Package Mechanical Attributes

13th Generation Intel® Core™ Processors

Datasheet, Volume 1 of 2
Supporting 13th Generation Intel® Core™ Processor for S/P/PX/H/HX/U Processor Line Platforms, formerly known as Raptor Lake

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ID 743844

Date 01/06/2023

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The S Processor Lines use a Flip Chip technology available in a Land Grid Array (LGA) package. The following table provides an overview of the package mechanical attributes. For specific dimensions (die size, die location, and so on), refer to the processor package mechanical drawings.

S LGA Processor Package Mechanical Attributes

Package	Parameter	S LGA Processor Lines
Package Technology	Package Type	Flip Chip Land Grid Array
	Interconnect	Land Grid Array (LGA)
	Lead Free	N/A
	Halogenated Flame Retardant Free	Yes
Package Configuration	Solder Ball Composition	N/A
	Ball/Pin Count	1700
	Grid Array Pattern	Grid Array
	Land Side Capacitors	Yes
	Die Side Capacitors	Yes
	Die Configuration	Single Die Single-Chip Package with HIS
Package Dimensions	Nominal Package Size	45.0 x 37.5 mm
	Z	Substrate Z=1.116 mm +/-0.95 Die Z is 0.37 mm
	Minimum Ball/Pin pitch	0.8 mm

HX BGA Processor Package Mechanical Attributes

Package	Parameter	HX Processor Lines
Package Technology	Package Type	Flip Chip Ball Grid Array
	Interconnect	Ball Grid Array (BGA)
	Lead Free	N/A
	Halogenated Flame Retardant Free	Yes
Package Configuration	Solder Ball Composition	Yes
	Ball/Pin Count	1964
	Grid Array Pattern	Grid Array
	Land Side Capacitors	Yes
	Die Side Capacitors	Yes (resistor/Capacitors)
	Die Configuration	Single Die Single-Chip Package
Package Dimensions	Nominal Package Size	45.0 x 37.5 mm
	Z	Substrate Z = 1.119+/-0.095 mm 2.005±0.114 (BOTTOM OF BGA TO TOP OF DIE)
	Minimum Ball/Pin pitch	0.8 mm

P/H/U - Processor Package Mechanical Attributes

Package	Parameter	P/H/U Processor Line
Package Technology	Package Type	Flip Chip Ball Grid Array
	Interconnect	Ball Grid Array (BGA)
	Lead Free	Yes
	Halogenated Flame Retardant Free	Yes
Package Configuration	Solder Ball Composition	SAC405
	Ball/Pin Count	1744
	Grid Array Pattern	Balls anywhere
	Land Side Capacitors	Yes
	Die Side Capacitors	No
	Die Configuration	2 Dice Multi Chip package (MCP)
Package Dimensions	Nominal Package Size	25 x 50 mm
	Z	Substrate Z = 0.594+/-0.08mm 1.185±0.096 (BOTTOM OF BGA TO TOP OF DIE)
	Minimum Ball/Pin pitch	0.65 mm BP

PX - Processor Package Mechanical Attributes

Package	Parameter	PX Processor Line
Package Technology	Package Type	Flip Chip Ball Grid Array
	Interconnect	Ball Grid Array (BGA)
	Lead Free	Yes
	Halogenated Flame Retardant Free	Yes
Package Configuration	Solder Ball Composition	SAC405
	Ball/Pin Count	1792
	Grid Array Pattern	Ball Anywhere
	Land Side Capacitors	Yes
	Die Side Capacitors	No
	Die Configuration	2 Dice Multi Chip Package (MCP)
Package Dimensions	Nominal Package Size	25 X 40 mm
	Z	Substrate Z= 0.594+/-0.08 mm 1.171±0.082 (Bottom of BGA to Top of Die)
	Minimum Ball/Pin pitch	0.62 mm BP