Intel® Core™ Ultra 200V Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
829568 05/27/2025 004 Confidential
Document Table of Contents

Maximum Pressure Specifications

A more relevant metric for concentrated loading is chosen by Intel based on the physics of failure to evaluate tile damage risk due to thermal solution enabling .

  • Static Compressive Pressure refers to the long-term steady state pressure applied to the tile from the thermal solution after system assembly is complete
  • Transient Compressive Pressure refers to the pressure on the tiles at any moment during the thermal solution assembly/disassembly procedures. Other system procedures such as repair/rework can also cause high pressure loading to occur on the tile and should be evaluated to ensure these limits are not exceeded

Metric: This metric is pressure over a 2 mm x 2 mm area

Measurement Method

Package Loading Specifications

Package

Static Compressive Pressure1 [PSI]

Transient Compressive Pressure1 [PSI]

Intel® Core™ Ultra 200V Series Processor

800psi

800psi

Notes:
  • This is the load and pressure that has been tested by Intel for a single assembly cycle. This metric is a pressure over 2 mm2 (2 mm x 2 mm) area.
  • For Static compressive pressure, the load conditions and corresponding pressure conditions need to be followed by the thermal attach design of maximum 10lbf on 0.6mm board and maximum of 15lbf on 0.8mm board.