Storage Conditions Specifications
Environmental storage condition limits define the temperature and relative humidity limits to which the device is exposed to while being stored in a moisture barrier bag. The specified storage conditions are for component level prior to board attach (see notes in the following table for post board attach limits).
The following table specifies absolute maximum and minimum storage temperature limits which represent the maximum or minimum device condition beyond which damage, latent or otherwise, may occur. The table also specifies sustained storage temperature, relative humidity, and time-duration limits. These limits specify the maximum or minimum device storage conditions for a sustained period of time. At conditions outside sustained limits, but within absolute maximum and minimum ratings, quality and reliability may be affected.
Storage Condition Ratings
| Symbol | Parameter | Min. | Max. | Notes |
|---|
| Tabsolute storage | The non-operating device storage temperature. Damage (latent or otherwise) may occur when subjected to this temperature for any length of time in Intel® original sealed moisture barrier bad and / or box. | -25°C | 125°C | 1, 2, 3 |
| Tsustained storage | The ambient storage temperature limit (in shipping media) for the sustained period of time as specified below in Intel® original sealed moisture barrier bad and /or box. | -5°C | 40°C | 1, 2, 3 |
| RHsustained storage | The maximum device storage relative humidity for a sustained period of time as specified below in Intel® original sealed moisture barrier bag and / or box. | 60% at 24°C | 1, 2, 3 |
| Time sustained storage | Maximum time: associated with customer shelf life in Intel® original sealed moisture barrier bag and / or box. | NA | Moisture Sensitive Devices: 60 months from bag seal date; Non-moisture sensitive devices: 60 months from lot date. | 1, 2, 3 |
| Notes: - TABSOLUTE STORAGE applies to the non-assembled only and does not apply to the shipping media, moisture barrier bag or desiccant. Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.
- Specified temperatures are based on data collected. Exceptions for surface mount re-flow are specified by applicable JEDEC J-STD-020 and MAS documents. The JEDEC, J-STD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.
- Post board attach storage temperature limits are not specified for non Intel® branded boards. Consult your board manufacturer for storage specifications.
|