Intel® Core™ Ultra 200S and 200HX Series Processors
Datasheet, Volume 1 of 2
| ID | Date | Version | Classification |
|---|---|---|---|
| 832586 | 03/11/2025 | Public |
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Revision History
Introduction
Processor and Device IDs
Package Mechanical Specifications
Memory Mapping
Security Technologies
Intel® Virtualization Technology (Intel® VT)
Instructions Set Enhancements
Platform Environmental Control Interface (PECI)
Intel GMM and Neural Network Accelerator (Intel GNA 3.5)
Intel® Neural Processing Unit (Intel® NPU)
Power Management
Power Delivery
Electrical Specifications
Thermal Management
Clock Topology
Memory
USB Type-C* Sub System
Intel® Volume Management Device (Intel® VMD) Technology
PCI Express* (PCIe*)
Graphics
Display
General Purpose Input and Output
Interrupt Timer Subsystem (ITSS)
Direct Media Interface (DMI)
Direct Enhanced Serial Peripheral Interface (Direct eSPI)
Testability and Monitoring
Miscellaneous Signals
Security Technologies
Intel® Converged Boot Guard and Intel® TXT
Crypto Acceleration Instructions
Intel® Secure Key
Execute Disable Bit
Intel® Supervisor Mode Execution Prevention (Intel® SMEP)
Intel® Supervisor Mode Access Prevention (Intel® SMAP)
User Mode Instruction Prevention (UMIP)
Read Processor ID (RDPID)
Intel® Total Memory Encryption - Multi-Key
Control-flow Enforcement Technology (Intel® CET)
KeyLocker Technology
Intel® System Resources Defense and Intel® System Security Report
BIOS Guard
Intel® Platform Trust Technology
Linear Address Space Separation (LASS)
Security Firmware Engines
Power and Performance Technologies
Intel® Thread Director
Intel® Smart Cache Technology
P-core and E-core Level 0, Level 1 and Level 2 Caches
Ring Interconnect
Intel® Hybrid Technology
Intel® Turbo Boost Technology 2.0
Intel® Turbo Boost Max Technology 3.0
Intel® Adaptive Boost Technology
Intel® System Agent Enhanced SpeedStep ® Technology
Enhanced Intel SpeedStep® Technology
Intel® Thermal Velocity Boost (Intel® TVB)
Intel® Speed Shift Technology
Intel® Advanced Vector Extensions 2 (Intel® AVX2)
Intel® 64 Architecture x2APIC
Intel® Dynamic Tuning Technology (Intel® DTT)
Cache Line Write Back (CLWB)
User Mode Wait Instructions
Thermal Management Features
Adaptive Thermal Monitor
Digital Thermal Sensor
PROCHOT# Signal
PROCHOT Output Only
Bi-Directional PROCHOT#
PROCHOT Demotion Algorithm
Voltage Regulator Protection using PROCHOT#
Thermal Solution Design and PROCHOT# Behavior
Low-Power States and PROCHOT# Behavior
THERMTRIP# Signal
Critical Temperature Detection
Software Controlled Clock Modulation (On-Demand Mode)
System Memory Interface
Processor SKU Support Matrix
Supported Memory Modules and Devices
System Memory Timing Support
Memory Controller (MC)
System Memory Controller Organization Mode
System Memory Frequency
Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)
Data Scrambling
ECC H-Matrix Syndrome Codes
Data Swapping
DDR I/O Interleaving
DRAM Clock Generation
DRAM Reference Voltage Generation
Data Swizzling
Post Package Repair (PPR)
Processor Clocking Signals
| Signal Name | Type | Description |
|---|---|---|
| CLKOUT_I_GEN4_N1 | O | PCI Express* Clock Output: Serial Reference 100 MHz PCIe* specification compliant differential output clocks to PCIe* devices interfacing IOE. CLKOUT_I_GEN5_P/N [1] can be used for IOE PCIe* Gen4 support. |
| CLKOUT_I_GEN4_P1 | ||
| CLKOUT_I_GEN5_N0 | ||
| CLKOUT_I_GEN5_P0 | ||
| CLKOUT_S_GEN5_N1 | O | PCI Express* Clock Output: Serial Reference 100 MHz PCIe* specification compliant differential output clocks to PCIe* devices interfacing SOC-S. CLKOUT_S_GEN5_P/N [3:0] can be used for SOC-S PCIe* Gen5 support |
| CLKOUT_S_GEN5_P1 | ||
| CLKOUT_S_GEN5_N2 | ||
| CLKOUT_S_GEN5_P2 | ||
| CLKOUT_S_GEN5_N3 | ||
| CLKOUT_S_GEN5_P3 | ||
| CLKOUT_S_GEN5_N0 | O | DMI Clock Output: Serial Reference differential output clocks to PCH DMI interfacing SOC-S. CLKOUT_S_GEN5_P/N [0] is dedicated to be used as Intel® 800 Series Chipset DMI REFCLK only |
| CLKOUT_S_GEN5_P0 | ||
| GPP_SB08/I_SRCCLKREQ0# | IOD | Clock Request: Serial Reference Clock request signals for PCIe* 100 MHz differential clocks. The I_SRCCLKREQ # signals can be configured to map to any of the IOE PCI Express* Root Ports while using any of the IOE CLKOUT differential pairs |
| GPP_SB09/I_SRCCLKREQ1# | ||
| GPP_SD06/SRCCLKREQ2# | IOD | Clock Request: Serial Reference Clock request signals for PCIe* 100 MHz differential clocks. The SRCCLKREQ # signals can be configured to map to any of the SOC-S PCI Express* Root Ports while using any of the SOC-S CLKOUT differential pairs. SRCCLKREQ2# pins (muxed on GPP_SD06 and GPP_SB00) and SRCCLKREQ3# pins (muxed on GPP_SD07 and GPP_SB01) are alternate signals; only one pin can be used at a time. |
| GPP_SB14/SRCCLKREQ1# | ||
| GPP_SB00/SRCCLKREQ2# | ||
| GPP_SD07/SRCCLKREQ3# | ||
| GPP_SB01/SRCCLKREQ3# | ||
| GPP_SB07/SRCCLKREQ0# | IOD | DMI Clock Request : Serial Reference Clock request signals for PCH DMI interfacing SOC-S. The SRCCLKREQ0# signals is dedicated to be used as Intel® 800 Series Chipset DMI CLKREQ only |
| EXT_INJ_BCLK_N | I | 100 MHz Differential bus clock input to the processor |
| EXT_INJ_BCLK_P | ||
| EXT_INJ_PHYREF_N | I | 100 MHz Differential bus clock input for PCIe and DMI OC |
| EXT_INJ_PHYREF_P | ||
| XTAL_INJ_N | I | 38.4 MHz crystal input |
| XTAL_INJ_P | ||
| RTC_CLK_IN | I | 32.768Khz RTC CLK from PCH to CPU |
| CLK_I_RCOMP CLK_S_RCOMP | Analog | (HX only) Differential Clock Bias Reference: Used to set BIAS reference for differential clocks. |