Intel® Processor and Intel® Core™ i3 and Intel® Core™ 3 N-Series

Datasheet, Volume 1 of 2

ID Date Version Classification
759603 01/07/2025 Public
Document Table of Contents

Package Mechanical Attributes

The N-series Processor Lines use a Flip Chip technology available in a Ball Grid Array (BGA) package. The following table provides an overview of the package mechanical attributes. For specific dimensions (die size, die location, and so on), refer to the processor package mechanical drawings.

Package Mechanical Attributes

Package

Parameter

Processor Line

Package Technology

Package Type

Flip Chip Ball Grid Array

Interconnect

Ball Grid Array (BGA)

Lead Free

Yes

Halogenated Flame Retardant Free

Yes

Package Configuration

Solder Ball Composition

SAC405

Ball/Pin Count

1264

Grid Array Pattern

Balls anywhere

Land Side Capacitors

Yes

Die Side Capacitors

No

Die Configuration

2 Dice Multi Chip package (MCP)

Package Dimensions

Nominal Package Size

24 x 35 mm2

Z

Substrate Z = 0.809+/-0.095 mm

1.386+/-0.109mm (Pre-SMT Z-height)

Minimum Ball/Pin pitch

0.62 mm BP