Intel® Core™ Processor (Series 3)
Formerly known as Wildcat Lake, Datasheet, Volume 1 of 2
| ID | Date | Version | Classification |
|---|---|---|---|
| 913965 | 05/19/2026 | 001 | Public |
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Revision History
Introduction
Processor and Device IDs
Package Mechanical Specifications
Memory Mapping
Security Technologies
Intel Virtualization Technology
Instructions Set Enhancements
Intel® Neural Processing Unit (Intel® NPU)
Audio Voice and Speech
Power Management
Power Delivery
Thermal Management
System Clocks
Real Time Clock (RTC)
Memory
USB Type-C Sub System
Universal Serial Bus (USB)
PCI Express (PCIe)
Universal Flash Storage
Graphics
Display
Processor Sideband Signals
General Purpose Input and Output
Interrupt Timer Subsystem (ITSS)
Intel® Serial IO Inter-Integrated Circuit (I2C) Controllers
Intel® Serial IO Improved Inter-Integrated Circuit (I3C) Controllers
Gigabit Ethernet Controller
Connectivity Integrated (CNVi)
Controller Link
Integrated Sensor Hub (ISH)
System Management Interface and SMLink
Host System Management Bus (SMBus) Controller
Serial Peripheral Interface (SPI)
Enhanced Serial Peripheral Interface (eSPI)
Intel® Serial IO Generic SPI (GSPI) Controllers
Touch Host Controller (THC)
Intel® Serial IO Universal Asynchronous ReceiverTransmitter (UART) Controlle
Private Configuration Space Port ID
Testability and Monitoring
Security Technologies
Intel® Converged Boot Guard and TXT
Crypto Acceleration Instructions
Intel® Secure Key
Execute Disable Bit
Intel® Supervisor Mode Execution Protection (Intel® SMEP)
Intel® Supervisor Mode Access Protection (Intel® SMAP)
User Mode Instruction Prevention (UMIP)
Read Processor ID (RDPID)
Intel® System Resources Defense and Intel® System Security Report
Intel® Total Memory Encryption - Multi-Key
Control-flow Enforcement Technology (Intel® CET)
BIOS Guard
Intel® Platform Trust Technology
Linear Address Space Separation (LASS)
Intel® Total Storage Encryption (Intel® TSE)
Security Firmware Engines
Audio Voice and Speech
Intel® High Definition Audio (Intel® HD Audio) Controller Capabilities
Audio DSP Capabilities
Intel® High Definition Audio Interface Capabilities
Direct Attached Digital Microphone (PDM) Interface
USB Audio Offload Support
I2S PCM Interface
Intel® Display Audio Interface
MIPI® SoundWire Interface
Signal Description
Integrated Pull-Ups and Pull-Downs
IO Signal Planes and States
Power and Performance Technologies
Intel® Thread Director
Intel® Smart Cache Technology
P-core LP E-core Level 0, Level 1 and Level 2 Caches
Ring Interconnect
Intel® Hybrid Technology
Intel® Turbo Boost Technology 2.0
Intel® Adaptive Boost Technology
Intel System Agent Enhanced SpeedStep ® Technology
Enhanced Intel SpeedStep® Technology
Intel® Speed Shift Technology
Intel® Advanced Vector Extensions 2 (Intel® AVX2)
Intel® 64 Architecture x2APIC
Intel® Dynamic Tuning Technology (Intel® DTT)
Cache Line Write Back (CLWB)
User Mode Wait Instructions
Thermal Management Features
Skin Temperature Control (STC)
Adaptive Thermal Monitor
Digital Thermal Sensor
FORCEPR# Signal
FORCEPR Demotion
Voltage Regulator Protection using FORCEPR#
Thermal Solution Design and FORCEPR Behavior
Low-Power States and FORCEPR Behavior
THERMTRIP Signal
Critical Temperature Detection
System Memory Interface
Processor SKU Support Matrix
Supported Memory Modules and Devices
System Memory Timing Support
Memory Controller (MC)
System Memory Frequency
Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)
Data Scrambling
Data Swapping
LPDDR5x CMDADD Ascending and Descending
DDR IO Interleaving
DRAM Clock Generation
DRAM Reference Voltage Generation
Data Swizzling
Error Correction With Standard RAM
Post Package Repair (PPR)
RFM
In-Memory Analytics Accelerator
Package Power Control
The package power control settings of PL1, PL2, PL3, PL4, and Tau allow the designer to configure Intel® Turbo Boost Technology 2.0 to match the platform power delivery and package thermal solution limitations.
- Power Limit 1 (PL1): A threshold for average power that will not exceed - recommend to set to equal Processor Base Power. PL1 should not be set higher than thermal solution cooling limits.
- Power Limit 2 (PL2): A threshold that if exceeded, the PL2 rapid power limiting algorithms will attempt to limit the spike above PL2.
- Power Limit 3 (PL3): A threshold that if exceeded, the PL3 rapid power limiting algorithms will attempt to limit the duty cycle of spikes above PL3 by reactively limiting frequency. This is an optional setting
- Power Limit 4 (PL4): A limit that will not be exceeded, the PL4 power limiting algorithms will preemptively limit frequency to prevent spikes above PL4.
- Turbo Time Parameter (Tau): An averaging constant used for PL1 exponential weighted moving average (EWMA) power calculation.
- Implementation of Intel® Turbo Boost Technology 2.0 only requires configuring PL1, PL1, Tau and PL2.
- PL3 and PL4 are disabled by default.
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Intel® Dynamic Tuning Technology (DTT) is recommended for performance improvement in platforms. Dynamic Tuning is configured by system manufacturers dynamically optimizing the processor power based on the current platform thermal and power delivery conditions. Contact Intel Representatives for enabling details.