Intel® Core™ Ultra 200H and 200U Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
842704 05/27/2025 Public
Document Table of Contents

Supported Memory Modules and Devices

Supported DDR5 Non-ECC SoDIMM/CSoDIMM Module Configurations (H/U-Processor Series)

Raw Card Version

DIMM

Capacity [GB]

DRAM Device

Technology [Gb]

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size [K]

A , F

16

16

2048M x 8

8

1

17/10

16

8

C , H

8

16

1024M x 16

4

1

17/10

8

8

B , G

32

16

2048M x 8

16

2

17/10

16

8

A , F

24

24

3072M x 8

8

1

17/10

32

8

C , H

12

24

1536M x 16

4

1

17/10

16

8

B , G

48

24

3072M x 8

16

2

17/10

32

8

A , F

32

32

4096M x 8

8

1

17/10

32

8

C , H

16

32

2048M x 16

4

1

17/10

16

8

B , G

64

32

4096M x 8

16

2

17/10

32

8

Supported DDR5 Memory Down Device Configurations (H/U - Processor Series)

Maximum System Capacity [GB]2

PKG Type

(Die bits x Package bits)

DRAM Organization / Package Type

Package Density [Gb]

Die Density [Gb]

Dies Per Channel

Rank Per Channel

PKGs Per channel

Physical Device Rank

Banks Inside DRAM

Page Size [K]

32

SDP 8x8

2048M x 8

16

16

8

1

8

1

16

8

16

SDP 16x16

1024M x 16

16

16

4

1

4

1

8

8

48

SDP 8x8

3072M x 8

24

24

8

1

8

1

32

8

24

SDP 16x16

1536M x 16

24

24

4

1

4

1

16

8

64

SDP 8x8

4096M x 8

32

32

8

1

8

1

32

8

32

SDP 16x16

2048M x 16

32

32

4

1

4

1

16

8

Notes:
  1. For SDP: 1Rx16 using 16 GB die density - the maximum system capacity is 16 GB
  2. Maximum system capacity, refer to system with 2 MC populated with same memory down devises

Supported LPDDR5/x x32 DRAMs Configurations (H/U - Processor Series)

Maximum System Capacity [GB]3

PKG Type 2

(Die bits per Ch x PKG bits)

Die Density [Gb]

PKG Density [Gb]

Rank Per PKGs

16

DDP

16x32

16

32

1

32

QDP

16x32

16

64

2

64

ODP

16x32

16

128

2

12

DDP

16x32

12

24

1

24

QDP

16x32

12

48

2

8

DDP

16x32

8

16

1

16

QDP

16x32

8

32

2

32

ODP

16x32

8

64

2

Notes:
  1. x32 BGA devices are 315 balls
  2. DDP - Dual Die Package, QDP - Quad Die Package, ODP - Octal Die Package
  3. Maximum system capacity refers to system with all 8 sub-channels populated

Supported LPDDR5/x x64 DRAMs Configurations (H/U - Processor Series )

Maximum System Capacity [GB]2

PKG Type

(Die bits per Ch x PKG bits)2

Die Density [Gb]

PKG Density [Gb]

DRAM

Channels Per PKGs

Rank Per PKGs

161

QDP

16x64

16

64

4

1

321

ODP

16x64

16

128

4

2

81

QDP

16x64

8

32

4

1

161

ODP

16x64

8

64

4

2

Notes:
  1. QDP = Quad Die Package, ODP-Octal Die Package
  2. Maximum system capacity refers to system with all 8 sub-channels populated