Processor SKU Support Matrix - 010 - ID:655258 | 12th Generation Intel® Core™ Processors

12th Generation Intel® Core™ Processors

Datasheet, Volume 1 of 2

ID	Date	Version	Classification
655258	06/15/2023		Public

Processor SKU Support Matrix

DDR Support Matrix Table

Technology	DDR4		DDR5		LPDDR4x	LPDDR5/x ^15,16
Processor	HX / S / H / P / U15	HX / S	HX / S / H / P / U15	HX / S	H/P/U15/U9	H/P/U15/U9
Configuration	1DPC	2DPC ¹¹	1DPC	2DPC ¹¹	1R/2R	1R/2R
Maximum Frequency [MT/s]	S UDIMM 3200 HX / S / H /P / U15 SoDIMM 3200	S UDIMM 3200 ¹² HX SoDIMM : 1 DIMM - 2933 ¹² 2 DIMMs - 3200	HX /S / P / U15 SoDIMM 4800 S : UDIMM 4800	S UDIMM : 1 DIMM - 4400, 2 DIMMs 1R - 4000, 2 DIMMs 2R - 3600 HX SoDIMM: 1 DIMM - 4000, 2 DIMMs 1R - 4000, 2 DIMMs 2R - 3600	4266	Type4 : 1R/2R :5200 P/H Type3: 1R/2R 4800
VDDQ [V]⁶	1.2		5,1.1¹⁰		0.6	0.5
VDD2 [V] ⁶	1.2		1.1		1.1	1.05
Maximum RPC ²	2	4	2	4	2	2
Die Density [Gb]	8,16	8,16	16		8,16	8, 12⁷ ,16
Ballmap Mode ¹¹	IL /NIL	IL /NIL	P : NIL, HX /S - IL	NIL	NIL	NIL
Notes: 1DPC refer to when only 1DIMM slot per channel is routed. RPC = Rank Per Channel An Interleave SoDIMM/MD placements like butterfly or back-to-back supported with a Non-Interleave ballmap mode at H, P, U15 - Processor Line Memory down of all technologies should be implemented homogeneous means that all DRAM devices should be from the same vendor and have the same part number. Implementing a mix of DRAM devices may cause serious signal integrity and functional issues. There is no support for memory modules with different technologies or capacities on opposite sides of the same memory module. If one side of a memory module is populated, the other side is either identical or empty. VDD2 is Processor and DRAM voltage, and VDDQ is DRAM voltage. Pending DRAM samples availability. Maximum 2DPC frequency supported when same DIMM part number populated Within channel. Frequency is not guaranteed when mix DIMM's populated. Mix DIMM in 2DPC use 2N Command Mode, speed to be set in BIOS per margin check. 5V is SODIMM/UDIMM voltage, 1.1V is Memory down voltage. DDR4/DDR5 SoDIMM 2DPC - Not supported on S -Processor Line. Far memory slot to be populated in case single dimm placed on 2DPC channel IL/NIL mode depends on Memory topology. DDR4/DDR5 ECC is supported only when all memory populated in the system supports ECC. LPDDR5 technology supports 8 Bank Mode, BG (Bank Group) Mode and 16 Bank Mode. This processor supports 8 Bank Mode only. LPDDR5x 1a node Supported from MR5 BKC release under LPDDR5 POR speed and with 8B mode only.

DDR Technology Support Matrix

Technology	Form Factor	Ball Count	Processor
DDR4	UDIMM	288	S
DDR4	SoDIMM	260	HX/H/P/U15/S
DDR4	x16 SDP (1R)¹	96	H/P/U15
DDR4	x16 DDP (1R)¹	96	H/P/U15
DDR4	x8 SDP (1R)¹	78	H/P/U15
DDR5	SoDIMM	262	HX/H/P/U15/S
DDR5	UDIMM	288	S
DDR5	x8 SDP (1R)¹	78	H/P/U15
DDR5	x16 SDP (1R)¹	102	H/P/U15
LPDDR4x	x32 (1R, 2R)¹	200	H/P/U15/U9
LPDDR4x	x64 (1R, 2R)¹	432	H/P/U15/U9
LPDDR4x	х64 (1R, 2R)¹	556	U9
LPDDR5/x	x64 (1R, 2R)¹	496	H/P/U15/U9
LPDDR5/x	x32 (1R, 2R)¹	315	H/P/U15/U9

Notes:

Memory down of all technologies should be implemented homogeneously, which means that all DRAM devices should be from the same vendor and have the same part number. Implementing a mix of DRAM devices may cause serious signal integrity and functional issues, DDR4/DDR5 restriction is for single MC configuration, LPDDR4x/LPDDR5/x restriction is for both MC configuration (all DRAMs in the system must be from same Part Number).