Intel® Core™ Ultra 200V Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
829568 05/27/2025 004 Confidential
Document Table of Contents

Package Mechanical Attributes

The Intel® Core™ Ultra 200V Series Processor series use a Flip Chip technology available in a Ball Grid Array (BGA) package. The following table provides an overview of the package mechanical attributes.

Package Mechanical Attributes

Package

Parameter

Intel® Core™ Ultra 200V Series Processor Series

Package Technology

Package Type

Flip Chip Ball Grid Array

Interconnect

Ball Grid Array (BGA)

Lead Free

Yes

Halogenated Flame Retardant Free

Yes

Package Configuration

Solder Ball Composition

LTS

Ball Count

2833

Grid Array Pattern

Balls anywhere

Land Side Capacitors

Yes

Die Side Capacitors

No

Die Configuration

Foveros: Base Die + Top Die

Memory on Package

Package Dimensions

Nominal Package Size

27.5 x 27 mm

Die Z-height (BGA Pre-SMT Bottom to DRAM Top) (mm)

1.34mm +/- 0.096 (16 GB: 2 x 8GB DRAM) /

1.58mm +/- 0.096 (32GB: 2 x 16GB DRAM)

Minimum Ball pitch

0.5 mm