12th Generation Intel® Core™ Processors
Datasheet, Volume 1 of 2
The Processor Base Power (a.k.a TDP) is the assured sustained power that should be used for the design of the processor thermal solution, Design to a higher thermal capability will get more Turbo residency. Processor Base Power is the time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the maximum junction temperature as specified in the
Note: The System on Chip processor integrates multiple compute cores and I/O on a single package. Platform support for specific usage experiences may require additional concurrency power to be considered when designing the power delivery and thermal sustained system capability.
The processor integrates multiple processing IA cores, graphics cores and for some SKUs a PCH on a single package. This may result in power distribution differences across the package and should be considered when designing the thermal solution.
Intel® Turbo Boost Technology 2.0 allows processor IA cores to run faster than the base frequency. It is invoked opportunistically and automatically as long as the processor is conforming to its temperature, power, power delivery, and current control limits. When Intel® Turbo Boost Technology 2.0 is enabled:
- The processor may exceed the Processor Base Power (a.k.a TDP) for short durations to utilize any available thermal capacitance within the thermal solution. The duration and time of such operation can be limited by platform runtime configurable registers within the processor.
- Graphics peak frequency operation is based on the assumption of only one of the graphics domains (GT/GTx) being active. This definition is similar to the IA core Turbo concept, where peak turbo frequency can be achieved when only one IA core is active. Depending on the workload being applied and the distribution across the graphics domains the user may not observe peak graphics frequency for a given workload or benchmark.
- Thermal solutions and platform cooling that is designed to less than thermal design guidance may experience thermal and performance issues.