Introduction

Intel® Core™ Ultra 200S, Intel® Core™ Ultra 200S Plus ,Intel® Core™ Ultra 200HX and 200HX Plus Series Processors

Datasheet, Volume 1 of 2

ID	Date	Version	Classification
832586	03/17/2026		Public

This document is intended for Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODM) and BIOS vendors creating products based on the Intel^® Core™ Ultra 200S/200HX/200S Plus/200HX PLUS Series Processors.

Intel® Core™ Ultra Processors includes the Intel® Performance Hybrid architecture, P-Cores for performance, and E-Cores for Efficiency. Refer to Table: Processor Series for availability in Intel processor lines. For more details on P-Core and E-Core, refer to Power Management.

This document assumes a working knowledge of the vocabulary and principles of interfaces and architectures such as PCI Express* (PCIe*), Universal Serial Bus (USB), Advance Host Controller Interface (AHCI), eXtensible Host Controller Interface (xHCI), and so on.

This document abbreviates buses as Bn, devices as Dn and functions as Fn. For example, Device 31 Function 0 is abbreviated as D31:F0, Bus 1 Device 8 Function 0 is abbreviated as B1:D8:F0. Generally, the bus number will not be used, and can be considered to be Bus 0.

The S/HX-Processor Line is offered in a 2-Chip Platform that includes the Processor Chip and Platform Controller Hub (PCH-S) Chip in LGA and BGA Package.

The S/HX-Plus Processor Line offered in a 2-Chip Platform that includes the Processor Die and Platform Controller Hub (PCH-S) die in LGA Package.

Naming Convention in this document:

S-Processor refers to Intel^® Core™ Ultra 200S Series processors.

HX-Processor refers to Intel^® Core™ Ultra 200HX Series processors.

S-Plus refers to the Intel^® Core™ Ultra 200S Plus Processor line.

HX-Plus refers to the Intel^® Core™ Ultra 200HX Plus Processor Line.

The S-Processor is based on the disaggregated architecture.

The following table describes the different processor series:

Processor Series

Processor Line¹	Package	Processor Base Power^{3, 4}	Processor Max P-cores²	Processor Max E-cores²	Graphics Configuration Max X^e-cores²	Platform Type
S-Processor	LGA1851	125 W	8	16	4	2-Chip
	LGA1851	65 W	6	8	4	2-Chip
	LGA1851	35 W	6	8	4	2-Chip
S-Plus Processor	LGA1851	125W	8	16	4	2-Chip
S-Plus Processor	LGA1851	125W	6	12	4	2-Chip
HX-Processor	BGA2114	55 W	8	16	4	2-Chip
	BGA2114	55 W	8	12	4	2-Chip
	BGA2114	55 W	6	8	3	2-Chip
HX-Plus Processor	BGA2114	55 W	8	16	4	2-Chip
HX-Plus Processor	BGA2114	55 W	8	12	4	2-Chip
Notes: Processor lines offering may change. Core count refers to native die with maximum physical cores. Some SKU may have reduced functional cores. For additional Processor Base Power Configurations, refer to Processor Line Thermal and Power Specifications, for adjustment to the Processor Base Power required to preserve base frequency associated with the sustained long-term thermal capability. Processor Base Power workload does not reflect I/O connectivity cases such as Thunderbolt, for power adders estimation for various I/O connectivity scenarios:

S/S-Plus LGA Processor Line Platform Diagram

HX/HX-Plus Processor Line Platform Diagram

Note:

Not all processor interfaces and features are presented in all Processor Lines. The presence of various interfaces and features will be indicated within the relevant sections and tables.