CPU

Number of Cores

Up to four Tremont Atom Cores

Burst Speed

Dependent on number of active cores and CPU SKU

LFM/HFM

400 MHz / 1.1-2 GHz

L1 Cache

32 KB Instruction, 32 KB Data per core

L2 Cache

1.5 MB

L3 Cache

4 MB

Package

Type

Type 3 FCBGA 35 mm x 24 mm

I/O Count

720

Pin Count

1338

Minimum Ball Pitch

0.593 mm

Z-Height

1.406 mm

TDP

6 W (Mobile) / 10 W (DT)

Operating Temperature

0 ⁰C to +85 ⁰C ambient (TjMax 105degC)

Graphics

Gen

Gen11 LP

LFM/HFM/Burst

200 MHz/≤ 450MHz/≤900MHz

Execution Units

Up to 32 in a 1x4x8 configuration

[16EU (1x2x8) and 24EU (1x4x6) configurations are also supported]

Display

Gen

Gen11 3x Pipe

DDI 0

eDP / MIPI DSI 4L / DP / HDMI

DDI 1

MIPI DSI 4L / DP / HDMI

DDI 2

DP / HDMI

Display Serial Interface (DSI)

MIPI-DSI 1.2 @ 2.5 Gbps

Embedded Display Port (eDP*)

eDP 1.4b @ 5.4 Gbps

Display Port (DP)

DP 1.4a @ 8.1 Gbps [ HBR3 is supported with DP alternate mode over type-C,HBR2 is natively supported over DP connector. HBR3 over DP connector is supported only with retimer]

High Definition Multimedia Interface (HDMI)

HDMI 2.0b @ 5.94 Gbps (With Platform Level Shifters above HD resolution)

Maximum Resolution

4K2K

Media

Decode Codec

VP9 or HEVC 8b/10b 4:4:4/4:2:0 4k30/4k60

Encode Codec

FF-VP9 or FF-HEVC 10b 4:4:4/4:2:0 4k30/4k60

Memory

Maximum Size Supported

2x32 (1 channel) or 4x32 (2 channel) LPDDR4x

1x64 (either of the 2 channels) and 2x64 DDR4

Supported Transfer Data Rates (MT/s)

LPDDR4x = 2933 MT/s

DDR4 = 2933 MT/s

Imaging

Number of Lanes

Eight lanes of DPHY1.2

Number of Cameras

Four Total Cameras / Three Concurrent cameras

Supported Data Rate (Total BW/lane)

2.5 Gbps/lane

Audio

Audio endpoint connections

Two HDA

One Intel Integrated Display Audio Codec

(HDMI / DP)

Three I2S / PCM codec

Two PDM DMIC module

One SoundWire* segment

SDO/SDI

Up to 48 Mb/s / 24 Mb/s

Codec Support

44.1 kHz sampling rate up to 24 MHz BCLK

Audio Engine

Dual Core Tensilica core with HIFI 3 Audio Engine @ 400 MHz

[1 MB L2 high performance SRAM

and 64 KB L2 low power SRAM]

Speech Accelerator

GNA 2.0

USB

Number of Ports

Up to eight USB ports

Type-C

External Type-C solution only

USB 3.2 2x1 SuperSpeed Port

Two

Maximum USB 3.2 2x1 Speed

10 Gb/s

USB 3.2 1x1 Port

Four

Maximum USB 3.2 1x1 Speed

5 Gb/s

USB 2.0 Port

Eight

Maximum USB 2.0 Speed

480 Mb/s

PCIe* Gen3

Ports

Up to five Ports

Eight Lanes (multiplexed)

Maximum Speed

8 GT/s

Storage

eMMC*

5.1

Maximum eMMC* Speed

400 MB/s

Sata

2x Gen3 ports

Maximum Speed

Gen 3 (6.0Gb/s)

Secure Digital

SD 3.0

SD Speed

Default Mode: Up to 12.5 MB/s

High Speed Mode: Up to 25 MB/s

UHS-I Mode: Up to 100 MB/s

LPSS

SPI

Three

SPI Speed

25 Mbps (Master Mode Only)

UART

Three

UART Speed

3.8 Mbps

I2C

Six

I2C Speed

3.4 Mbps (Master Mode Only)

SMBus

Ports

One

Maximum Speed

100 kHz

Fast SPI

Controller

Controller: One

Devices supported: Three (two for Flash, one for TPM) (FST_​SPI supports up to three loads)

Maximum Fast SPI Frequency

50 MHz

eSPI

Maximum eSPI Frequency

60 MHz

Clocks

38.4 MHz, 32 kHz Xtal Inputs

Interrupt

2 X Interrupt Controller

(8256 and I/O APIC)

15 Interrupts, Message Signaled Interrupts (MSI) Support

Timer

8x HPET

Intel^® 8254 timer

RTC

256 byte Battery backed RAM

ACPI

Advanced Configuration Power Interface (ACPI) 5.0a Compliant Power Management

Security

Technology

Trusted Platform Module (TPM2.0),

Intel^® Platform Trust Technology

Wireless Connectivity

Wi-Fi

Integrated CNVi, 802.11ax [Wi-Fi 6] (1x1 and 2x2)

Bluetooth^*

Integrated CNVi BT 5.x using UART/I2S/USB2