Intel® Core™ Ultra 200H and 200U Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
842704 05/27/2025 Public
Document Table of Contents

Processor SKU Support Matrix

DDR Support Matrix Table

Technology

DDR5

LPDDR59 LPDDR5x 9 LPCAMM2

Processor

H/U

H/U H/U H/U

Maximum Frequency [MT/s]

1R/2R - 640010

6400 10 Type 3: 1R/2R - 7467 10

Type 4: 1R/2R - 8400 10

LPDDR5x Type3 - 7467 10

VDDQ [V] 6

1.1

0.52 0.52 0.52

VDD2 [V] 6

1.1

1.065 1.065 1.065

DPC 1

1

- - -

Maximum RPC 2

2

2 2 2

Die Density [Gb]

16, 24, 32

8,12,16 8,12,16 16

Ballmap Mode

NIL

NIL NIL NIL
Notes:
  1. 1DPC refer to when only 1DIMM slot per channel is routed.
  2. RPC = Rank Per Channel
  3. An Interleave SoDIMM/MD placements like butterfly or back-to-back supported with a Non-Interleave ballmap mode at H/U Processor
  4. Memory down of all technologies should be implemented homogeneous means that all DRAM devices should be from the same vendor and have the same part number. Implementing a mix of DRAM devices may cause serious signal integrity and functional issues.
  5. There is no support for memory modules with different technologies or capacities on opposite sides of the same memory module. If one side of a memory module is populated, the other side is either identical or empty.
  6. DDR5: VDD2 is Processor voltage, VDDQ is DRAM voltage merged with VDD2.
  7. Pending DRAM samples availability and eco system readiness.
  8. 5V is DIMM voltage, 1.1V is Memory down voltage
  9. LPDDR5 technology supports 8 Bank Mode, BG (Bank Group) Mode and 16 Bank Mode.LPDDR5x technology supports BG Mode and 16 Bank Mode, according to JEDEC spec. Bank Mode may vary according to SAGV Point.
  10. DDR POR speed refers to Processor top SKU. Other SKUs may use lower memory speed, refer to ark.intel.com for top memory speed .