Die Pressure Specifications

A more relevant metric for concentrated loading is chosen by Intel based on the physics of failure to evaluate die damage risk due to thermal solution enabling

Static Compressive pressure refers to the long term steady state pressure applied to the die from the thermal solution after system assembly is complete.

Transient Compressive pressure refers to the pressure on the dice at any moment during the thermal solution assembly/disassembly procedures. Other system procedures such as repair/rework can also cause high pressure loading to occur on the die and should be evaluated to ensure these limits are not exceeded.

Metric: This metric is pressure over a 2 mm x 2 mm area