Power Rails
Ground and Reserved Signals
Processor Internal Pull-Up / Pull-Down Terminations
Electrical Specifications
Electrical Specifications Processor Power Rails DC Specifications
Processor Power Rails
Processor Power Rails Power and Ground Pins Voltage Regulator VCC Voltage Identification (VID)
Power and Ground Pins
Voltage Regulator
VCC Voltage Identification (VID)
DC Specifications
DC Specifications Processor Power Rails DC Specifications Processor Interfaces DC Specifications
Processor Power Rails DC Specifications
Processor Power Rails DC Specifications VCCCORE DC Specifications VccGT DC Specifications VccSA DC Specifications VDD2 DC Specifications VCCANA DC Specifications VCC_MIPILP DC Specifications Vcc1P05_PROC DC Specifications Vcc1P8_PROC DC Specifications
VCCCORE DC Specifications
VccGT DC Specifications
VccSA DC Specifications
VDD2 DC Specifications
VCCANA DC Specifications
VCC_MIPILP DC Specifications
Vcc1P05_PROC DC Specifications
Vcc1P8_PROC DC Specifications
Processor Interfaces DC Specifications
Processor Interfaces DC Specifications DDR4 DC Specifications DDR5 DC Specifications LPDDR4x DC Specification LPDDR5 DC Specification PCI Express* Graphics (PEG) Group DC Specifications Digital Display Interface (DDI) DC Specifications CMOS DC Specifications GTL and OD DC Specification PECI DC Characteristics
DDR4 DC Specifications
DDR5 DC Specifications
LPDDR4x DC Specification
LPDDR5 DC Specification
PCI Express* Graphics (PEG) Group DC Specifications
Digital Display Interface (DDI) DC Specifications
CMOS DC Specifications
GTL and OD DC Specification
PECI DC Characteristics
Package Mechanical Specifications
Package Mechanical Specifications Package Mechanical Attributes Package Storage Specifications
Package Mechanical Attributes
Package Storage Specifications
CPU And Device IDs
CPU And Device IDs CPUID PCI Configuration Header Device IDs
CPUID
PCI Configuration Header
Device IDs
Legal Disclaimer
Revision History
Introduction
Technologies
Power Management
Thermal Management
Memory
USB-C* Sub System
PCIe* Interface
Direct Media Interface and On Package Interface
Graphics
Display
Camera/MIPI
Signal Description
Electrical Specifications
Package Mechanical Specifications
CPU And Device IDs

Supported Memory Modules and Devices

Supported DDR4 Non-ECC SoDIMM Module Configurations (S/H/P/U15-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

A

8 GB

8 Gb

1024M x 8

8

1

16/10

16

8K

A

16 GB

16 Gb

2048M x 8

8

1

17/10

16

8K

C

4 GB

8 Gb

512M x 16

4

1

16/10

8

8K

C

8 GB

16 Gb

1024M x 16

4

1

17/10

8

8K

E

16 GB

8 Gb

1024M x 8

16

2

16/10

16

8K

E

32 GB

16 Gb

2048M x 8

16

2

17/10

16

8K

Supported DDR4 ECC SoDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

D

8 GB

8 Gb

1024M x 8

9

1

16/10

16

8K

D

16 GB

16 Gb

2048M x 8

9

1

17/10

16

8K

G

8 GB

8 Gb

1024M x 8

18

2

16/10

16

8K

G

16 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

F

16 GB

8 Gb

1024M x 8

18

2

16/10

16

8K

F

32 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

Supported DDR4 Non-ECC UDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

A

8 GB

8 Gb

1024M x 8

8

1

16/10

16

8K

A

16 GB

16 Gb

2048M x 8

8

1

17/10

16

8K

C

4 GB

8 Gb

512M x 16

4

1

16/10

8

8K

C

8 GB

16 Gb

1024M x 16

4

1

17/10

8

8K

B

16 GB

8 Gb

1024M x 8

16

2

16/10

16

8K

B

32 GB

16 Gb

2048M x 8

16

2

17/10

16

8K

Supported DDR4 ECC UDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

D

8 GB

8 Gb

1024M x 8

9

1

16/10

16

8K

D

16 GB

16 Gb

2048M x 8

9

1

17/10

16

8K

E

4 GB

8 Gb

1024M x 8

18

2

16/10

16

8K

E

8 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

Supported DDR5 Non-ECC SoDIMM Module Configurations (S/H/P/U15-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

A

16 GB

16 Gb

2048M x 8

8

1

17/10

16

8K

C

8 GB

16 Gb

1024M x 16

4

1

17/10

8

8K

B

32 GB

16 Gb

2048M x 8

16

2

17/10

16

8K

Supported DDR5 ECC SoDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

D

16 GB

16 Gb

2048M x 8

9

1

17/10

16

8K

E

32 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

Supported DDR5 Non-ECC UDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

A

16 GB

16 Gb

2048M x 8

8

1

17/10

16

8K

C

8 GB

16 Gb

1024M x 16

4

1

17/10

8

8K

B

32 GB

16 Gb

2048M x 8

16

2

17/10

16

8K

Supported DDR5 ECC UDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

D

16 GB

16 Gb

2048M x 8

9

1

17/10

16

8K

E

32 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

Supported DDR4 Memory Down Device Configurations (H/P /U15 Processor Line)

Maximum System Capacity3

PKG Type

(Die bits x Package bits)

DRAM Organization / Package Type

Package Density

Die Density

Dies Per Channel

Rank Per Channel

PKGs Per Channel

Physical Device Rank

Banks Inside DRAM

Page Size

32 GB

SDP 8x8

1024M x 8

8 Gb

8 Gb

16

2

16

1

16

8K

64 GB

SDP 8x8

2048M x 8

16 Gb

16 Gb

16

2

16

1

16

8K

8 GB

SDP 16x16

512M x 16

8 Gb

8 Gb

4

1

4

1

8

8K

16 GB1

SDP 16x16

1024M x 16

16 Gb

16 Gb

4

1

4

1

8

8K

16 GB

DDP 8x16

1024M x 16

16 Gb

8 Gb

8

1

4

1

16

8K

32 GB2

DDP 8x16 2048M x 16 32 Gb 16 Gb 8 1 4 1 16 8K
Notes:
  1. For SDP: 1Rx16 using 16 GB die density - the maximum system capacity is 16 GB
  2. For DDP: 1Rx16 using 16 GB die density - the maximum system capacity is 32 GB.
  3. Maximum system capacity refer to system with 2 channels populated

Supported DDR5 Memory Down Device Configurations (H/P/U15 Processor Line)

Maximum System Capacity3

PKG Type

(Die bits x Package bits)

DRAM Organization / Package Type

Package Density

Die Density

Dies Per Channel

Rank Per Channel

PKGs Per channel

Physical Device Rank

Banks Inside DRAM

Page Size

32 GB

SDP 8x8

2048M x 8

16 Gb

16 Gb

8

1

8

1

16

8K

16 GB1

SDP 16x16

1024M x 16

16 Gb

16 Gb

4

1

4

1

8

8K

Notes:
  1. For SDP: 1Rx16 using 16 GB die density - the maximum system capacity is 16 GB
  2. Maximum system capacity, refer to system with 2 channels populated

Supported LPDDR4x x32 DRAMs Configurations (H/P/U Processor Line) 

Maximum System Capacity4

PKG Type

(Die bits per Ch x PKG bits)2

Die Density

PKG Density

Rank Per PKGs

8 GB

DDP

16x32

8 Gb

16 Gb

1

16 GB

QDP

16x32

8 Gb

32 Gb

2

32 GB

ODP

16x32(Byte mode)

8 Gb

64 Gb

2

16 GB

QDP

16x32

16 Gb

32 Gb

1

32 GB

ODP

16x32

16 Gb

64 Gb

2

Notes:
  1. x32 BGA devices are 200 balls
  2. QDP = Quad Die Package, ODP-Octal Die Package
  3. Each LPDDR4x channel include two sub-channels
  4. Maximum system capacity refers to system with all 8 sub channels populated

Supported LPDDR4x x64 DRAMs Configurations (H/P/U Processor Line) 

Maximum System Capacity3

PKG Type

(Die bits per Ch x PKG bits)

Die Density

Ball Count Per PKG PKG Density

DRAM

Channels Per PKGs

Processor Line Rank Per PKGs

8 GB

QDP 16x64 8 Gb 432 32 Gb 4 H/P/U 1

16 GB

ODP 16x64 8 Gb 432 64 Gb 4 H/P/U 2

16 GB

QDP 16x64 16 Gb 432 64 Gb 4 H/P/U 2

8 GB

QDP 16x64 8 Gb 556 32 Gb 4 U9 1

16 GB

ODP 16x64 8 Gb 556 64 Gb 4 U9 2

16 GB

QDP 16x64 16 Gb 556 64 Gb 4 U9 2
Notes:

  1. QDP = Quad Die Package, ODP-Octal Die Package

  2. Each LPDDR4x channel include two sub-channels

  3. Maximum system capacity refers to system with all 8 sub-channels populated

Supported LPDDR5/x x32 DRAMs Configurations6 (H/P/U Processor Line) 

Maximum System Capacity4

PKG Type

(Die bits per Ch x PKG bits)2

Die Density

PKG Density

Rank Per PKGs

12 GB5

DDP

16x32

12 Gb

24 Gb

1

24 GB5

QDP

16x32

12 Gb

48 Gb

2

16 GB

DDP

16x32

16 Gb

32 Gb

1

32 GB

QDP

16x32

16 Gb

64 Gb

2

64 GB5

ODP

16x32

16 Gb

128 Gb

2

8 GB

DDP

16x32

8 Gb

16 Gb

1

16 GB

QDP

16x32

8 Gb

32 Gb

2

32 GB

ODP

16x32

8 Gb

64 Gb

2

Notes:
  1. x32 BGA devices are 315 balls
  2. QDP = Quad Die Package, ODP-Octal Die Package
  3. Each LPDDR5 channel include two sub-channels
  4. Maximum system capacity refers to system with all 8 sub channels populated
  5. Pending DRAM samples availability.
  6. LPDDR5x supported with 1a node only.

Supported LPDDR5/x x64 DRAMs Configurations 4(H/P/U Processor Line) 

Maximum System Capacity3

PKG Type

(Die bits per Ch x PKG bits)

Die Density

PKG Density

DRAM

Channels Per PKGs

Rank Per PKGs

16 GB

QDP

16x64

16 Gb

64 Gb

4

1

32 GB

ODP

16x64

16 Gb

128 Gb

4

2

8 GB

QDP

16x64

8 Gb

32 Gb

4

1

16 GB

ODP

16x64

8 Gb

64 Gb

4

2

Notes:
  1. QDP = Quad Die Package, ODP-Octal Die Package
  2. Each LPDDR5 channel include two sub-channels
  3. Maximum system capacity refers to system with all 8 sub-channels populated
  4. LPDDR5x supported with 1a node only.
System Memory Timing Support