Intel® Core™ Ultra 200S and 200HX Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
832586 12/02/2025 Public
Document Table of Contents
LAM

Introduction

This document is intended for Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODM) and BIOS vendors creating products based on the Intel® Core™ Ultra 200S Series Processors.

Intel® Core™ Ultra Processors includes the Intel® Performance Hybrid architecture, P-Cores for performance, and E-Cores for Efficiency. Refer to Table: Processor Series for availability in Intel processor lines. For more details on P-Core and E-Core, refer to Power Management.

This document assumes a working knowledge of the vocabulary and principles of interfaces and architectures such as PCI Express* (PCIe*), Universal Serial Bus (USB), Advance Host Controller Interface (AHCI), eXtensible Host Controller Interface (xHCI), and so on.

This document abbreviates buses as Bn, devices as Dn and functions as Fn. For example, Device 31 Function 0 is abbreviated as D31:F0, Bus 1 Device 8 Function 0 is abbreviated as B1:D8:F0. Generally, the bus number will not be used, and can be considered to be Bus 0.

The S/HX-Processor Line is offered in a 2-Chip Platform that includes the Processor Chip and Platform Controller Hub (PCH-S) Chip in LGA and BGA Package.

Naming Convention in this document:

  • S-Processor refers to Intel® Core™ Ultra 200S Series processors.

  • HX-Processor refers to Intel® Core™ Ultra 200HX Series processors.

The S-Processor is based on the disaggregated architecture.

The following table describes the different processor series:

Processor Series

Processor Line1

Package

Processor Base Power3, 4

Processor Max

P-cores2

Processor Max

E-cores2

Graphics Configuration Max

Xe-cores2

Platform Type

S-Processor

LGA1851

125 W

8

16

4

2-Chip

LGA1851

65 W

6

8

4

2-Chip

LGA1851

35 W

6

8

4

2-Chip

HX-Processor

BGA2114

55 W

8

16

4

2-Chip

BGA2114

55 W

8

12

4

2-Chip

BGA2114

55 W

6

8

3

2-Chip

Notes:
  1. Processor lines offering may change.
  2. Core count refers to native die with maximum physical cores. Some SKU may have reduced functional cores.
  3. For additional Processor Base Power Configurations, refer to Processor Line Thermal and Power Specifications, for adjustment to the Processor Base Power required to preserve base frequency associated with the sustained long-term thermal capability.
  4. Processor Base Power workload does not reflect I/O connectivity cases such as Thunderbolt, for power adders estimation for various I/O connectivity scenarios:

S LGA Processor Line Platform Diagram

HX Processor Line Platform Diagram

Note:

Not all processor interfaces and features are presented in all Processor Lines. The presence of various interfaces and features will be indicated within the relevant sections and tables.