Intel® Processor and Intel® Core™ i3 N-Series

Datasheet, Volume 1 of 2

ID 759603
Date 01/04/2023
Version 001
Document Table of Contents

DDR Support Matrix

DDR Support Matrix Table

Technology

DDR4

DDR5

LPDDR5 7
Configuration 1DPC 1DPC 1R/2R
Maximum Frequency [MT/s]

3200

4800

Type3:

4800

VDDQ [V] 5

1.2

5,1.1 7

0.5

VDD2 [V] 5

1.2

1.1

1.05

Maximum RPC 2

2 2 2

Die Density [Gb]

8,16 16 8,12, 16

Notes:

  1. 1DPC refer to when only 1DIMM slot per channel is routed.
  2. RPC = Rank Per Channel
  3. Memory down of all technologies should be implemented homogeneous means that all DRAM devices should be from the same vendor and have the same part number. Implementing a mix of DRAM devices may cause serious signal integrity and functional issues.
  4. There is no support for memory modules with different technologies or capacities on opposite sides of the same memory module. If one side of a memory module is populated, the other side is either identical or empty.
  5. VDD2 is Processor and DRAM voltage, and VDDQ is DRAM voltage.
  6. 5V is SoDIMM/UDIMM voltage, 1.1V is Memory down voltage.
  7. LP5x memory combo devices in LP5-8B mode is supported.

DDR Technology Support Matrix

Technology

Form Factor

Ball Count

DDR4

SoDIMM

260

DDR4

x16 SDP (1R)1

96

DDR4

x16 DDP (1R)1

96

DDR4

x8 SDP (1R)1

78

DDR5

SoDIMM

262

DDR5

x8 SDP (1R)1

78

DDR5

x16 SDP (1R)1

102

LPDDR5

x32 (1R, 2R)1

315

Note: Memory down of all technologies should be implemented homogeneously, which means that all DRAM devices should be from the same vendor and have the same part number. Implementing a mix of DRAM devices may cause serious signal integrity and functional issues (all DRAMs in the system must be from same Part Number).