Jasper Lake EDS Vol1

Datasheet

ID 633935
Date 01/01/2021
Public Content

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents
DSP

Thermal and Power Specifications

For more information on target processor specifications, refer to Table: SKU MAP

Note:

The TDP values are the average power dissipation in junction temperature operating condition limit, for the SKU Segment and Configuration, for which the processor is validated during manufacturing when executing an associated Intel-specified TDP workload.

TDP workload may consist of a combination of processor IA core intensive and graphics core intensive applications.