Intel® Core™ Ultra 200H and 200U Series Processors

Datasheet, Volume 1 of 2

ID Date Version Classification
842704 05/27/2025 Public
Document Table of Contents

Package Mechanical Attributes

The U/H-series processor use a Flip Chip technology available in a Ball Grid Array (BGA) package. The following table provides an overview of the package mechanical attributes.

H/U Package Mechanical Attributes

Package

Parameter

H/U-Series Processor

Package Technology

Package Type

Flip Chip Ball Grid Array

Interconnect

Ball Grid Array (BGA)

Lead Free

Yes

Halogenated Flame Retardant Free

Yes

Package Configuration

Solder Ball Composition

SAC405

Ball/Pin Count

2049

Grid Array Pattern

Balls anywhere

Land Side Capacitors

Yes

Tile Side Capacitors

No

Tile Configuration

Foveros

Package Dimensions

Nominal Package Size

25 x 50 mm

Z

Substrate Z = 0.644 ± 0.095 mm

1.245 ± 0.109 mm (BOTTOM OF BGA TO TOP OF TILE)

Minimum Ball/Pin pitch

0.65 mm BP