Intel® Core™ Processor (Series 3)
Formerly known as Wildcat Lake, Datasheet, Volume 1 of 2
| ID | Date | Version | Classification |
|---|---|---|---|
| 913965 | 05/19/2026 | 001 | Public |
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Revision History
Introduction
Processor and Device IDs
Package Mechanical Specifications
Memory Mapping
Security Technologies
Intel Virtualization Technology
Instructions Set Enhancements
Intel® Neural Processing Unit (Intel® NPU)
Audio Voice and Speech
Power Management
Power Delivery
Thermal Management
System Clocks
Real Time Clock (RTC)
Memory
USB Type-C Sub System
Universal Serial Bus (USB)
PCI Express (PCIe)
Universal Flash Storage
Graphics
Display
Processor Sideband Signals
General Purpose Input and Output
Interrupt Timer Subsystem (ITSS)
Intel® Serial IO Inter-Integrated Circuit (I2C) Controllers
Intel® Serial IO Improved Inter-Integrated Circuit (I3C) Controllers
Gigabit Ethernet Controller
Connectivity Integrated (CNVi)
Controller Link
Integrated Sensor Hub (ISH)
System Management Interface and SMLink
Host System Management Bus (SMBus) Controller
Serial Peripheral Interface (SPI)
Enhanced Serial Peripheral Interface (eSPI)
Intel® Serial IO Generic SPI (GSPI) Controllers
Touch Host Controller (THC)
Intel® Serial IO Universal Asynchronous ReceiverTransmitter (UART) Controlle
Private Configuration Space Port ID
Testability and Monitoring
Security Technologies
Intel® Converged Boot Guard and TXT
Crypto Acceleration Instructions
Intel® Secure Key
Execute Disable Bit
Intel® Supervisor Mode Execution Protection (Intel® SMEP)
Intel® Supervisor Mode Access Protection (Intel® SMAP)
User Mode Instruction Prevention (UMIP)
Read Processor ID (RDPID)
Intel® System Resources Defense and Intel® System Security Report
Intel® Total Memory Encryption - Multi-Key
Control-flow Enforcement Technology (Intel® CET)
BIOS Guard
Intel® Platform Trust Technology
Linear Address Space Separation (LASS)
Intel® Total Storage Encryption (Intel® TSE)
Security Firmware Engines
Audio Voice and Speech
Intel® High Definition Audio (Intel® HD Audio) Controller Capabilities
Audio DSP Capabilities
Intel® High Definition Audio Interface Capabilities
Direct Attached Digital Microphone (PDM) Interface
USB Audio Offload Support
I2S PCM Interface
Intel® Display Audio Interface
MIPI® SoundWire Interface
Signal Description
Integrated Pull-Ups and Pull-Downs
IO Signal Planes and States
Power and Performance Technologies
Intel® Thread Director
Intel® Smart Cache Technology
P-core LP E-core Level 0, Level 1 and Level 2 Caches
Ring Interconnect
Intel® Hybrid Technology
Intel® Turbo Boost Technology 2.0
Intel® Adaptive Boost Technology
Intel System Agent Enhanced SpeedStep ® Technology
Enhanced Intel SpeedStep® Technology
Intel® Speed Shift Technology
Intel® Advanced Vector Extensions 2 (Intel® AVX2)
Intel® 64 Architecture x2APIC
Intel® Dynamic Tuning Technology (Intel® DTT)
Cache Line Write Back (CLWB)
User Mode Wait Instructions
Thermal Management Features
Skin Temperature Control (STC)
Adaptive Thermal Monitor
Digital Thermal Sensor
FORCEPR# Signal
FORCEPR Demotion
Voltage Regulator Protection using FORCEPR#
Thermal Solution Design and FORCEPR Behavior
Low-Power States and FORCEPR Behavior
THERMTRIP Signal
Critical Temperature Detection
System Memory Interface
Processor SKU Support Matrix
Supported Memory Modules and Devices
System Memory Timing Support
Memory Controller (MC)
System Memory Frequency
Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)
Data Scrambling
Data Swapping
LPDDR5x CMDADD Ascending and Descending
DDR IO Interleaving
DRAM Clock Generation
DRAM Reference Voltage Generation
Data Swizzling
Error Correction With Standard RAM
Post Package Repair (PPR)
RFM
In-Memory Analytics Accelerator
Data Processing Unit (DPU)
The Data Processing Unit (DPU) supports 4k MACs built from 256 MAC Processing Engines (MPE) with 16 Fused-MACs in each MPE.
Feature Set
- SprLUT feature - SprLUT was added for complex non-linear activation functions.
- Optimized HW support for standard and depth-wise convolutions,
- Convolution Kernel size of M*N where N, M are up to 11,
- Convolution Stride of up to 8,
- Support configurable padding of activations,
- Supports reuse of activations and weights to reduce CMX Memory read bandwidth,
- Support for both Dense and Sparse operations,
- Sparse Element-wise operations,
- Supported Data Types
- FP8
- I8
- U8
- Precision
- FP32 and INT32 accumulators
- Floating point and integer scaling supported
- Integer floating point inline conversion
- Floating point subnormal support
- Supports statistics gathering (Hardware Profiling)
- Features 64 Post Processing Elements (PPE) where each support:
- Quantization
- Activation function
- Element-Wise functions
- Features Four 256-bit wide Read-Only Ports and four 256-bit wide Read/Write Ports
- Support for Sparse acceleration and compression to increase effective TOPs by up to 2x.
- Sparsity awareness allows the MAC circuits to run more TOPs by not consuming cycles processing data that does not affect the result.
- Those extra (or effective) TOPs translate to lower power for the same compute performance, or, higher compute performance for the same power by comparison to a design that is sparsity agnostic.
- DPU State Machine is responsible for loading tensor workloads and micro-scheduling.
- New Feature in NPU that allows splitting Input channels (ICs) across MPE to improve the overall utilization of the PE array.