13th Generation Intel® Core™ Processors

Datasheet, Volume 1 of 2
Supporting 13th Generation Intel® Core™ Processor for S/P/PX/H/HX/U Processor Line Platforms, formerly known as Raptor Lake

ID Date Version Classification
743844 01/06/2023 Public

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Document Table of Contents

Package Support

The S-Processor line is available in the following packages:

  • LGA1700
    • A 45 X 37.5 mm
    • Substrate Z=1.116 mm +/-0.95
    • Substrate + Die Z is 1.116+0.37= 1.486 mm

The HX-Processor line is available in the following packages:

  • BGA1964
    • A 45 X 37.5 mm

    • Substrate Z = 0.594+/-0.08 mm

    • 1.185±0.096 (BOTTOM OF BGA TO TOP OF DIE)

The P/H/U-Processor line is available in the following packages:

  • BGA1744
    • A 25 X 50 mm
    • Substrate Z = 0.594+/-0.08 mm
    • 1.185±0.096 (BOTTOM OF BGA TO TOP OF DIE)

The PX-Processor line is available in the following packages:

  • BGA1792
    • A 25 X 40 mm
    • Substrate Z = 0.594+/-0.08 mm
    • 1.171±0.082 (BOTTOM OF BGA TO TOP OF DIE)