12th Generation Intel® Core™ Processors

Datasheet, Volume 1 of 2

ID 655258
Date 08/08/2022
Document Table of Contents

Package Support

The S-Processor line is available in the following packages:

  • LGA1700
    • A 45 X 37.5 mm
    • Substrate Z=1.116 mm +/-0.95
    • Substrate + Die Z is 1.116+0.37= 1.486 mm

The HX-Processor line is available in the following packages:

  • BGA1964
    • A 45 X 37.5 mm
    • Substrate Z = 1.119+/-0.095 mm
    • 2.005±0.114 (BOTTOM OF BGA TO TOP OF DIE)

The H-Processor line, P-Processor line, and U15-Processor line (U-Processor line) are available in the following packages:

  • BGA1744
    • A 25 X 50 mm
  • Substrate Z = 0.594+/-0.08 mm
  • 1.185±0.096 (BOTTOM OF BGA TO TOP OF DIE)

The U9-Processor line (U-Processor line) is available in the following packages:

  • BGA1781
    • A 19 x 28.5 mm
    • Substrate Z = 584±0.065
    • 1.033 ± 0.079 (BOTTOM OF BGA TO TOP OF DIE)