Intel® Core™ Ultra 200H and 200U Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
842704 05/27/2025 Public
Document Table of Contents

Maximum Pressure Specifications

A more relevant metric for concentrated loading is chosen by Intel based on the physics of failure to evaluate tile damage risk due to thermal solution enabling .

  • Static Compressive Pressure refers to the long-term steady state pressure applied to the tile from the thermal solution after system assembly is complete
  • Transient Compressive Pressure refers to the pressure on the tiles at any moment during the thermal solution assembly/disassembly procedures. Other system procedures such as repair/rework can also cause high pressure loading to occur on the tile and should be evaluated to ensure these limits are not exceeded

Metric: This metric is pressure over a 2 mm x 2 mm area

Measurement Method: Intel has provided the document for accurate measurement of pressure on tiles.

Package Loading Specifications

Package

Static Compressive Pressure1 [PSI]

Transient Compressive Pressure1 [PSI]

U/H 800 800
Note:This is the load and pressure that has been tested by Intel for a single assembly cycle. This metric is a pressure over 2 mm2 (2 mm x 2 mm) area.