12th Generation Intel® Core™ Processors

Datasheet, Volume 1 of 2

ID 655258
Date 08/08/2022
Document Table of Contents

Supported Memory Modules and Devices

Supported DDR4 Non-ECC SoDIMM Module Configurations (S/H/P/U15-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

A

8 GB

8 Gb

1024M x 8

8

1

16/10

16

8K

A

16 GB

16 Gb

2048M x 8

8

1

17/10

16

8K

C

4 GB

8 Gb

512M x 16

4

1

16/10

8

8K

C

8 GB

16 Gb

1024M x 16

4

1

17/10

8

8K

E

16 GB

8 Gb

1024M x 8

16

2

16/10

16

8K

E

32 GB

16 Gb

2048M x 8

16

2

17/10

16

8K

Supported DDR4 ECC SoDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

D

8 GB

8 Gb

1024M x 8

9

1

16/10

16

8K

D

16 GB

16 Gb

2048M x 8

9

1

17/10

16

8K

G

8 GB

8 Gb

1024M x 8

18

2

16/10

16

8K

G

16 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

F

16 GB

8 Gb

1024M x 8

18

2

16/10

16

8K

F

32 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

Supported DDR4 Non-ECC UDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

A

8 GB

8 Gb

1024M x 8

8

1

16/10

16

8K

A

16 GB

16 Gb

2048M x 8

8

1

17/10

16

8K

C

4 GB

8 Gb

512M x 16

4

1

16/10

8

8K

C

8 GB

16 Gb

1024M x 16

4

1

17/10

8

8K

B

16 GB

8 Gb

1024M x 8

16

2

16/10

16

8K

B

32 GB

16 Gb

2048M x 8

16

2

17/10

16

8K

Supported DDR4 ECC UDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

D

8 GB

8 Gb

1024M x 8

9

1

16/10

16

8K

D

16 GB

16 Gb

2048M x 8

9

1

17/10

16

8K

E

4 GB

8 Gb

1024M x 8

18

2

16/10

16

8K

E

8 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

Supported DDR5 Non-ECC SoDIMM Module Configurations (S/H/P/U15-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

A

16 GB

16 Gb

2048M x 8

8

1

17/10

16

8K

C

8 GB

16 Gb

1024M x 16

4

1

17/10

8

8K

B

32 GB

16 Gb

2048M x 8

16

2

17/10

16

8K

Supported DDR5 ECC SoDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

D

16 GB

16 Gb

2048M x 8

9

1

17/10

16

8K

E

32 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

Supported DDR5 Non-ECC UDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

A

16 GB

16 Gb

2048M x 8

8

1

17/10

16

8K

C

8 GB

16 Gb

1024M x 16

4

1

17/10

8

8K

B

32 GB

16 Gb

2048M x 8

16

2

17/10

16

8K

Supported DDR5 ECC UDIMM Module Configurations (S-Processor Line)

Raw Card Version

DIMM

Capacity

DRAM Device

Technology

DRAM Organization

# of DRAM Devices

# of Ranks

# of Row/Col Address Bits

# of Banks Inside DRAM

Page Size

D

16 GB

16 Gb

2048M x 8

9

1

17/10

16

8K

E

32 GB

16 Gb

2048M x 8

18

2

17/10

16

8K

Supported DDR4 Memory Down Device Configurations (H/P /U15 Processor Line)

Maximum System Capacity3

PKG Type

(Die bits x Package bits)

DRAM Organization / Package Type

Package Density

Die Density

Dies Per Channel

Rank Per Channel

PKGs Per Channel

Physical Device Rank

Banks Inside DRAM

Page Size

32 GB

SDP 8x8

1024M x 8

8 Gb

8 Gb

16

2

16

1

16

8K

64 GB

SDP 8x8

2048M x 8

16 Gb

16 Gb

16

2

16

1

16

8K

8 GB

SDP 16x16

512M x 16

8 Gb

8 Gb

4

1

4

1

8

8K

16 GB1

SDP 16x16

1024M x 16

16 Gb

16 Gb

4

1

4

1

8

8K

16 GB

DDP 8x16

1024M x 16

16 Gb

8 Gb

8

1

4

1

16

8K

32 GB2

DDP 8x16 2048M x 16 32 Gb 16 Gb 8 1 4 1 16 8K
Notes:
  1. For SDP: 1Rx16 using 16 GB die density - the maximum system capacity is 16 GB
  2. For DDP: 1Rx16 using 16 GB die density - the maximum system capacity is 32 GB.
  3. Maximum system capacity refer to system with 2 channels populated

Supported DDR5 Memory Down Device Configurations (H/P/U15 Processor Line)

Maximum System Capacity3

PKG Type

(Die bits x Package bits)

DRAM Organization / Package Type

Package Density

Die Density

Dies Per Channel

Rank Per Channel

PKGs Per channel

Physical Device Rank

Banks Inside DRAM

Page Size

32 GB

SDP 8x8

2048M x 8

16 Gb

16 Gb

8

1

8

1

16

8K

16 GB1

SDP 16x16

1024M x 16

16 Gb

16 Gb

4

1

4

1

8

8K

Notes:
  1. For SDP: 1Rx16 using 16 GB die density - the maximum system capacity is 16 GB
  2. Maximum system capacity, refer to system with 2 channels populated

Supported LPDDR4x x32 DRAMs Configurations (H/P/U Processor Line) 

Maximum System Capacity4

PKG Type

(Die bits per Ch x PKG bits)2

Die Density

PKG Density

Rank Per PKGs

8 GB

DDP

16x32

8 Gb

16 Gb

1

16 GB

QDP

16x32

8 Gb

32 Gb

2

32 GB

ODP

16x32(Byte mode)

8 Gb

64 Gb

2

16 GB

QDP

16x32

16 Gb

32 Gb

1

32 GB

ODP

16x32

16 Gb

64 Gb

2

Notes:
  1. x32 BGA devices are 200 balls
  2. QDP = Quad Die Package, ODP-Octal Die Package
  3. Each LPDDR4x channel include two sub-channels
  4. Maximum system capacity refers to system with all 8 sub channels populated

Supported LPDDR4x x64 DRAMs Configurations (H/P/U Processor Line) 

Maximum System Capacity3

PKG Type

(Die bits per Ch x PKG bits)

Die Density

Ball Count Per PKG PKG Density

DRAM

Channels Per PKGs

Processor Line Rank Per PKGs

8 GB

QDP 16x64 8 Gb 432 32 Gb 4 H/P/U 1

16 GB

ODP 16x64 8 Gb 432 64 Gb 4 H/P/U 2

16 GB

QDP 16x64 16 Gb 432 64 Gb 4 H/P/U 2

8 GB

QDP 16x64 8 Gb 556 32 Gb 4 U9 1

16 GB

ODP 16x64 8 Gb 556 64 Gb 4 U9 2

16 GB

QDP 16x64 16 Gb 556 64 Gb 4 U9 2
Notes:
  1. QDP = Quad Die Package, ODP-Octal Die Package

  2. Each LPDDR4x channel include two sub-channels

  3. Maximum system capacity refers to system with all 8 sub-channels populated

Supported LPDDR5 x32 DRAMs Configurations (H/P/U Processor Line) 

Maximum System Capacity4

PKG Type

(Die bits per Ch x PKG bits)2

Die Density

PKG Density

Rank Per PKGs

12 GB5

DDP

16x32

12 Gb

12 Gb

1

24 GB5

QDP

16x32

12 Gb

24 Gb

2

16 GB

DDP

16x32

16 Gb

16 Gb

1

32 GB

QDP

16x32

16 Gb

32 Gb

2

64 GB5

ODP

16x32

16 Gb

64 Gb

2

8 GB

DDP

16x32

8 Gb

8 Gb

1

16 GB

QDP

16x32

8 Gb

16 Gb

2

32 GB

ODP

16x32

8 Gb

32 Gb

2

Notes:
  1. x32 BGA devices are 315 balls
  2. QDP = Quad Die Package, ODP-Octal Die Package
  3. Each LPDDR5 channel include two sub-channels
  4. Maximum system capacity refers to system with all 8 sub channels populated
  5. Pending DRAM samples availability.

Supported LPDDR5 x64 DRAMs Configurations (H/P/U Processor Line) 

Maximum System Capacity3

PKG Type

(Die bits per Ch x PKG bits)

Die Density

PKG Density

DRAM

Channels Per PKGs

Rank Per PKGs

16 GB

QDP

16x64

16 Gb

64 Gb

4

1

32 GB

ODP

16x64

16 Gb

128 Gb

4

2

8 GB

QDP

16x64

8 Gb

32 Gb

4

1

16 GB

ODP

16x64

8 Gb

64 Gb

4

2

Notes:
  1. QDP = Quad Die Package, ODP-Octal Die Package
  2. Each LPDDR5 channel include two sub-channels
  3. Maximum system capacity refers to system with all 8 sub-channels populated