Jasper Lake EDS Vol1


ID 633935
Date 01/01/2021
Public Content

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Document Table of Contents

Processor Thermal Management

The thermal solution provides both component-level and system-level thermal management. To allow optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed so that the processor:

  • Remains below the maximum junction temperature (TjMAX) specification at the maximum Thermal Design Power (TDP).
  • Conforms to system constraints, such as system acoustics, system skin-temperatures, and exhaust-temperature requirements.
Caution:Thermal specifications given in this chapter are on the component and package level and apply specifically to the processor. Operating the processor outside the specified limits may result in permanent damage to the processor and potentially other components in the system.