Intel® Core™ Ultra 200H and 200U Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
842704 05/27/2025 Public
Document Table of Contents

Processor Thermal Management

The thermal solution provides both component-level and system-level thermal management. To allow optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed so that the processor:

  • Remains below the Maximum Operating Temperature (T_​sensor_​max) specification at the maximum Processor Base Power (PBP, previously known as TDP).
  • Conforms to system constraints, such as system acoustics, system skin-temperatures, and exhaust-temperature requirements.

Caution:Thermal specifications given in this chapter are on the component and package level and apply specifically to the processor. Operating the processor outside the specified limits may result in permanent damage to the processor and potentially other components in the system.