Intel® Core™ Ultra 200S, Intel® Core™ Ultra 200S Plus ,Intel® Core™ Ultra 200HX and 200HX Plus Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
832586 03/17/2026 Public
Document Table of Contents
LAM

I/O Signal Planes and States

For more information, refer to Intel® 800 Series Chipset Family Platform Controller Hub (PCH) Datasheet, Volume 1 of 2 (#833778 )

Signal Name

Power Plane

During Reset

Immediately after Reset

S4/S5

PROC_​C10_​GATE#

Primary

Driven High

Driven High

Driven High

PLT_​PWROK

RTC

Undriven

Undriven

Undriven

RSMRST#

RTC

Undriven

Undriven

Undriven

PS_​ON# Primary Indeterministic, no deglitch PD. Depending on the PMC HW default value Depending on PMC HW default value

SLP_​S0# 1

Primary

Driven High

Driven High

Driven High

RESET_​SYNC#

Primary

Hi-Z Driven High Driven High
Notes:
  1. Driven High during S0 and driven Low during S0i3 when all criteria for assertion are met.
  2. SLP_​S4# is driven low in S4/S5.
  3. SLP_​S5# is driven high in S4, driven low in S5.
  4. .PRIMPWRDNACK is always ‘0’ while in M0 or M3, but can be driven to ‘0’ or ‘1’ while in Moff state. PRIMPWRDNACK is the default mode of operation.
  5. The pad should only be pulled low momentarily when the corresponding buffer power supply is not stable.
  6. Based on wake event and Intel CSME state.
  7. Internal weak pull-down resistor is enabled during power sequencing.
  8. Pin state is a function of whether the platform is configured to have Intel CSME on or off in Sx.
  9. Output High-Z, not glitch free.
  10. Output High-Z, glitch free with ~1 kohm Pull-down during respective power sequencing.
  11. Output High-Z, glitch free with ~20 kohm Pull-down during respective power sequencing.
  12. Output High-Z, glitch free with ~20 kohm Pull-up during respective power sequencing.