Intel® Core™ Ultra 200V Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
829568 05/27/2025 004 Confidential
Document Table of Contents

Package Dimensions

Intel® Core™ Ultra 200V Series Processor is available in the following package

  • BGA 2833
  • A 27.5 X 27 mm
  • Substrate Z-height = 0.584 mm +/- 0.08 mm
  • Total Package Z-height (Bottom of BGA to top of DRAM) = 1.34mm +/- 0.096 (16 GB: 2 x 8GB DRAM) / 1.58mm +/- 0.096 (32GB: 2 x 16GB DRAM)

The Intel® Core™ Ultra 200V Series Processor is required low temperature solder process.

For more details, refer to Package Mechanical Specifications.