13th Generation Intel® Core™ and Intel® Core™ 14th Generation Processors

Datasheet, Volume 1 of 2
Supporting 13th Generation Intel® Core™ Processor for S, H, P, HX, and U Processor Line Platforms, formerly known as Raptor Lake, Intel® Core™ 14th Generation Processor for S, HX, and U Processor Line Platform, formerly known as Raptor Lake Refresh and Intel® Xeon™ E 2400 Processor, formerly known As Raptor Lake–E

ID 743844
Date 03/25/2024
Document Table of Contents
Document Table of Contents
Legal Disclaimer Revision History Introduction Technologies Power Management Thermal Management Memory USB-C* Sub System PCIe* Interface Direct Media Interface and On Package Interface Graphics Display Camera/MIPI Signal Description Electrical Specifications Package Mechanical Specifications CPU And Device IDs
Legal Disclaimer
Revision History
Introduction
Introduction Processor Volatility Statement Package Support Supported Technologies Power Management Support Thermal Management Support Ball-out Information Processor Testability Operating Systems Support Terminology and Special Marks Related Documents
Processor Volatility Statement
Package Support
Supported Technologies
Supported Technologies API Support (Windows*)
API Support (Windows*)
Power Management Support
Power Management Support Processor Core Power Management System Power Management Memory Controller Power Management Processor Graphics Power Management
Processor Core Power Management
System Power Management
Memory Controller Power Management
Processor Graphics Power Management
Thermal Management Support
Ball-out Information
Processor Testability
Operating Systems Support
Terminology and Special Marks
Related Documents
Technologies
Technologies Platform Environmental Control Interface Intel® Virtualization Technology Security Technologies Power and Performance Technologies Intel® Image Processing Unit Debug Technologies Clock Topology Intel Volume Management Device Technology Deprecated Technologies
Platform Environmental Control Interface
Platform Environmental Control Interface PECI Bus Architecture
PECI Bus Architecture
Intel® Virtualization Technology
Intel® Virtualization Technology Intel® VT for Intel® 64 and Intel® Architecture Intel® Virtualization Technology for Directed I/O Intel® APIC Virtualization Technology (Intel® APICv) Hypervisor-Managed Linear Address Translation
Intel® VT for Intel® 64 and Intel® Architecture
Intel® Virtualization Technology for Directed I/O
Intel® APIC Virtualization Technology (Intel® APICv)
Hypervisor-Managed Linear Address Translation
Security Technologies
Security Technologies Intel® Trusted Execution Technology Intel® Advanced Encryption Standard New Instructions Perform Carry-Less Multiplication Quad Word Instruction Intel® Secure Key Execute Disable Bit Boot Guard Technology Intel® Supervisor Mode Execution Protection Intel® Supervisor Mode Access Protection Intel® Secure Hash Algorithm Extensions User Mode Instruction Prevention Read Processor ID Intel® Total Memory Encryption - Multi-Key Intel® Control-flow Enforcement Technology KeyLocker Technology Devil’s Gate Rock
Intel® Trusted Execution Technology
Intel® Advanced Encryption Standard New Instructions
Perform Carry-Less Multiplication Quad Word Instruction
Intel® Secure Key
Execute Disable Bit
Boot Guard Technology
Intel® Supervisor Mode Execution Protection
Intel® Supervisor Mode Access Protection
Intel® Secure Hash Algorithm Extensions
User Mode Instruction Prevention
Read Processor ID
Intel® Total Memory Encryption - Multi-Key
Intel® Control-flow Enforcement Technology
Intel® Control-flow Enforcement Technology Shadow Stack Indirect Branch Tracking
Shadow Stack
Indirect Branch Tracking
KeyLocker Technology
Devil’s Gate Rock
Power and Performance Technologies
Power and Performance Technologies Intel® Smart Cache Technology IA Cores Level 1 and Level 2 Caches Ring Interconnect Intel® Performance Hybrid Architecture Intel® Turbo Boost Max Technology 3.0 Power Aware Interrupt Routing (PAIR) Intel® Hyper-Threading Technology Intel® Turbo Boost Technology 2.0 Enhanced Intel SpeedStep® Technology Intel® Thermal Velocity Boost (Intel® TVB) Intel® Speed Shift Technology Intel® Advanced Vector Extensions 2 (Intel® AVX2) Intel® 64 Architecture x2APIC Intel® Dynamic Tuning Technology Intel® GMM and Neural Network Accelerator Cache Line Write Back Remote Action Request User Mode Wait Instructions Intel® Adaptive Boost Technology
Intel® Smart Cache Technology
IA Cores Level 1 and Level 2 Caches
Ring Interconnect
Intel® Performance Hybrid Architecture
Intel® Turbo Boost Max Technology 3.0
Power Aware Interrupt Routing (PAIR)
Intel® Hyper-Threading Technology
Intel® Turbo Boost Technology 2.0
Intel® Turbo Boost Technology 2.0 Intel® Turbo Boost Technology 2.0 Frequency Intel® Turbo Boost Technology 2.0 Power Control Intel® Turbo Boost Technology 2.0 Power Monitoring
Intel® Turbo Boost Technology 2.0 Frequency
Intel® Turbo Boost Technology 2.0 Power Control
Intel® Turbo Boost Technology 2.0 Power Monitoring
Enhanced Intel SpeedStep® Technology
Intel® Thermal Velocity Boost (Intel® TVB)
Intel® Speed Shift Technology
Intel® Advanced Vector Extensions 2 (Intel® AVX2)
Intel® Advanced Vector Extensions 2 (Intel® AVX2) Intel® AVX2 Vector Neural Network Instructions (AVX2 VNNI)
Intel® AVX2 Vector Neural Network Instructions (AVX2 VNNI)
Intel® 64 Architecture x2APIC
Intel® Dynamic Tuning Technology
Intel® GMM and Neural Network Accelerator
Cache Line Write Back
Remote Action Request
User Mode Wait Instructions
Intel® Adaptive Boost Technology
Intel® Image Processing Unit
Platform Imaging Infrastructure Intel® Image Processing Unit
Platform Imaging Infrastructure
Intel® Image Processing Unit
Debug Technologies
Debug Technologies Intel® Processor Trace Platform CrashLog Telemetry Aggregator
Intel® Processor Trace
Platform CrashLog
Telemetry Aggregator
Clock Topology
Clock Topology Integrated Reference Clock PLL
Integrated Reference Clock PLL
Intel Volume Management Device Technology
Deprecated Technologies
Power Management
Power Management Advanced Configuration and Power Interface (ACPI) States Supported Processor IA Core Power Management Processor AUX Power Management Processor Graphics Power Management System Agent Enhanced Intel SpeedStep® Technology Rest Of Platform (ROP) PMIC PCI Express* Power Management TCSS Power State
Advanced Configuration and Power Interface (ACPI) States Supported
Processor IA Core Power Management
Processor IA Core Power Management OS/HW Controlled P-states Low-Power Idle States Requesting the Low-Power Idle States Processor IA Core C-State Rules Package C-States Package C-States and Display Resolutions
OS/HW Controlled P-states
Enhanced Intel SpeedStep® Technology Intel® Speed Shift Technology
Enhanced Intel SpeedStep® Technology
Intel® Speed Shift Technology
Low-Power Idle States
Requesting the Low-Power Idle States
Processor IA Core C-State Rules
Package C-States
Package C-States and Display Resolutions
Processor AUX Power Management
Processor Graphics Power Management
Processor Graphics Power Management Memory Power Savings Technologies Display Power Savings Technologies Processor Graphics Core Power Savings Technologies
Memory Power Savings Technologies
Display Power Savings Technologies
Processor Graphics Core Power Savings Technologies
System Agent Enhanced Intel SpeedStep® Technology
Rest Of Platform (ROP) PMIC
PCI Express* Power Management
TCSS Power State
Thermal Management
Thermal Management Processor Thermal Management General Notes Processor Line Power and Frequency Specifications Processor Line Thermal and Power Specifications
Processor Thermal Management
Processor Thermal Management Thermal Considerations Assured Power (cTDP) Thermal Management Features Intel® Memory Thermal Management
Thermal Considerations
Thermal Considerations Package Power Control Platform Power Control Turbo Time Parameter (Tau)
Package Power Control
Platform Power Control
Turbo Time Parameter (Tau)
Assured Power (cTDP)
Assured Power (cTDP) Assured Power (cTDP)
Assured Power (cTDP)
Thermal Management Features
Thermal Management Features Adaptive Thermal Monitor Digital Thermal Sensor PROCHOT# Signal PROCHOT Output Only Bi-Directional PROCHOT# PROCHOT Demotion Algorithm Voltage Regulator Protection using PROCHOT# Thermal Solution Design and PROCHOT# Behavior Low-Power States and PROCHOT# Behavior THRMTRIP# Signal Critical Temperature Detection On-Demand Mode MSR Based On-Demand Mode I/O Emulation-Based On-Demand Mode
Adaptive Thermal Monitor
Digital Thermal Sensor
PROCHOT# Signal
PROCHOT Output Only
Bi-Directional PROCHOT#
PROCHOT Demotion Algorithm
Voltage Regulator Protection using PROCHOT#
Thermal Solution Design and PROCHOT# Behavior
Low-Power States and PROCHOT# Behavior
THRMTRIP# Signal
Critical Temperature Detection
On-Demand Mode
MSR Based On-Demand Mode
I/O Emulation-Based On-Demand Mode
Intel® Memory Thermal Management
General Notes
Processor Line Power and Frequency Specifications
Processor Line Thermal and Power Specifications
Memory
Memory System Memory Interface Integrated Memory Controller (IMC) Power Management
System Memory Interface
System Memory Interface Processor SKU Support Matrix Supported Memory Modules and Devices System Memory Timing Support Memory Controller (MC) Memory Controller Power Gate System Memory Controller Organization Mode (DDR4/5 Only) System Memory Frequency Technology Enhancements of Intel® FMA Data Scrambling ECC H-Matrix Syndrome Codes Data Swapping LPDDR5/x Ascending and Descending LPDDR4x CMD Mirroring DDR I/O Interleaving DRAM Clock Generation DRAM Reference Voltage Generation Data Swizzling Error Correction With Standard RAM Post Package Repair Refresh Management (RFM)
Processor SKU Support Matrix
Supported Memory Modules and Devices
System Memory Timing Support
System Memory Timing Support System Memory Timing Support SAGV Points DDR Frequency Shifting
System Memory Timing Support
SAGV Points
DDR Frequency Shifting
Memory Controller (MC)
Memory Controller Power Gate
System Memory Controller Organization Mode (DDR4/5 Only)
System Memory Frequency
Technology Enhancements of Intel® FMA
Data Scrambling
ECC H-Matrix Syndrome Codes
Data Swapping
LPDDR5/x Ascending and Descending
LPDDR4x CMD Mirroring
DDR I/O Interleaving
DRAM Clock Generation
DRAM Reference Voltage Generation
Data Swizzling
Error Correction With Standard RAM
Post Package Repair
Refresh Management (RFM)
Integrated Memory Controller (IMC) Power Management
Integrated Memory Controller (IMC) Power Management Disabling Unused System Memory Outputs DRAM Power Management and Initialization DDR Electrical Power Gating Power Training
Disabling Unused System Memory Outputs
DRAM Power Management and Initialization
DRAM Power Management and Initialization Initialization Role of CKE Conditional Self-Refresh Dynamic Power-Down DRAM I/O Power Management
Initialization Role of CKE
Conditional Self-Refresh
Dynamic Power-Down
DRAM I/O Power Management
DDR Electrical Power Gating
Power Training
USB-C* Sub System
USB-C* Sub System General Capabilities USB* 4 Router USB-C Sub-system xHCI/xDCI Controllers USB-C Sub-System Display Interface
General Capabilities
USB* 4 Router
USB* 4 Router USB 4 Host Router Implementation Capabilities
USB 4 Host Router Implementation Capabilities
USB-C Sub-system xHCI/xDCI Controllers
USB-C Sub-system xHCI/xDCI Controllers USB 3 Controllers USB-C Sub-System PCIe Interface
USB 3 Controllers
USB-C Sub-System PCIe Interface
USB-C Sub-System Display Interface
PCIe* Interface
PCIe* Interface Processor PCI Express* Interface
Processor PCI Express* Interface
Processor PCI Express* Interface PCI Express* Support PCI Express* Architecture PCI Express* Configuration Mechanism PCI Express* Equalization Methodology PCI Express* Hot Plug
PCI Express* Support
PCI Express* Architecture
PCI Express* Configuration Mechanism
PCI Express* Equalization Methodology
PCI Express* Hot Plug
Direct Media Interface and On Package Interface
Direct Media Interface (DMI) On Package Interface (OPI)
Direct Media Interface (DMI)
Direct Media Interface (DMI) DMI Error Flow DMI Link Down
DMI Error Flow
DMI Link Down
On Package Interface (OPI)
OPI Support Functional Description
OPI Support
Functional Description
Graphics
Graphics Processor Graphics
Processor Graphics
Processor Graphics Media Support (Intel® QuickSync and Clear Video Technology HD) Platform Graphics Hardware Feature
Media Support (Intel® QuickSync and Clear Video Technology HD)
Media Support (Intel® QuickSync and Clear Video Technology HD) Hardware Accelerated Video Decode Hardware Accelerated Video Encode Hardware Accelerated Video Processing Hardware Accelerated Transcoding
Hardware Accelerated Video Decode
Hardware Accelerated Video Encode
Hardware Accelerated Video Processing
Hardware Accelerated Transcoding
Platform Graphics Hardware Feature
Platform Graphics Hardware Feature Hybrid Graphics
Hybrid Graphics
Display
Display Display Technologies Support Display Configuration Display Features
Display Technologies Support
Display Configuration
Display Features
Display Features General Capabilities Multiple Display Configurations High-bandwidth Digital Content Protection (HDCP) DisplayPort* High-Definition Multimedia Interface (HDMI*) embedded DisplayPort* (eDP*) MIPI* DSI Integrated Audio
General Capabilities
Multiple Display Configurations
High-bandwidth Digital Content Protection (HDCP)
DisplayPort*
DisplayPort* Multi-Stream Transport (MST)
Multi-Stream Transport (MST)
High-Definition Multimedia Interface (HDMI*)
embedded DisplayPort* (eDP*)
MIPI* DSI
Integrated Audio
Camera/MIPI
Camera/MIPI Camera Pipe Support MIPI* CSI-2 Camera Interconnect
Camera Pipe Support
MIPI* CSI-2 Camera Interconnect
MIPI* CSI-2 Camera Interconnect Camera Control Logic Camera Modules CSI-2 Lane Configurations
Camera Control Logic
Camera Modules
CSI-2 Lane Configurations
Signal Description
Signal Description System Memory Interface PCI Express* Graphics (PEG) Signals Direct Media Interface (DMI) Signals Reset and Miscellaneous Signals Display Interfaces USB Type-C Signals MIPI CSI 2 Interface Signals Processor Clocking Signals Testability and Monitoring Signals Error and Thermal Protection Signals Processor Power Rails Ground and Reserved Signals Processor Internal Pull-Up / Pull- Down on Package
System Memory Interface
System Memory Interface DDR4 Memory Interface LP4x-LP5 Memory Interface DDR5 Memory Interface
DDR4 Memory Interface
LP4x-LP5 Memory Interface
DDR5 Memory Interface
PCI Express* Graphics (PEG) Signals
Direct Media Interface (DMI) Signals
Reset and Miscellaneous Signals
Display Interfaces
Display Interfaces Digital Display Interface (DDI) Signals Digital Display Audio Signals
Digital Display Interface (DDI) Signals
Digital Display Audio Signals
USB Type-C Signals
MIPI CSI 2 Interface Signals
Processor Clocking Signals
Testability and Monitoring Signals
Error and Thermal Protection Signals
Processor Power Rails
Ground and Reserved Signals
Processor Internal Pull-Up / Pull- Down on Package
Electrical Specifications
Electrical Specifications Power Delivery DC Specifications
Power Delivery
Power Delivery Power and Ground Pins Digital Linear Voltage Regulator (DLVR) VCC Voltage Identification (VID) Fast V-Mode Current Excursion Protection (CEP)
Power and Ground Pins
Digital Linear Voltage Regulator (DLVR)
VCC Voltage Identification (VID)
Fast V-Mode
Current Excursion Protection (CEP)
DC Specifications
DC Specifications Processor Power Rails DC Specifications Processor Interfaces DC Specifications
Processor Power Rails DC Specifications
Processor Power Rails DC Specifications VCCCORE DC Specifications VccGT DC Specifications VDD2 DC Specifications Vcc1P05_PROC DC Specifications Vcc1P8_PROC DC Specifications
VCCCORE DC Specifications
VccGT DC Specifications
VDD2 DC Specifications
Vcc1P05_PROC DC Specifications
Vcc1P8_PROC DC Specifications
Processor Interfaces DC Specifications
Processor Interfaces DC Specifications DDR4 DC Specifications DDR5 DC Specifications LPDDR4x DC Specification LPDDR5/x DC Specification PCIe* DC and Timing Specifications PCI Express* Graphics (PEG) Group DC Specifications Digital Display Interface (DDI) DC Specifications CMOS DC Specifications GTL and OD DC Specification PECI DC Characteristics
DDR4 DC Specifications
DDR5 DC Specifications
LPDDR4x DC Specification
LPDDR5/x DC Specification
PCIe* DC and Timing Specifications
PCI Express* Graphics (PEG) Group DC Specifications
Digital Display Interface (DDI) DC Specifications
CMOS DC Specifications
GTL and OD DC Specification
PECI DC Characteristics
Package Mechanical Specifications
Package Mechanical Specifications Package Mechanical Attributes Package Storage Specifications
Package Mechanical Attributes
Package Storage Specifications
CPU And Device IDs
CPU And Device IDs CPUID PCI Configuration Header Device IDs
CPUID
PCI Configuration Header
Device IDs
Legal Disclaimer
Revision History
Introduction
Technologies
Power Management
Thermal Management
Memory
USB-C* Sub System
PCIe* Interface
Direct Media Interface and On Package Interface
Graphics
Display
Camera/MIPI
Signal Description
Electrical Specifications
Package Mechanical Specifications
CPU And Device IDs

VCCCORE DC Specifications

Processor VCCCORE Active and Idle Mode DC Voltage and Current Specifications (S and S-Refresh Processor Line)

Symbol

Parameter

Segment

Minimum

Typical

Maximum

Unit

Note1

Operating Voltage

Voltage Range for Processor Operating Mode

S/S Refresh - Processor Line

0

—

1.72

V

1,2,3, 7,12,15

IccMAX

(S/S Refresh Processor)

Maximum Processor

ICC

S/S Refresh-Processor Line (150W)

8P+16E Core

—

—

307

A

4,5,6,7,11

IccMAX.App

(S/S Refresh Processor)

Maximum Processor

ICC .app

S/S Refresh-Processor Line (150W)

8P+16E Core

—

—

245

A

4,5,6,7,11

IccMAX

(S/S Refresh Processor)

Maximum Processor

ICC

S/S Refresh-Processor Line (150W)

8P+16E Core

Extreme Config

—

—

400

A

4,5,6,7,11,17

IccMAX.App

(S/S Refresh Processor)

Maximum Processor

ICC .app

S/S Refresh-Processor Line (150W)

8P+16E Core

Extreme Config

—

—

320

A

4,5,6,7,11,17

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (125W)

8P+16E/

8P+8E Core

—

—

307

A

4,5,6,7,11

IccMAX.App

(S Processor)

Maximum Processor

ICC .app

S-Processor Line (125W)

8P+16E/

8P+8E Core

—

—

245

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S Refresh-Processor Line (125W)

8P+16E/

8P+12E Core

307 A

IccMAX.App

(S Refresh Processor)

Maximum Processor

ICC .app

S Refresh -Processor Line (125W)

8P+16E/

8P+12E Core

245 A

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (125W)

8P+16E

Core

Extreme Config

—

—

400

A

4,5,6,7,11,17

IccMAX.App

(S Processor)

Maximum Processor

ICC .app

S-Processor Line (125W)

8P+16E

Core

Extreme Config

—

—

320

A

4,5,6,7,11,17

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (125W)

6P+8E

Core

—

—

200

A

4,5,6,7,11

IccMAX.App

(S Processor)

Maximum Processor

ICC .app

S-Processor Line (125W)

6P+8E

Core

—

—

170

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S Refresh-Processor Line (125W)

6P+8E

Core

—

—

200

A

4,5,6,7,11

IccMAX.App

(S Refresh Processor)

Maximum Processor

ICC .app

S Refresh-Processor Line (125W)

6P+8E

Core

—

—

170

A

4,5,6,7,11

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (65W)

8P+16E/

8P+8E Core

—

—

279

A

4,5,6,7,11

IccMAX.App

(S Processor)

Maximum Processor

ICC .app

S-Processor Line (65W)

8P+16E/

8P+8E Core

—

—

231

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S Refresh-Processor Line (65W)

8P+16E/

8P+12E Core

—

—

279

A

4,5,6,7,11

IccMAX.App

(S Refresh Processor)

Maximum Processor

ICC .app

S Refresh-Processor Line (65W)

8P+16E/

8P+12E Core

—

—

231

A

4,5,6,7,11

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (65W)

6P+8E Core

—

—

160

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S-Processor Line (65W)

6P+8E Core

160 A

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (65W)

6P+4E Core

—

—

140

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S-Processor Line (65W)

6P+4E Core

140 A

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (65W)

6P+0E Core

—

—

151

A

4,5,6,7,11

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (60W/58W)

4P+0E Core

—

—

126

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S-Processor Line (60W/58W)

4P+0E Core

120 A

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (35W)

8P+16E/

8P+8E Core

—

—

165

A

4,5,6,7,11

IccMAX.App

(S Processor)

Maximum Processor

ICC .app

S-Processor Line (35W)

8P+16E/

8P+8E Core

—

—

140

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S Refresh-Processor Line (35W)

8P+16E/

8P+12E Core

—

—

165

A

4,5,6,7,11

IccMAX.App

(S Refresh Processor)

Maximum Processor

ICC .app

S Refresh-Processor Line (35W)

8P+16E/

8P+12E Core

—

—

140

A

4,5,6,7,11

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (35W)

6P+8E Core

—

—

120

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S Refresh -Processor Line (35W)

6P+8E Core

—

—

120

A

4,5,6,7,11

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (35W)

6P+4E Core

—

—

100

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S Refresh -Processor Line (35W)

6P+4E Core

100

A

4,5,6,7,11

IccMAX

(S Processor)

Maximum Processor

ICC

S-Processor Line (35W)

4P+0E Core

—

—

92

A

4,5,6,7,11

IccMAX

(S Refresh Processor)

Maximum Processor

ICC

S Refresh -Processor Line (35W)

4P+0E Core

92

A

4,5,6,7,11

IccTDC

Thermal Design Current (TDC) for processor VccCORE Rail

—

—

—

VR_​TDC

A

9

TOBVCC

Voltage Tolerance

PS0, PS1 ,PS2, PS3

—

—

±20

mV

3, 6, 8

TOBVCC+Ripple

Ripple Tolerance

PS0, PS1, PS2, PS3

—

—

-35 /+50

mV

3, 6, 8,16

DC_​LL

Loadline slope within the VR regulation loop capability

S/S Refresh - Processor Line

(65W,125W)

0

—

1.1

mΩ

10,13,14

DC_​LL

Loadline slope within the VR regulation loop capability

S/S Refresh -Processor Line

( 35W)

0

—

1.7

mΩ

10,13,14
AC_​LL AC Loadline 3 S/S Refresh Processor Line

—

—

Same as DC LL

mΩ

10,13,14

V_​OVS

TDP_​MAX/virus_​MAX

Maximum Overshoot at TDP/virus mode

All Processor Lines

—

—

10

%

T_​OVS_​TDP_​MAX Maximum Overshoot at TDP/virus mode

All Processor Lines

—

—

500

us

Notes:
  1. All specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date.
  2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel Speed-step Technology, or low-power states).
  3. The voltage specification requirements are measured across Vcc_​SENSE and Vss_​SENSE as near as possible to the processor. The measurement needs to be performed with a 20MHz bandwidth limit on the oscilloscope, 1.5pF maximum probe capacitance, and 1Ω minimum impedance. The maximum length of the ground wire on the probe should be less than 5mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
  4. Processor VccCORE VR to be designed to electrically support this current.
  5. Processor VccCORE VR to be designed to thermally support this current indefinitely.
  6. Long term reliability cannot be assured if tolerance, ripple, and core noise parameters are violated.
  7. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
  8. PSx refers to the voltage regulator power state as set by the SVID protocol.
  9. Refer to Intel Platform Design Studio (iPDS) for the minimum, typical, and maximum VCC allowed for a given current and Thermal Design Current (TDC).
  10. LL measured at sense points.
  11. Typical column represents IccMAX for commercial application it is NOT a specification - it's a characterization of limited samples using limited set of benchmarks that can be exceeded.
  12. Operating voltage range in steady state.
  13. LL spec values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
  14. Load Line (AC/DC) should be measured by the VRTT tool and programmed accordingly via the BIOS Load Line override setup options. AC/DC Load Line BIOS programming directly affects operating voltages (AC) and power measurements (DC). A superior board design with a shallower AC Load Line can improve on power, performance and thermals compared to boards designed for POR impedance.
  15. An IMVP9.1 controller to support VccCORE need to have an offset voltage capability and potentially VccCORE output voltage (VID+Offset) may be higher than 1.5V.
  16. Ripple can be higher if DC TOB is below 20mV, as long as Total TOB is within -35mV/+50mV.
  17. S Processor Line K/KF/KS i9 SKUs and S Refresh Processor Line K/KF i9 SKUs - ICCMAX 400A is an optional Extreme Power Delivery (PD) spec which opportunistically allows better multi-core performance based on customer designs PD and if thermal headroom exists

Processor VCCCORE Active and Idle Mode DC Voltage and Current Specifications (HX and HX Refresh Processor Lines)

Symbol

Parameter

Segment

Minimum

Typical

Maximum

Unit

Note1

Operating Voltage

Voltage Range for Processor Operating Mode

HX /HX Refresh - Processor Line

0

—

1.72

V

1,2,3, 7,12,15

IccMAX

(HX Processor)

Maximum Processor

ICC

HX-Processor Line (55W)

8P+16E/

8P+12E/

8P+8E Core

—

—

215

A

4,5,6,7,11

IccMAX.App

(HX Processor)

Maximum Processor

ICC.app

HX-Processor Line (55W)

8P+16E/

8P+12E/

8P+8E Core

—

—

175

A

4,5,6,7,11

IccMAX

(HX Processor)

Maximum Processor

ICC

HX-Processor Line (55W)

6P+8E/

6P+4E

Core

—

—

160

A

4,5,6,7,11

IccMAX.App

(HX Processor)

Maximum Processor

ICC.app

HX-Processor Line (55W)

6P+8E/

6P+4E

Core

—

—

130

A

4,5,6,7,11

IccMAX

(HX Refresh Processor)

Maximum Processor

ICC

HX Refresh-Processor Line (55W)

8P+16E/

8P+12E/

8P+8E Core

—

—

215

A

4,5,6,7,11

IccMAX.App

(HX Refresh Processor)

Maximum Processor

ICC.app

HX Refresh-Processor Line (55W)

8P+16E/

8P+12E/

8P+8E Core

—

—

175

A

4,5,6,7,11

IccMAX

(HX Refresh Processor)

Maximum Processor

ICC

HX Refresh-Processor Line (55W)

6P+8E/

6P+4E

Core

—

—

160

A

4,5,6,7,11

IccMAX.App

(HX Refresh Processor)

Maximum Processor

ICC.app

HX Refresh-Processor Line (55W)

6P+8E/

6P+4E

Core

—

—

130

A

4,5,6,7,11

IccTDC

Thermal Design Current (TDC) for processor VccCORE Rail

—

—

—

VR_​TDC

A

9

TOBVCC

Voltage Tolerance

PS0, PS1 ,PS2, PS3

—

—

±20

mV

3, 6, 8

TOBVCC+Ripple

Ripple Tolerance

PS0, PS1, PS2, PS3

—

—

-35 /+50

mV

3, 6, 8,16

DC_​LL

Loadline slope within the VR regulation loop capability

HX/HX Refresh Processor

(55W)

0

—

1.7

mΩ

10,13,14
AC_​LL AC Loadline 3 HX/HX Refresh Processor Line 8P + 16E Core

(55W)

—

—

1.7

mΩ

10,13,14

V_​OVS

TDP_​MAX/virus_​MAX

Maximum Overshoot at TDP/virus mode

All Processor Lines

—

—

10

%

T_​OVS_​TDP_​MAX Maximum Overshoot at TDP/virus mode

All Processor Lines

—

—

500

us

Notes:
  1. All specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date.
  2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel Speed-step Technology, or low-power states).
  3. The voltage specification requirements are measured across Vcc_​SENSE and Vss_​SENSE as near as possible to the processor. The measurement needs to be performed with a 20MHz bandwidth limit on the oscilloscope, 1.5pF maximum probe capacitance, and 1Ω minimum impedance. The maximum length of the ground wire on the probe should be less than 5mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
  4. Processor VccCORE VR to be designed to electrically support this current.
  5. Processor VccCORE VR to be designed to thermally support this current indefinitely.
  6. Long term reliability cannot be assured if tolerance, ripple, and core noise parameters are violated.
  7. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
  8. PSx refers to the voltage regulator power state as set by the SVID protocol.
  9. Refer to Intel Platform Design Studio (iPDS) for the minimum, typical, and maximum VCC allowed for a given current and Thermal Design Current (TDC).
  10. LL measured at sense points.
  11. Typical column represents IccMAX for commercial application it is NOT a specification - it's a characterization of limited samples using limited set of benchmarks that can be exceeded.
  12. Operating voltage range in steady state.
  13. LL spec values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
  14. Load Line (AC/DC) should be measured by the VRTT tool and programmed accordingly via the BIOS Load Line override setup options. AC/DC Load Line BIOS programming directly affects operating voltages (AC) and power measurements (DC). A superior board design with a shallower AC Load Line can improve on power, performance and thermals compared to boards designed for POR impedance.
  15. An IMVP9.1 controller to support VccCORE need to have an offset voltage capability and potentially VccCORE output voltage (VID+Offset) may be higher than 1.5V.
  16. Ripple can be higher if DC TOB is below 20mV, as long as Total TOB is within -35mV/+50mV.
  17. S Processor Line K/KF/KS i9 SKUs and S Refresh Processor Line K/KF i9 SKUs - ICCMAX 400A is an optional Extreme Power Delivery (PD) spec which opportunistically allows better multi-core performance based on customer designs PD and if thermal headroom exists

Processor VCCCORE Active and Idle Mode DC Voltage and Current Specifications (U/P/H/PX /U Refresh Processor Lines)

Symbol

Parameter

Segment

Minimum

Typical

Maximum

Unit

Note1

Operating Voltage

Voltage Range for Processor Operating Mode

U /U Refresh/P/H/PX Processor Line

0

—

1.6

V

1,2,3, 7,12,15

IccMAX

(PX Processor)

Maximum Processor

ICC

PX-Processor Line (45W)

6P+8E/

4P+8E Core

—

—

160

A

4,5,6,7,11

IccMAX.App

(PX Processor)

Maximum Processor

ICC.app

PX-Processor Line (45W)

6P+8E/

4P+8E Core

—

—

128

A

4,5,6,7,11

IccMAX

(P Processor)

Maximum Processor

ICC

P-Processor Line (28W)

6P+8E/

4P+8E

Core

—

—

102

A

4,5,6,7,11

IccMAX.App

(P Processor)

Maximum Processor

ICC.app

P-Processor Line (28W)

6P+8E/

4P+8E

Core

—

—

82

A

4,5,6,7,11

IccMAX

(H Processor)

Maximum Processor

ICC

H -Processor Line (45W)

4P+4E

Core

—

—

122

A

4,5,6,7,11

IccMAX.App

(H Processor)

Maximum Processor

ICC.app

H Processor Line (45W)

4P+4E /

Core

—

—

100

A

4,5,6,7,11

IccMAX

(H Processor)

Maximum Processor

ICC

H -Processor Line (45W)

6P+8E/

6P+4E/

4P+8E Core

—

—

160

A

4,5,6,7,11

IccMAX.App

(H Processor)

Maximum Processor

ICC.app

H Processor Line (45W)

6P+8E /

6P+4E/

4P+8E Core

—

—

128

A

4,5,6,7,11

IccMAX

(U Processor)

Maximum Processor

ICC

U Processor Line (15W)

2P+8E/

2P+4E/

1P+4E Core

—

—

80

A

4,5,6,7,11

IccMAX.App

(U Processor)

Maximum Processor

ICC.app

U Processor Line (15W)

2P+8E /

2P+4E/

1P+4E Core

—

—

61

A

4,5,6,7,11

IccMAX

(U Refresh Processor)

Maximum Processor

ICC

U Refresh Processor Line (15W)

2P+8E/

2P+4E/

1P+4E Core

—

—

80

A

4,5,6,7,11

IccMAX.App

(U Refresh Processor)

Maximum Processor

ICC.app

U Refresh Processor Line (15W)

2P+8E /

2P+4E/

1P+4E Core

—

—

61

A

4,5,6,7,11

IccTDC

Thermal Design Current (TDC) for processor VccCORE Rail

—

—

—

VR_​TDC

A

9

TOBVCC

Voltage Tolerance

PS0, PS1 ,PS2, PS3

—

—

±20

mV

3, 6, 8

TOBVCC+Ripple

Ripple Tolerance

PS0, PS1, PS2, PS3

—

—

-35 /+50

mV

3, 6, 8,16

DC_​LL

Loadline slope within the VR regulation loop capability

H-Processor Line

(45W)

0

—

2.3

mΩ

10,13,14

DC_​LL

Loadline slope within the VR regulation loop capability

P-Processor Line

(28W)

0

—

2.3

mΩ

10,13,14

DC_​LL

Loadline slope within the VR regulation loop capability

U/U Refresh -Processor Line (15W)

0

—

2.8

mΩ

10,13,14

DC_​LL

Loadline slope within the VR regulation loop capability

PX-Processor Line

(45W)

0

—

2.3

mΩ

10,13,14

AC_​LL

AC Loadline 3

H-Processor Line (45W)

—

—

  • Below 400kHz:2.3
  • 400kHz-2MHz:Linear decrease with log (frequency) from 2.3 to 1.9
  • Above 2MHz: 1.9

mΩ

10,13,14

P-Processor Line (28W)

AC_​LL AC Loadline 3 U/U Refresh -Processor Line (15W)

—

—

2.8

mΩ

10,13,14

AC_​LL

AC Loadline 3

PX-Processor Line

(45W)

—

—

  • Below 400kHz:2.3
  • 400kHz-2MHz:linear decrease with log (frequency) from 2.2 to 1.9
  • Above 2MHz: 1.9

mΩ

10,13,14

V_​OVS

TDP_​MAX/virus_​MAX

Maximum Overshoot at TDP/virus mode

All Processor Lines

—

—

10

%

T_​OVS_​TDP_​MAX Maximum Overshoot at TDP/virus mode

All Processor Lines

—

—

500

us

Notes:
  1. All specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date.
  2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel Speed-step Technology, or low-power states).
  3. The voltage specification requirements are measured across Vcc_​SENSE and Vss_​SENSE as near as possible to the processor. The measurement needs to be performed with a 20MHz bandwidth limit on the oscilloscope, 1.5pF maximum probe capacitance, and 1Ω minimum impedance. The maximum length of the ground wire on the probe should be less than 5mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
  4. Processor VccCORE VR to be designed to electrically support this current.
  5. Processor VccCORE VR to be designed to thermally support this current indefinitely.
  6. Long term reliability cannot be assured if tolerance, ripple, and core noise parameters are violated.
  7. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
  8. PSx refers to the voltage regulator power state as set by the SVID protocol.
  9. Refer to Intel Platform Design Studio (iPDS) for the minimum, typical, and maximum VCC allowed for a given current and Thermal Design Current (TDC).
  10. LL measured at sense points.
  11. Typical column represents IccMAX for commercial application it is NOT a specification - it's a characterization of limited samples using limited set of benchmarks that can be exceeded.
  12. Operating voltage range in steady state.
  13. LL spec values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
  14. Load Line (AC/DC) should be measured by the VRTT tool and programmed accordingly via the BIOS Load Line override setup options. AC/DC Load Line BIOS programming directly affects operating voltages (AC) and power measurements (DC). A superior board design with a shallower AC Load Line can improve on power, performance and thermals compared to boards designed for POR impedance.
  15. An IMVP9.1 controller to support VccCORE need to have an offset voltage capability and potentially VccCORE output voltage (VID+Offset) may be higher than 1.5V.
  16. Ripple can be higher if DC TOB is below 20mV, as long as Total TOB is within -35mV/+50mV.
  17. S Processor Line K/KF/KS i9 SKUs and S Refresh Processor Line K/KF i9 SKUs - ICCMAX 400A is an optional Extreme Power Delivery (PD) spec which opportunistically allows better multi-core performance based on customer designs PD and if thermal headroom exists

Processor VCCCORE Active and Idle Mode DC Voltage and Current Specifications (E Processor Line)

Symbol

Parameter

Segment

Minimum

Typical

Maximum

Unit

Note1

IccMAX

(E Processor)

Maximum Processor

ICC

E-Processor 95W

8P+0E Core

—

—

279

A

4,5,6,7,11

IccMAX.App

(E Processor)

Maximum Processor

ICC.app

E-Processor 95W

8P+0E Core

—

—

231

A

4,5,6,7,11

IccMAX

(E Processor)

Maximum Processor

ICC

E-Processor 80W

8P+0E Core

—

—

279

A

4,5,6,7,11

IccMAX.App

(E Processor)

Maximum Processor

ICC.app

E-Processor 80W

8P+0E Core

—

—

231

A

4,5,6,7,11

IccMAX

(E Processor)

Maximum Processor

ICC

E-Processor 65W

8P+0E Core

—

—

200

A

4,5,6,7,11

IccMAX.App

(E Processor)

Maximum Processor

ICC.app

E-Processor 65W

8P+0E Core

—

—

170

A

4,5,6,7,11

IccMAX

(E Processor)

Maximum Processor

ICC

E-Processor 95W

6P+0E Core

—

—

200

A

4,5,6,7,11

IccMAX.App

(E Processor)

Maximum Processor

ICC.app

E-Processor 95W

6P+0E Core

—

—

170

A

4,5,6,7,11

IccMAX

(E Processor)

Maximum Processor

ICC

E-Processor 80W

6P+0E Core

—

—

200

A

4,5,6,7,11

IccMAX.App

(E Processor)

Maximum Processor

ICC.app

E-Processor 80W

6P+0E Core

—

—

170

A

4,5,6,7,11

IccMAX

(E Processor)

Maximum Processor

ICC

E-Processor 65W

6P+0E Core

—

—

200

A

4,5,6,7,11

IccMAX.App

(E Processor)

Maximum Processor

ICC.app

E-Processor 65W

6P+0E Core

—

—

170

A

4,5,6,7,11

IccMAX

(E Processor)

Maximum Processor

ICC

E-Processor 55W

4P+0E Core

—

—

165

A

4,5,6,7,11

IccMAX.App

(E Processor)

Maximum Processor

ICC.app

E-Processor 55W

4P+0E Core

—

—

140

A

4,5,6,7,11

IccTDC

Thermal Design Current (TDC) for processor VccCORE Rail

—

—

—

VR_​TDC

A

9

TOBVCC

Voltage Tolerance

PS0, PS1 ,PS2, PS3

—

—

±20

mV

3, 6, 8

TOBVCC+Ripple

Ripple Tolerance

PS0, PS1, PS2, PS3

—

—

-35 /+50

mV

3, 6, 8,16

DC_​LL

Loadline slope within the VR regulation loop capability

E- Processor Line 8P +16E Core

(95W)

0

—

1.1

mΩ

10,13,14

E-Processor Line 8P + 0E Core

(95W, 80W)

0

—

1.1

mΩ

10,13,14

V_​OVS

TDP_​MAX/virus_​MAX

Maximum Overshoot at TDP/virus mode

All Processor Lines

—

—

10

%

T_​OVS_​TDP_​MAX Maximum Overshoot at TDP/virus mode

All Processor Lines

—

—

500

us

Notes:
  1. All specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date.
  2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel Speed-step Technology, or low-power states).
  3. The voltage specification requirements are measured across Vcc_​SENSE and Vss_​SENSE as near as possible to the processor. The measurement needs to be performed with a 20MHz bandwidth limit on the oscilloscope, 1.5pF maximum probe capacitance, and 1Ω minimum impedance. The maximum length of the ground wire on the probe should be less than 5mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
  4. Processor VccCORE VR to be designed to electrically support this current.
  5. Processor VccCORE VR to be designed to thermally support this current indefinitely.
  6. Long term reliability cannot be assured if tolerance, ripple, and core noise parameters are violated.
  7. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
  8. PSx refers to the voltage regulator power state as set by the SVID protocol.
  9. Refer to Intel Platform Design Studio (iPDS) for the minimum, typical, and maximum VCC allowed for a given current and Thermal Design Current (TDC).
  10. LL measured at sense points.
  11. Typical column represents IccMAX for commercial application it is NOT a specification - it's a characterization of limited samples using limited set of benchmarks that can be exceeded.
  12. Operating voltage range in steady state.
  13. LL spec values should not be exceeded. If exceeded, power, performance and reliability penalty are expected.
  14. Load Line (AC/DC) should be measured by the VRTT tool and programmed accordingly via the BIOS Load Line override setup options. AC/DC Load Line BIOS programming directly affects operating voltages (AC) and power measurements (DC). A superior board design with a shallower AC Load Line can improve on power, performance and thermals compared to boards designed for POR impedance.
  15. An IMVP9.1 controller to support VccCORE need to have an offset voltage capability and potentially VccCORE output voltage (VID+Offset) may be higher than 1.5V.
  16. Ripple can be higher if DC TOB is below 20mV, as long as Total TOB is within -35mV/+50mV.
  17. S Processor Line K/KF/KS i9 SKUs and S Refresh Processor Line K/KF i9 SKUs - ICCMAX 400A is an optional Extreme Power Delivery (PD) spec which opportunistically allows better multi-core performance based on customer designs PD and if thermal headroom exists

VccIN_​AUX Supply DC Voltage and Current Specifications

Symbol

Parameter

Segment

Minimum

Typical

Maximum

Unit

Notes

VCCINAUX

Voltage Range

S/S Refresh -Processor Line

—

1.8

—

V

1,2,3,7

VCCINAUX

Voltage Range

HX/HX Refresh -Processor Line

—

1.8

—

V

1,2,3,7

VCCINAUX

Voltage Range

U/P/H/PX -Processor Line

—

1.8

—

V

1,2,3,7

IccMAX

Maximum VccIN_​AUX Icc

S/S Refresh -Processor Line (125W)

0

—

36

A

1,2

IccMAX

Maximum VccIN_​AUX Icc

S/S Refresh -Processor Line (65W)

0

—

36

A

1,2

S/S Refresh -Processor Line (35W)

0

—

36

A

1,2

IccMAX

Maximum VccIN_​AUX Icc

S/S Refresh -Processor Line (60/58W)

4P + 0E Core

0

—

33

A

1,2

IccMAX

Maximum VccIN_​AUX Icc

S/S Refresh -Processor Line (35W)

4P + 0E Core

0

—

33

A

1,2

IccMAX Maximum VccIN_​AUX Icc PX - Processor Line (45W)

0

—

34.2

A

1,2

IccMAX Maximum VccIN_​AUX Icc U/U Refresh - Processor Line (15W)

0

—

32

A

1,2

IccMAX Maximum VccIN_​AUX Icc H - Processor Line (45W)

0

—

34.2

A

1,2

IccMAX Maximum VccIN_​AUX Icc P - Processor Line (28W)

0

—

32

A

1,2

IccMAX Maximum VccIN_​AUX Icc HX/HX Refresh - Processor Line (55W)

0

—

33

A

1,2

TOBVCC

Voltage Tolerance Budget

S - Processor Line

—

—

AC+DC:+5/-10

%

1,3,6

TOBVCC

Voltage Tolerance Budget

HX/HX Refresh - Processor Line

—

—

AC+DC:+5/-10

%

1,3,6

TOBVCC

Voltage Tolerance Budget

U/U Refresh /P/H/PX -Processor Line

—

—

AC+DC:+5/-10

%

1,3,6

DC_​LL

DC Loadline

S/S Refresh -Processor Line

—

—

2.0

mΩ

4,5

DC_​LL

DC Loadline

HX/HX Refresh -Processor Line

—

—

2.0

mΩ

4,5

DC_​LL

DC Loadline

P/H/PX -Processor Line

—

—

2.0

mΩ

4,5

AC_​LL

AC Loadline

S/S Refresh Processor Line

—

—

3.9

mΩ

4,5

AC_​LL

AC Loadline

U/U Refresh /P/H/PX -Processor Line

—

—

mΩ

4,5

AC_​LL

AC Loadline

HX/HX Refresh Processor Line

—

—

mΩ

4,5

Notes:
  1. All specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date.
  2. Long term reliability cannot be assured in conditions above or below Maximum/Minimum functional limits.
  3. The voltage specification requirements are measured on package pins as near as possible to the processor with an oscilloscope set to 100 MHz bandwidth, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
  4. LL measured at sense points. LL specification values should not be exceeded. If exceeded, power, performance, and reliability penalty are expected.
  5. The LL values are for reference. Must still need to meet the voltage tolerance specification.
  6. Voltage Tolerance budget values Include ripples
  7. VccIN_​AUX is having few point of voltage define by CPU VID
VccGT DC Specifications