Assured Power (cTDP) Modes

Intel® Core™ Ultra 200V Series Processors

Datasheet, Volume 1 of 2

ID	Date	Version	Classification
829568	05/27/2025	004	Confidential

Note:Assured Power (cTDP) availability may vary between the different SKUs.

With cTDP, the processor is now capable of altering the maximum sustained power with an alternate processor P/LP E core base frequency. Assured Power (cTDP) allows operation in situations where extra cooling is available or situations where a cooler and quieter mode of operation is desired.

cTDP consists of three modes as shown in the following table.

Assured Power (cTDP)

SOC Power Characteristic	Description of Characteristic	SOC Design Considerations
Maximum Turbo Power	The maximum sustained (>1s) power dissipation of the processor as limited by current and/or temperature controls.  Instantaneous power may exceed Maximum Turbo Power for short durations (<=10ms). Maximum Turbo Power is configurable by system vendor and can be system specific.	Intel performance advocacy for power delivery and transient thermal solution design (PL2)
Base Power	The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the operating temperature.	Intel reference performance advocacy for sustained thermal solution design (PL1)
Minimum Assured Power	Min Assured Power is a performance advocacy determined by running a complex scenario defined by Intel. Every product SKU stack has guidance on Min Assured Power for thermal chassis design. Represents Intel specified min PL1 that needs to be taken for thermal design to get the advocated performance experience. Min Assured Power is the performance vs power cross-over point across the product SKU stack.	Intel minimum performance advocacy for sustained thermal solution design (PL1)
High Concurrency Power	High Concurrency Power is a functional characteristic determined by running a complex scenario defined by Intel. Every SoC consumes a minimum power during a max connected case.  This is a functional characteristic, not intended to indicate performance floor. Scenario takes into consideration IO ports, compute IPs concurrency (CPU, GPU, IPU) along with memory BW. Temperature assumption of spec limit. Manufacturing screening is done to exclude parts that don't meet the target power for the high concurrency scenario. The SoC may not honor PL1 values set lower than high concurrency power during the high concurrency scenario.	Thermal solution capability required to support the high concurrency scenario as described

In each mode, the Intel® Turbo Boost Technology 2.0 power limits are reprogrammed along with a new OS controlled frequency range. The Intel Dynamic Tuning driver assists in Processor Base Power operation by adjusting processor PL1 dynamically. The cTDP mode does not change the maximum per-processor P/LP E core turbo frequency.