Intel® Core™ Ultra 200V Series Processors
Datasheet, Volume 1 of 2
| ID | Date | Version | Classification |
|---|---|---|---|
| 829568 | 05/27/2025 | 004 | Confidential |
Package Mechanical Attributes
The Intel® Core™ Ultra 200V Series Processor series use a Flip Chip technology available in a Ball Grid Array (BGA) package. The following table provides an overview of the package mechanical attributes.
| Package | Parameter | Intel® Core™ Ultra 200V Series Processor Series |
|---|---|---|
| Package Technology | Package Type | Flip Chip Ball Grid Array |
| Interconnect | Ball Grid Array (BGA) | |
| Lead Free | Yes | |
| Halogenated Flame Retardant Free | Yes | |
| Package Configuration | Solder Ball Composition | LTS |
| Ball Count | 2833 | |
| Grid Array Pattern | Balls anywhere | |
| Land Side Capacitors | Yes | |
| Die Side Capacitors | No | |
| Die Configuration | Foveros: Base Die + Top Die Memory on Package | |
| Package Dimensions | Nominal Package Size | 27.5 x 27 mm |
| Die Z-height (BGA Pre-SMT Bottom to DRAM Top) (mm) | 1.34mm +/- 0.096 (16 GB: 2 x 8GB DRAM) / 1.58mm +/- 0.096 (32GB: 2 x 16GB DRAM) | |
| Minimum Ball pitch | 0.5 mm |